Abstract: A dual in-line memory module (DIMM) cooling apparatus is described. The DIMM cooling assembly includes a first heat spreader to be thermally coupled to respective memory chips of a first side of the DIMM. The DIMM cooling assembly includes a second heat spreader to be thermally coupled to respective memory chips of a second side of the DIMM. The DIMM cooling assembly includes a heat sink element. The heat sink element is to reside above the DIMM. The heat sink element is to receive heat from the first and second heat spreaders. The heat sink element has thermal transfer structures to lower thermal resistance between the heat sink element and the heat sink element's ambient.

Abstract: An apparatus is described. The apparatus includes a cooling mass. The apparatus includes a cooling block having an opening to receive a portion of the cooling mass. The apparatus having a spring element to be rotated about an axis of rotation. An obstruction between a hot pluggable electronic component and an electro-mechanical connector is to be removed by the spring element's rotation. The cooling mass is to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.

Abstract: Apparatuses, methods and storage medium associated with coolant systems for computer and electrical environments are disclosed herein. In embodiments, an apparatus for selectively transferring of heat within a computer environment may include a cold plate thermally coupled to a liquid line of a liquid coolant system of the computer environment, the cold plate to transfer heat to the liquid line and a thermally-conductive body to cool a component of the computer environment. The apparatus may further include a thermoelectric cooler (TEC) thermally coupled with the cold plate on a first side of the TEC and thermally coupled with the thermally-conductive body on a second side of the TEC, the TEC to increase an amount of heat transfer from the second side of the TEC to the first side of the TEC in response to energy provided to the TEC.

Abstract: Apparatuses, methods and storage medium associated with coolant systems for computer and electrical environments are disclosed herein. In embodiments, an apparatus for selectively transferring of heat within a computer environment may include a cold plate thermally coupled to a liquid line of a liquid coolant system of the computer environment, the cold plate to transfer heat to the liquid line and a thermally-conductive body to cool a component of the computer environment. The apparatus may further include a thermoelectric cooler (TEC) thermally coupled with the cold plate on a first side of the TEC and thermally coupled with the thermally-conductive body on a second side of the TEC, the TEC to increase an amount of heat transfer from the second side of the TEC to the first side of the TEC in response to energy provided to the TEC.

Abstract: An apparatus is described. The apparatus includes a module to be inserted into an electronic system. The module includes a first heat exchanger at one end of the module and second heat exchanger at another end of the module. The module also includes a first vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a first side of the module and a second vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a second side of the module. The first heat exchanger is in thermal contact with at least one of the first and second vapor chambers, and, the second heat exchanger is in thermal contact with at least one of the first and second vapor chambers.

Abstract: The present disclosure describes embodiments of apparatuses and methods related to a computing apparatus with a closed cooling loop thermally coupled to one or more processors disposed on a circuit board of the computing apparatus. The closed cooling loop circulates a dielectric fluid to absorb heat from the processor. A portion of the dielectric fluid is evaporated from the processor heat absorbed by the dielectric fluid. A heat exchanger is coupled to the circuit board and thermally coupled to the closed cooling loop. The heat exchanger is to include a coolant flow to remove heat from the dielectric fluid circulated through the portion of the closed cooling loop thermally coupled to the heat exchanger. A vapor portion of the dielectric fluid is condensed from the heat removed by the coolant flow. Other embodiments may be described and/or claimed.

Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide a mechanism with a folded wrapping to mate with a circuit board and a heatsink to enclose and seal a volume between the circuit board and the heatsink. The mechanism with the folded wrapping may be dimensioned to enclose and seal the volume with the volume having a size to accommodate one or more processors to be disposed within the volume, electrically coupled to the circuit board and thermally coupled to the heatsink. On enclosing and sealing the volume, the mechanism with the folded wrapping may keep coolant from reaching the one or more processors when the circuit board, the mechanism, and the heatsink are immersed in the coolant. Other embodiments may be described and/or claimed.

Abstract: Embodiments herein relate to multi-phase cooling of electronic equipment such as processors and voltage regulators in a rack computing system. In various embodiments, a cooling device may include a heat exchanger, an inlet manifold, an outlet manifold, one or more fluid conductors coupled with the heat exchange, the inlet manifold, and the outlet manifold to carry a two-phase fluid from the outlet manifold to the inlet manifold through the heat exchanger, and one or more fans to generate a flow of air against the heat exchanger. In some embodiments, the heat exchanger may be arranged in an inverted-V or an inverted-W configuration with respect to the fans. In embodiments, the cooling device may be disposed in a rack module. Other embodiments may be described and/or claimed.

Abstract: The present disclosure describes embodiments of apparatuses and methods related to a computing apparatus with a closed cooling loop thermally coupled to one or more processors disposed on a circuit board of the computing apparatus. The closed cooling loop circulates a dielectric fluid to absorb heat from the processor. A portion of the dielectric fluid is evaporated from the processor heat absorbed by the dielectric fluid. A heat exchanger is coupled to the circuit board and thermally coupled to the closed cooling loop. The heat exchanger is to include a coolant flow to remove heat from the dielectric fluid circulated through the portion of the closed cooling loop thermally coupled to the heat exchanger. A vapor portion of the dielectric fluid is condensed from the heat removed by the coolant flow. Other embodiments may be described and/or claimed.

Abstract: Thermal management technology is disclosed. A thermal management component in accordance with the present disclosure can comprise a heat spreader having a plurality of microchannels. The thermal management component can also comprise a plurality of fins directly coupled to the heat spreader to provide surface area for heat transfer. In another aspect, a thermal management component can comprise a heat spreader having a plurality of microchannels, and an inlet port and an outlet port in fluid communication with the plurality of microchannels. The thermal management component can also comprise a plurality of fins coupled to the heat spreader to provide surface area for heat transfer. Additionally, the thermal management component can comprise a fluid conduit thermally coupled to the plurality of fins and fluidly coupled to the outlet port and the inlet port to facilitate flow of a heat transfer fluid through the microchannels and the fluid conduit.

Abstract: Embodiments herein relate to hydraulic bladders to provide a force against an integrated circuit package to be located between the hydraulic bladder and a system board. In various embodiments, a hydraulic force generator may include a block to be coupled with a system board and a hydraulic bladder to be located between the block and the system board, where the hydraulic bladder, in response to pressurization, is to provide a force against an integrated circuit package to be located between the hydraulic bladder and the system board. Other embodiments may be described and/or claimed.

Abstract: Thermal management technology is disclosed. A thermal management component in accordance with the present disclosure can comprise a heat spreader having a plurality of microchannels. The thermal management component can also comprise a plurality of fins directly coupled to the heat spreader to provide surface area for heat transfer. In another aspect, a thermal management component can comprise a heat spreader having a plurality of microchannels, and an inlet port and an outlet port in fluid communication with the plurality of microchannels. The thermal management component can also comprise a plurality of fins coupled to the heat spreader to provide surface area for heat transfer. Additionally, the thermal management component can comprise a fluid conduit thermally coupled to the plurality of fins and fluidly coupled to the outlet port and the inlet port to facilitate flow of a heat transfer fluid through the microchannels and the fluid conduit.

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a die disposed on a substrate; a cooling solution comprising a first surface and a second surface opposite the first surface, wherein the second surface is disposed on a backside of the die disposed on a package substrate. A lid comprising an outer surface is disposed on the first surface of the cooling solution, wherein the lid includes a plurality of fins disposed on an inner surface of the lid. A solder is disposed between the outer surface of the lid and the first surface of the cooling solution.

Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide a mechanism with a folded wrapping to mate with a circuit board and a heatsink to enclose and seal a volume between the circuit board and the heatsink. The mechanism with the folded wrapping may be dimensioned to enclose and seal the volume with the volume having a size to accommodate one or more processors to be disposed within the volume, electrically coupled to the circuit board and thermally coupled to the heatsink. On enclosing and sealing the volume, the mechanism with the folded wrapping may keep coolant from reaching the one or more processors when the circuit board, the mechanism, and the heatsink are immersed in the coolant. Other embodiments may be described and/or claimed.

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a die disposed on a substrate; a cooling solution comprising a first surface and a second surface opposite the first surface, wherein the second surface is disposed on a backside of the die disposed on a package substrate. A lid comprising an outer surface is disposed on the first surface of the cooling solution, wherein the lid includes a plurality of fins disposed on an inner surface of the lid. A solder is disposed between the outer surface of the lid and the first surface of the cooling solution.

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a die disposed on a substrate; a cooling solution comprising a first surface and a second surface opposite the first surface, wherein the second surface is disposed on a backside of the die disposed on a package substrate. A lid comprising an outer surface is disposed on the first surface of the cooling solution, wherein the lid includes a plurality of fins disposed on an inner surface of the lid. A solder is disposed between the outer surface of the lid and the first surface of the cooling solution.

Abstract: Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.

Abstract: Embodiments herein relate to multi-phase cooling of electronic equipment such as processors and voltage regulators in a rack computing system. In various embodiments, a cooling device may include a heat exchanger, an inlet manifold, an outlet manifold, one or more fluid conductors coupled with the heat exchange, the inlet manifold, and the outlet manifold to carry a two-phase fluid from the outlet manifold to the inlet manifold through the heat exchanger, and one or more fans to generate a flow of air against the heat exchanger. In some embodiments, the heat exchanger may be arranged in an inverted-V or an inverted-W configuration with respect to the fans. In embodiments, the cooling device may be disposed in a rack module. Other embodiments may be described and/or claimed.

Abstract: Cooling assemblies and methods, including, for example, at least one bar (e.g., electrically insulated and/or thermally conductive bar(s)), members (e.g., i-beams, rectangular members, and the like), stator laminations, rotor laminations, and/or combinations thereof, such as those configured to cool electric machines (e.g., electric motors and generators).

Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide an evaporator including a chamber to receive condensate flow from an input end and output a vapor outflow at an output end with a wick, heated by a surface of the chamber, having variable thickness within the chamber to receive condensate, where the thickness of the wick proximate to the condensate inflow is greater than the thickness of the wick proximate to the vapor outflow. Other embodiments may be described and/or claimed.