Patents by Inventor Devdatta P. Kulkarni

Devdatta P. Kulkarni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10455731
    Abstract: Embodiments herein relate to hydraulic bladders to provide a force against an integrated circuit package to be located between the hydraulic bladder and a system board. In various embodiments, a hydraulic force generator may include a block to be coupled with a system board and a hydraulic bladder to be located between the block and the system board, where the hydraulic bladder, in response to pressurization, is to provide a force against an integrated circuit package to be located between the hydraulic bladder and the system board. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: October 22, 2019
    Assignee: Intel Corporation
    Inventors: Ralph W. Jensen, Jeffory L. Smalley, Kevin J. Ceurter, Devdatta P. Kulkarni, Casey Winkel
  • Publication number: 20190206764
    Abstract: Thermal management technology is disclosed. A thermal management component in accordance with the present disclosure can comprise a heat spreader having a plurality of microchannels. The thermal management component can also comprise a plurality of fins directly coupled to the heat spreader to provide surface area for heat transfer. In another aspect, a thermal management component can comprise a heat spreader having a plurality of microchannels, and an inlet port and an outlet port in fluid communication with the plurality of microchannels. The thermal management component can also comprise a plurality of fins coupled to the heat spreader to provide surface area for heat transfer. Additionally, the thermal management component can comprise a fluid conduit thermally coupled to the plurality of fins and fluidly coupled to the outlet port and the inlet port to facilitate flow of a heat transfer fluid through the microchannels and the fluid conduit.
    Type: Application
    Filed: December 29, 2017
    Publication date: July 4, 2019
    Applicant: Intel Corporation
    Inventors: Devdatta P. Kulkarni, Richard J. Dischler, Je-Young Chang
  • Publication number: 20190094925
    Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a die disposed on a substrate; a cooling solution comprising a first surface and a second surface opposite the first surface, wherein the second surface is disposed on a backside of the die disposed on a package substrate. A lid comprising an outer surface is disposed on the first surface of the cooling solution, wherein the lid includes a plurality of fins disposed on an inner surface of the lid. A solder is disposed between the outer surface of the lid and the first surface of the cooling solution.
    Type: Application
    Filed: November 21, 2018
    Publication date: March 28, 2019
    Applicant: Intel Corporation
    Inventors: Devdatta P. Kulkarni, Richard J. Dischler, Je-Young Chang
  • Publication number: 20190090344
    Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide a mechanism with a folded wrapping to mate with a circuit board and a heatsink to enclose and seal a volume between the circuit board and the heatsink. The mechanism with the folded wrapping may be dimensioned to enclose and seal the volume with the volume having a size to accommodate one or more processors to be disposed within the volume, electrically coupled to the circuit board and thermally coupled to the heatsink. On enclosing and sealing the volume, the mechanism with the folded wrapping may keep coolant from reaching the one or more processors when the circuit board, the mechanism, and the heatsink are immersed in the coolant. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 21, 2017
    Publication date: March 21, 2019
    Inventors: Barrett M. Faneuf, Annie Chen, Jessica Gulbrand, Devdatta P. Kulkarni, Kristin L. Weldon, Joseph Andrew Broderick
  • Patent number: 10228735
    Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a die disposed on a substrate; a cooling solution comprising a first surface and a second surface opposite the first surface, wherein the second surface is disposed on a backside of the die disposed on a package substrate. A lid comprising an outer surface is disposed on the first surface of the cooling solution, wherein the lid includes a plurality of fins disposed on an inner surface of the lid. A solder is disposed between the outer surface of the lid and the first surface of the cooling solution.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: March 12, 2019
    Assignee: Intel Corporation
    Inventors: Devdatta P. Kulkarni, Richard J. Dischler, Je-Young Chang
  • Publication number: 20190004573
    Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a die disposed on a substrate; a cooling solution comprising a first surface and a second surface opposite the first surface, wherein the second surface is disposed on a backside of the die disposed on a package substrate. A lid comprising an outer surface is disposed on the first surface of the cooling solution, wherein the lid includes a plurality of fins disposed on an inner surface of the lid. A solder is disposed between the outer surface of the lid and the first surface of the cooling solution.
    Type: Application
    Filed: June 29, 2017
    Publication date: January 3, 2019
    Applicant: Intel Corporation
    Inventors: Devdatta P. Kulkarni, Richard J. Dischler, Je-Young Chang
  • Patent number: 10168749
    Abstract: Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: January 1, 2019
    Assignee: Intel Corporation
    Inventors: Russell S. Aoki, Devdatta P. Kulkarni, Alan W. Tate, Robin A. Steinbrecher, Ralph W. Jensen
  • Publication number: 20180343773
    Abstract: Embodiments herein relate to multi-phase cooling of electronic equipment such as processors and voltage regulators in a rack computing system. In various embodiments, a cooling device may include a heat exchanger, an inlet manifold, an outlet manifold, one or more fluid conductors coupled with the heat exchange, the inlet manifold, and the outlet manifold to carry a two-phase fluid from the outlet manifold to the inlet manifold through the heat exchanger, and one or more fans to generate a flow of air against the heat exchanger. In some embodiments, the heat exchanger may be arranged in an inverted-V or an inverted-W configuration with respect to the fans. In embodiments, the cooling device may be disposed in a rack module. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: May 25, 2017
    Publication date: November 29, 2018
    Inventors: Devdatta P. Kulkarni, Xudong Tang
  • Publication number: 20180323684
    Abstract: Cooling assemblies and methods, including, for example, at least one bar (e.g., electrically insulated and/or thermally conductive bar(s)), members (e.g., i-beams, rectangular members, and the like), stator laminations, rotor laminations, and/or combinations thereof, such as those configured to cool electric machines (e.g., electric motors and generators).
    Type: Application
    Filed: November 13, 2017
    Publication date: November 8, 2018
    Inventors: Devdatta P. Kulkarni, Gabriel Rupertus, Edward Chen, Lex Ramsey
  • Publication number: 20180270993
    Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide an evaporator including a chamber to receive condensate flow from an input end and output a vapor outflow at an output end with a wick, heated by a surface of the chamber, having variable thickness within the chamber to receive condensate, where the thickness of the wick proximate to the condensate inflow is greater than the thickness of the wick proximate to the vapor outflow. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: March 17, 2017
    Publication date: September 20, 2018
    Inventors: Devdatta P. Kulkarni, Sandeep Ahuja
  • Publication number: 20180263137
    Abstract: Embodiments herein relate to hydraulic bladders to provide a force against an integrated circuit package to be located between the hydraulic bladder and a system board. In various embodiments, a hydraulic force generator may include a block to be coupled with a system board and a hydraulic bladder to be located between the block and the system board, where the hydraulic bladder, in response to pressurization, is to provide a force against an integrated circuit package to be located between the hydraulic bladder and the system board. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: March 13, 2017
    Publication date: September 13, 2018
    Inventors: RALPH W. JENSEN, JEFFORY L. SMALLEY, KEVIN J. CEURTER, DEVDATTA P. KULKARNI, CASEY WINKEL
  • Patent number: 10074591
    Abstract: Embodiments of the present disclosure provide techniques and configurations for providing a thermal interface to a PCB. In some embodiments, the system for providing a thermal interface to a PCB may include a heat sink couplable to a printed circuit board (PCB) via a thermal interface. The heat sink may include a base configured to accommodate a plurality of heat pipes. The system may further include a heater block couplable to the base with the plurality of heat pipes, to conduct heat generated by the heater block to the base via the plurality of heat pipes, to heat the thermal interface, and cause the thermal interface to spread substantially evenly between the heat sink and the PCB. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: September 11, 2018
    Assignee: Intel Corporation
    Inventors: Devdatta P. Kulkarni, Russell S. Aoki
  • Publication number: 20180254237
    Abstract: Embodiments of the present disclosure provide techniques and configurations for providing a thermal interface to a PCB. In some embodiments, the system for providing a thermal interface to a PCB may include a heat sink couplable to a printed circuit board (PCB) via a thermal interface. The heat sink may include a base configured to accommodate a plurality of heat pipes. The system may further include a heater block couplable to the base with the plurality of heat pipes, to conduct heat generated by the heater block to the base via the plurality of heat pipes, to heat the thermal interface, and cause the thermal interface to spread substantially evenly between the heat sink and the PCB. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: March 2, 2017
    Publication date: September 6, 2018
    Inventors: Devdatta P. Kulkarni, Russell S. Aoki
  • Publication number: 20180157296
    Abstract: Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: December 1, 2016
    Publication date: June 7, 2018
    Inventors: RUSSELL S. AOKI, DEVDATTA P. KULKARNI, ALAN W. TATE, ROBIN A. STEINBRECHER, RALPH W. JENSEN
  • Patent number: 9983641
    Abstract: Methods, apparatuses, and systems associated with tunable pumped two-phase liquid cooling thermal management are disclosed. In embodiments, a tunable cooling apparatus may include a thermoelectric cooler device, TEC, that has a hot side and a cold side, where the cold side is to cool the coolant in route to an inlet manifold of the cold plate before the coolant enters the inlet manifold, and the hot side may be to warm the coolant in route from an outlet manifold of the cold plate after the coolant flows through the cold plate and exits the outlet manifold and or vice versa. In embodiments, the coolant may be either in a liquid state or in a vapor state. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: May 29, 2018
    Assignee: Intel Corporation
    Inventors: Devdatta P. Kulkarni, Timothy G. Hanna
  • Publication number: 20180066663
    Abstract: Processes, apparatuses, and systems are associated with using coolant-driven fans to cool computer systems. In embodiments, the flow of coolant through tubes used to cool cold plates within the system may be used to drive one or more fans within the system to provide additional airflow to cool components, for example, components to be air cooled that are attached to a motherboard. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 8, 2016
    Publication date: March 8, 2018
    Inventors: Devdatta P. Kulkarni, Robin A. Steinbrecher
  • Publication number: 20180004259
    Abstract: Apparatuses, methods and storage medium associated with coolant systems for computer and electrical environments are disclosed herein. In embodiments, an apparatus for selectively transferring of heat within a computer environment may include a cold plate thermally coupled to a liquid line of a liquid coolant system of the computer environment, the cold plate to transfer heat to the liquid line and a thermally-conductive body to cool a component of the computer environment. The apparatus may further include a thermoelectric cooler (TEC) thermally coupled with the cold plate on a first side of the TEC and thermally coupled with the thermally-conductive body on a second side of the TEC, the TEC to increase an amount of heat transfer from the second side of the TEC to the first side of the TEC in response to energy provided to the TEC.
    Type: Application
    Filed: June 30, 2016
    Publication date: January 4, 2018
    Inventors: Devdatta P. Kulkarni, Timothy G. Hanna
  • Patent number: 9819248
    Abstract: Cooling assemblies and methods, including, for example, at least one bar (e.g., electrically insulated and/or thermally conductive bar(s)), members (e.g., i-beams, rectangular members, and the like), stator laminations, rotor laminations, and/or combinations thereof, such as those configured to cool electric machines (e.g., electric motors and generators).
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: November 14, 2017
    Assignee: TECO-Westinghouse Motor Company
    Inventors: Devdatta P. Kulkarni, Gabriel Rupertus, Edward Chen, Lex Ramsey
  • Publication number: 20170315595
    Abstract: Methods, apparatuses, and systems associated with tunable pumped two-phase liquid cooling thermal management are disclosed. In embodiments, a tunable cooling apparatus may include a thermoelectric cooler device, TEC, that has a hot side and a cold side, where the cold side is to cool the coolant in route to an inlet manifold of the cold plate before the coolant enters the inlet manifold, and the hot side may be to warm the coolant in route from an outlet manifold of the cold plate after the coolant flows through the cold plate and exits the outlet manifold and or vice versa. In embodiments, the coolant may be either in a liquid state or in a vapor state. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: April 27, 2016
    Publication date: November 2, 2017
    Inventors: Devdatta P. Kulkarni, Timothy G. Hanna
  • Patent number: 9531242
    Abstract: Cooling apparatuses and methods comprising cooling apparatuses, such as those configured to be coupled to and/or cool electric machines (e.g., motors, generators, and the like).
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: December 27, 2016
    Assignee: TECO-Westinghouse Motor Company
    Inventors: Devdatta P. Kulkarni, Gabriel Rupertus, Edward Chen