Abstract: In some implementations, a system may obtain, via a first user interface, an arrangement of one or more user interface elements for a dynamic user experience. The system may obtain one or more prototype templates for the arrangement of one or more user interface elements, wherein the one or more prototype templates include rendering information for a second user interface. The system may generate, based on the arrangement and the one or more prototype templates, one or more tile specifications for the dynamic user experience. The system may store the one or more tile specifications in a data structure in association with the dynamic user experience.

Abstract: In some implementations, a system may receive, from a client device, a request for a dynamic user experience associated with a user interface. The system may receive, from the client device and in association with receiving the request for the dynamic user experience, capability information indicating one or more client capabilities supported by the client device for the dynamic user interface tiles. The system may transmit, to the client device, a tile specification indicating user interface information for a user interface tile associated with the dynamic user experience, where the tile specification is in accordance with the capability information and one or more provider capabilities.

Abstract: In some implementations, a system may receive, from a client device, a client request for a dynamic user experience associated with a user interface. The system may obtain an experience configuration associated with the dynamic user experience, wherein the experience configuration indicates a data provider for the dynamic user experience. The system may transmit, to the data provider, a data request, wherein the data request is generated based on the experience configuration. The system may receive, from the data provider, the dynamic data based on transmitting the data request. The system may transmit, to the client device, one or more tile specifications indicating user interface information for a user interface tile associated with the dynamic user experience to cause the client device to display the user interface tile via the user interface.

Abstract: In some implementations, a system may store one or more unhydrated tile specifications for one or more dynamic user experiences. The system may store content information that is insertable into one or more blank fields of the one or more unhydrated tile specifications. The system may receive, from a device, a request that indicates a dynamic user experience from the one or more dynamic user experiences. The system may obtain, based on the dynamic user experience, an unhydrated tile specification, from the one or more unhydrated tile specifications, and one or more content data objects from the content information. The system may automatically generate a hydrated tile specification based on the unhydrated tile specification and the one or more content data objects. The system may transmit, to the device, the hydrated tile specification to cause the device to render and display the dynamic user experience via a user interface.

Abstract: In some implementations, a system may receive, from a client device, a client request for a dynamic user experience associated with a user interface, wherein the client request indicates client data associated with the client device. The system may obtain, based on the client data, dynamic data associated with the dynamic user experience and the client device. The system may provide, to a tile utility component of the system, tile definition information, wherein the tile definition information includes the client data, an indication of the dynamic user experience, and the dynamic data. The system may obtain, from the tile utility component, the one or more tile specifications based on the tile definition information. The system may transmit, to the client device, the one or more tile specifications to cause the client device to display the dynamic user experience via the user interface.

Abstract: An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.

Abstract: An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.

Abstract: An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.

Abstract: An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.

Abstract: An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.

Abstract: An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.

Abstract: An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.

Abstract: A method, apparatus and system with an electrically conductive through hole via of a composite material with a matrix forming a continuous phase and embedded particles, with a different material property than the matrix, forming a dispersed phase, the resulting composite material having a different material property than the matrix.

Abstract: In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer. In one embodiment, the interposer 106 includes columnar interconnects which may be fabricated by etching a conductive member such as copper foil, for example. In one application, the pitch or center to center spacing of the columnar interconnects may be defined by masking techniques to provide an interconnect pitch suitable for a particular application. In yet another aspect, etching rates may be controlled to provide height to width aspect ratios of the columnar interconnects which are suitable for various applications.

Abstract: Embodiments of the invention provide a device with a die and a substrate having a similar coefficient of thermal expansion to that of the die. The substrate may comprise a silicon base layer. Build up layers may be formed on the side of the base layer further from the die.

Abstract: A method, apparatus and system with an electrically conductive through hole via of a composite material with a matrix forming a continuous phase and embedded particles, with a different material property than the matrix, forming a dispersed phase, the resulting composite material having a different material property than the matrix.

Abstract: Horizontal carbon nanotubes may be used for on-die routing and other applications. In one example, a catalyst is applied to a plurality of different points on a substrate. Carbon nanotubes are then grown vertically on the plurality of different points to form a plurality of vertical carbon nanotube structures on the substrate. The vertical carbon nanotuhe structures are then rolled to form horizontal carbon nanotube structures.

Abstract: Nano-scale particle paste may be used for on-die routing and other applications using deposition and inkjet printing. A metal paste is applied to a surface of a die to electrically couple two spaced apart connection points of the die. Alternatively, or in addition, the paste may contain carbon nanotubes. The paste may be used on other surfaces as well.

Abstract: Embodiments of the invention provide a device with a die and a substrate having a similar coefficient of thermal expansion to that of the die. The substrate may comprise a silicon base layer. Build up layers may be formed on the side of the base layer further from the die.

Abstract: In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer. In one embodiment, the interposer 106 includes columnar interconnects which may be fabricated by etching a conductive member such as copper foil, for example. In one application, the pitch or center to center spacing of the columnar interconnects may be defined by masking techniques to provide an interconnect pitch suitable for a particular application. In yet another aspect, etching rates may be controlled to provide height to width aspect ratios of the columnar interconnects which are suitable for various applications.