Abstract: Systems and methods are provided for allocating memory to dissimilar memory devices. An exemplary embodiment includes a method for allocating memory to dissimilar memory devices. An interleave bandwidth ratio is determined, which comprises a ratio of bandwidths for two or more dissimilar memory devices. The dissimilar memory devices are interleaved according to the interleave bandwidth ratio to define two or more memory zones having different performance levels. Memory address requests are allocated to the memory zones based on a quality of service (QoS).

Abstract: Systems and methods are provided for managing performance of a computing device having dissimilar memory types. An exemplary embodiment comprises a method for interleaving dissimilar memory devices. The method involves determining an interleave bandwidth ratio comprising a ratio of bandwidths for two or more dissimilar memory devices. The dissimilar memory devices are interleaved according to the interleave bandwidth ratio. Memory address requests are distributed from one or more processing units to the dissimilar memory devices according to the interleave bandwidth ratio.

Abstract: Systems and methods are provided for dynamically allocating a memory subsystem. An exemplary embodiment comprises a method for dynamically allocating a memory subsystem in a portable computing device. The method involves fully interleaving a first portion of a memory subsystem having memory components with asymmetric memory capacities. A second remaining portion of the memory subsystem is partial interleaved according to an interleave bandwidth ratio. The first portion of the memory subsystem is allocated to one or more high-performance memory clients. The second remaining portion is allocated to one or more relatively lower-performance memory clients.

Abstract: Various embodiments of methods and systems for hardware (“HW”) based dynamic memory management in a portable computing device (“PCD”) are disclosed. One exemplary method includes generating a lookup table (“LUT”) to track each memory page located across multiple portions of a volatile memory. The records in the LUT are updated to keep track of data locations. When the PCD enters a sleep state to conserve energy, the LUT may be queried to determine which specific memory pages in a first portion of volatile memory (e.g., an upper bank) contain data content and which pages in a second portion of volatile memory (e.g., a lower bank) are available for receipt of content. Based on the query, the location of the data in the memory pages of the upper bank is known and can be quickly migrated to memory pages in the lower bank which are identified for receipt of the data.

Abstract: Some implementations provide a folding electronic device that includes a base portion, a cover portion and a coupler. The base portion includes a region configured to generate heat. The cover portion includes a display screen, a heat dissipating component, and a thermally insulating component. The heat dissipating component is coplanar to the display screen. The thermally insulating component is coplanar to the display screen. The thermally insulating component is located between the display screen and the heat dissipating component. The coupler is for thermally coupling the base portion to the cover portion. The coupler includes a first component and a second component. The first component is coupled to the region configured to generate heat. The second component is coupled to the heat dissipating component of the cover portion. The coupler provides a path for transferring heat.

Abstract: In an embodiment, a stacked package-on-package system has a memory die and a logic die. The memory die comprises a first memory and a second memory, each operated independently of the other, and each having an inter-chip interface electrically connected to the logic die. The logic die has two independent clock sources, one to provide a first clock signal to the first memory, and the other clock source to provide a second clock signal to the second memory.

Abstract: A system involves a first SerDes link from a first integrated circuit (IC) to a second IC and a second link from the second IC to the first IC. Power consumption settings in circuitry of the first link are adjusted to control power consumption such that the bit error rate of the first link is maintained in a range, where the lower bound of the range is substantially greater than zero. Power consumption settings in circuitry for the second link are adjusted to control power consumption such that the bit error rate of the second link is maintained in range, where the lower bound of the range is substantially greater than zero. In one example, circuitry in the second IC detects errors in the first link and reports back via the second link. The first IC uses the reported information to determine a bit error rate for the first link.

Abstract: Electronic devices incorporating a heat dissipation feature include an enclosure, and at least one heat-generating component positioned within the enclosure. The heat dissipation feature is sufficiently coupled to the at least one heat-generating component to facilitate conductive heat transfer from the heat-generating component. The heat dissipation feature includes a plurality of protrusions exposed externally to the enclosure. A thermally insulating material may be disposed on at least a tip portion of at least some of the protrusions. The thermally insulating material is selected to provide a touch temperature that is below a predetermined threshold. In some instances, the thermally insulating material can provide such a touch temperature by selecting the material to include properties for thermal conductivity (k), density (?), and specific heat (Cp) such that the product of k*?*Cp results in a value less than a product of k*?*Cp for human skin.

Abstract: A system involves a first SerDes link from a first integrated circuit (IC) to a second IC and a second link from the second IC to the first IC. Power consumption settings in circuitry of the first link are adjusted to control power consumption such that the bit error rate of the first link is maintained in a range, where the lower bound of the range is substantially greater than zero. Power consumption settings in circuitry for the second link are adjusted to control power consumption such that the bit error rate of the second link is maintained in range, where the lower bound of the range is substantially greater than zero. In one example, circuitry in the second IC detects errors in the first link and reports back via the second link. The first IC uses the reported information to determine a bit error rate for the first link.