Abstract: A laser includes an active ring, a passive waveguide, and a reflector. The active ring is to generate light. The passive waveguide is associated with the active ring to capture generated light. The reflector is associated with the passive waveguide to cause captured light from the waveguide to be coupled into the active ring to trigger domination of unidirectional lasing in the active ring to generate light.

Abstract: A non-evanescent hybrid laser. The laser includes an elongated waveguide including grating reflectors defining a laser cavity, a thin-film dielectric adjacent the laser cavity, and a group III-V wafer carried by the waveguide adjacent the laser cavity, separated from the laser cavity by the dielectric, and in non-evanescent optical communication with the laser cavity.

Abstract: A thermal shunt is to transfer heat from a sidewall of a device to a silicon substrate. The device is associated with a Silicon-On-Insulator (SOI) including a buried oxide layer. The thermal shunt extends through the buried oxide layer to the silicon substrate.

Abstract: Compact photonics platforms and methods of forming the same are provided. An example of a compact photonics platform includes a layered structure having an active region along a longitudinal axis, a facet having an angle no less than a critical angle formed at least one longitudinal end of the active region, and a waveguide having at least one grating coupler positioned in alignment with the angled facet to couple light out to or in from the waveguide.

Abstract: One example includes a laser system. The system can include a first electrode to transmit first electrical carriers into an active region via a first waveguide region in response to a current signal. The system also includes a second electrode to transmit second electrical carriers into the active region via a second waveguide region in response to the current signal. The first and second electrical carriers can be combined in the active region to emit photons to generate an optical signal. The system further includes a third electrode responsive to a signal to affect a concentration of third electrical carriers in a device layer located proximal to the second waveguide region to modulate an optical characteristic of the optical signal.

Abstract: A device includes a first region, a multiplication region, a second region, and an absorption region. The first region is associated with a first terminal, and the second region is associated with a second terminal. The first region is separated from the second region by the multiplication region. The absorption region is disposed on the multiplication region and associated with a third terminal. A multiplication region electric field is independently controllable with respect to an absorption region electric field, based on the first terminal, the second terminal, and the third terminal.

Abstract: A hybrid MOS optical modulator. The optical modulator includes an optical waveguide, a cathode comprising a first material and formed in the optical waveguide, and an anode comprising a second material dissimilar from the first material and formed in the optical waveguide, the anode adjoining the cathode, a capacitor being defined between the anode and the cathode.

Abstract: A laser system can include an electrode to transmit electrical carriers into an active region in response to first electrical stimulation. The laser system can also include another electrode to transmit electrical carriers into the active region in response to second electrical stimulation. The electrical carriers can be combined in the active region to emit photons to generate an optical signal. The system can further include yet another electrode responsive to electrical stimulation to affect a concentration of electrical carriers in a device layer to change a capacitance of an internal capacitance region associated with at least one of first and second waveguide regions and the device layer. The third electrical stimulation can be modulated to modulate the optical signal based on the change to the capacitance of the internal capacitance region.

Abstract: A laser includes an active ring, a passive waveguide, and a reflector. The active ring is to generate light. The passive waveguide is associated with the active ring to capture generated light. The reflector is associated with the passive waveguide to cause captured light from the waveguide to be coupled into the active ring to trigger domination of unidirectional lasing in the active ring to generate light.

Abstract: Apparatuses and systems for analyzing light by mode interference are provided. An example of an apparatus for analyzing light by mode interference includes a number of waveguides to support in a multimode region two modes of the light of a particular polarization and a plurality of scattering objects offset from a center of at least one of the number of waveguides.

Abstract: A laser system can include an electrode to transmit electrical carriers into an active region in response to first electrical stimulation. The laser system can also include another electrode to transmit electrical carriers into the active region in response to second electrical stimulation. The electrical carriers can be combined in the active region to emit photons to generate an optical signal. The system can further include yet another electrode responsive to electrical stimulation to affect a concentration of electrical carriers in a device layer to change a capacitance of an internal capacitance region associated with at least one of first and second waveguide regions and the device layer. The third electrical stimulation can be modulated to modulate the optical signal based on the change to the capacitance of the internal capacitance region.

Abstract: A device includes a substrate layer, a diamond layer, and a device layer. The device layer is patterned. The diamond layer is to conform to a pattern associated with the device layer.

Abstract: A thermal shunt is to transfer heat from a sidewall of a device to a silicon substrate. The device is associated with a Silicon-On-Insulator (SOI) including a buried oxide layer. The thermal shunt extends through the buried oxide layer to the silicon substrate.

Abstract: InP epitaxial material is directly bonded onto a Silicon-On-Insulator (SOI) wafer having Vertical Outgassing Channels (VOCs) between the bonding surface and the insulator (buried oxide, or BOX) layer. H2O and other molecules near the bonding surface migrate to the closest VOC and are quenched in the buried oxide (BOX) layer quickly by combining with bridging oxygen ions and forming pairs of stable nonbridging hydroxyl groups (Si—OH). Various sizes and spacings of channels are envisioned for various devices.

Abstract: InP epitaxial material is directly bonded onto a Silicon-On-Insulator (SOI) wafer having Vertical Outgassing Channels (VOCs) between the bonding surface and the insulator (buried oxide, or BOX) layer. H2O and other molecules near the bonding surface migrate to the closest VOC and are quenched in the buried oxide (BOX) layer quickly by combining with bridging oxygen ions and forming pairs of stable nonbridging hydroxyl groups (Si—OH). Various sizes and spacings of channels are envisioned for various devices.

Abstract: InP epitaxial material is directly bonded onto a Silicon-On-Insulator (SOI) wafer having Vertical Outgassing Channels (VOCs) between the bonding surface and the insulator (buried oxide, or BOX) layer. H2O and other molecules near the bonding surface migrate to the closest VOC and are quenched in the buried oxide (BOX) layer quickly by combining with bridging oxygen ions and forming pairs of stable nonbridging hydroxyl groups (Si—OH). Various sizes and spacings of channels are envisioned for various devices.

Abstract: InP epitaxial material is directly bonded onto a Silicon-On-Insulator (SOI) wafer having Vertical Outgassing Channels (VOCs) between the bonding surface and the insulator (buried oxide, or BOX) layer. H2O and other molecules near the bonding surface migrate to the closest VOC and are quenched in the buried oxide (BOX) layer quickly by combining with bridging oxygen ions and forming pairs of stable nonbridging hydroxyl groups (Si—OH). Various sizes and spacings of channels are envisioned for various devices.

Abstract: InP epitaxial material is directly bonded onto a Silicon-On-Insulator (SOI) wafer having Vertical Outgassing Channels (VOCs) between the bonding surface and the insulator (buried oxide, or BOX) layer. H2O and other molecules near the bonding surface migrate to the closest VOC and are quenched in the buried oxide (BOX) layer quickly by combining with bridging oxygen ions and forming pairs of stable nonbridging hydroxyl groups (Si—OH). Various sizes and spacings of channels are envisioned for various devices.

Abstract: Disclosed is an example method to reduce waveguide scattering loss. The method includes forming a waveguide having a sidewall, the waveguide including a group III-V compound semiconductor material, and growing a native oxide on the waveguide to form an index of refraction contrast at the sidewall, the native oxide grown in a controlled Oxygen-enriched water vapor environment to reduce a roughness of the sidewall.