Abstract: A process for preparing organohalosilanes comprising combining hydrogen, a halosilane having the formula HaSiX4-a (I) and an organohalide having the formula RX (II), wherein R is C1-C10 alkyl or C4-C10 cycloalkyl, each X is independently halo, and the subscript a is 0, 1, or 2, in the presence of a sufficient amount of a catalyst effective in enabling the replacement of one or more of the halo groups of the halosilane with the R group from the organohalide, at a temperature from 200 to 800° C., to form an organohalosilane and a hydrogen halide, wherein the volumetric ratio of hydrogen to halosilane is from 1:3 to 1:0.001 and the volumetric ratio of hydrogen to organohalide is from 1:1 to 1:0.001, and wherein the catalyst is optionally treated with the hydrogen or the halosilane prior to the combining.

Abstract: A method of preparing a hydridohalosilane compound comprises treating a preformed metal silicide with a mixture comprising hydrogen gas and a silicon tetrahalide to prepare the hydridohalosilane compound.

Abstract: A method of preparing organohalosilanes comprising combining an organohalide having the formula RX (I), wherein R is a hydrocarbyl group having 1 to 10 carbon atoms and X is fluoro, chloro, bromo, or iodo, with a contact mass comprising at least 2% (w/w) of a palladium suicide of the formula PdxSiy (II), wherein x is an integer from 1 to 5 and y is 1 to 8, or a platinum suicide of formula Pt2Si (III), wherein z is 1 or 2, in a reactor at a temperature from 250 to 700° C. to form an organohalosilane.

Abstract: An article of manufacture comprising (i) at least one metal foil substrate; (ii) a coating layer on at least a portion of at least one side of the metal foil substrate wherein the coating layer comprises (a) a condensation cured silicone resin composition and (b) silica nanoparticles.

Abstract: An article of manufacture comprising (i) at least one glass substrate and (ii) a coating layer on at least a portion of at least one side of the glass substrate wherein the coating layer comprises a cured silicone resin composition selected from a hydrosilylation cured silicone resin composition, a condensation cured silicone resin composition, or a tree radical cured silicone resin composition; the glass being preferably a thin glass (5-500 micrometers).

Abstract: Cyclic dihydrogenpolysiloxanes, hydrogenpolysiloxanes of specific siloxane unit formulas etc., a process for their production using hydrolysis/condensation, a process for the production of silica type glass moldings with an optical transmittance of 90% to 100% in the vacuum-UV region to UV region and an optical transmittance of 98% to 100% in the visible region to near infrared region by curing said cyclic dihydrogensiloxanes or said hydrogenpolysiloxanes in a mold, said silica type glass moldings, optical elements made up of the silica type glass, a process for the production of optical elements having such a silica type glass film layer by coating an optical element with the hydrogenpolysiloxanes and curing them, and optical elements having such a silica type glass film layer.

Abstract: This invention relates to a method of embossing a cured silicone resin thermoset substrate to imprint patterns onto the substrate from a master mold comprising (i) stacking a master mold with a cured silicone resin thermoset substrate such that the surface of the master mold containing a feature is facing the silicone resin substrate; (ii) applying pressure to the product of (i) in a press at a temperature slightly higher than the Tg of the silicone resin but lower than the softening point of the master mold; (iii) cooling the product of (ii) and maintaining the pressure on the mold; and (iv) releasing the substrate whereby the feature is imprinted on the silicone resin substrate. Cured silicone resin thermoset substrates offer advantages over the organic thermoplastics in terms of hot embossing lithography by offering a very smooth surface which promotes high fidelity of replication in the micrometer and manometer domain, and requiring no release agent for demolding.

Abstract: An article of manufacture comprising (i) at least one metal foil substrate; (ii) a coating layer on at least a portion of at least one side of the metal foil substrate wherein the coating layer comprises (a) a condensation cured silicone resin composition and (b) silica nanoparticles.

Abstract: An article of manufacture comprising (i) at least one glass substrate and (ii) a coating layer on at least a portion of at least one side of the glass substrate wherein the coating layer comprises a cured silicone resin composition selected from a hydrosilylation cured silicone resin composition, a condensation cured silicone resin composition, or a tree radical cured silicone resin composition; the glass being preferably a thin glass (5-500 micrometers)

Abstract: A method of manufacturing an inorganic substrate coated with a thin silica type glass layer of 2 H to 9 H pencil hardness, said method comprising the steps of: coating an inorganic substrate with a cyclic dihydrogenpolysiloxane and/or a hydrogenpolysiloxane represented by a specific unit formula, and curing it; an inorganic substrate coated with a thin silica type glass layer; a coating agent for an inorganic substrate that is composed of a cyclic dihydrogenpolysiloxane and/or a hydrogenpolysiloxane represented by a specific unit formula; and a semiconductor device having an inorganic substrate coated with a thin silica type glass layer.

Abstract: A method of preparing a silicone resin film comprising coating a first release liner with a filled silicone composition comprising a hydrosilylation-curable silicone composition and a flame retardant filler, applying a second release liner to the coated first release liner to form an assembly, compressing the assembly; and curing the silicone resin of the compressed assembly, wherein the silicone resin film has a thickness of from 1 to 500 ?m; and a silicone resin film.

Abstract: The present invention relates to silicone compositions that can be used to control the interface at which release occurs when a bi-layer or multi-layer structure comprising compositions as separate layers, and a pattern of a different material sandwiched in between, is separated. The present invention further relates to a process that utilizes these compositions to control the transfer or release of patterns deposited on a substrate.

Abstract: A method of preparing a reinforced silicone resin film, the method comprising the steps of impregnating a fiber reinforcement in a hydrosilylation-curable silicone composition comprising a silicone resin, and heating the impregnated fiber reinforcement at a temperature sufficient to cure the silicone resin, wherein the reinforced silicone resin film comprises from 10 to 99% (w/w) of the cured silicone resin and the film has a thickness of from 15 to 500 ?m; and a reinforced silicone resin film prepared according to the method.

Abstract: A dielectric coating for use on a conductive substrate including a silicone composition of the formula: [RxSiO(4-x)/2]n wherein x=1-4 and wherein R comprises of methyl, or phenyl, or hydrido, or hydroxyl or alkoxy or combination of them (when 1<x<4). R can also comprise other monovalent radicals independently selected from alkyl or aryl groups, arylether, alkylether, alylamide, arylamide, alkylamino and arylamino radicals. The dielectric coating has a network structure. A photovoltaic substrate is also disclosed and includes a conductive material having a dielectric coating disposed on a surface of the conductive material.

Abstract: This invention relates to a method of embossing a cured silicone resin thermoset substrate to imprint patterns onto the substrate from a master mold comprising (i) stacking a master mold with a cured silicone resin thermoset substrate such that the surface of the master mold containing a feature is facing the silicone resin substrate; (ii) applying pressure to the product of (i) in a press at a temperature slightly higher than the Tg of the silicone resin but lower than the softening point of the master mold; (iii) cooling the product of (ii) and maintaining the pressure on the mold; and (iv) releasing the substrate whereby the feature is imprinted on the silicone resin substrate. Cured silicone resin thermoset substrates offer advantages over the organic thermoplastics in terms of hot embossing lithography by offering a very smooth surface which promotes high fidelity of replication in the micrometer and manometer domain, and requiring no release agent for demolding.

Abstract: The present invention relates to silicone compositions that can be used to control the interface at which release occurs when a bi-layer or multi-layer structure comprising compositions as separate layers, and a pattern of a different material sandwiched in between, is separated. The present invention further relates to a process that utilizes these compositions to control the transfer or release of patterns deposited on a substrate.

Abstract: A fiber reinforced composite including layers of fibers, each layer being impregnated with a resin. The layers include in combination a layer of an addition cured silicone resin and a layer of an organic resin. The layers form a hybrid composite having a higher modulus retention at elevated temperatures than the addition cured silicone resin alone. The hybrid composite's mechanical properties are similar to the organic resin composite, but demonstrate enhanced thermal resistance and reduced flammability.

Abstract: The present invention relates to a film made from a cross-linked polysiloxane obtained by subjecting a polysiloxane that has a specific chemical structure and contains at least two unsaturated aliphatic hydrocarbon groups in one molecule and an organosilicon compound with at least two hydrogen atoms directly bonded to silicon atoms in one molecule to cross-linking reaction in the presence of a platinum-type catalyst. The film provided by the invention possesses superior heat-resistant properties, has excellent permeability for light in the visible wavelength range, is characterized by low birefringence, and demonstrates physical properties suitable for practical application. By forming an inorganic substance layer on the aforementioned polysiloxane, it is possible to use the laminated film of the invention, e.g., as a transparent electrode film.