Abstract: Described is an illumination structure for a key of a keyboard. The illumination structure is used to uniformly illuminate the key and any glyphs that are present on the key. The illumination structure includes a light guide having various features that increase total internal reflection and also illuminate the glyphs of the key.

Abstract: Embodiments related to an electronic device having an adaptive input row. The adaptive input row may be positioned within an opening of a device and include a cover for receiving a touch and a display that is configured to present an adaptable set of indicia. The adaptive input row may also include one or more sensors for detecting the location of a touch and/or the magnitude of a force of the touch. The adaptive input row may be positioned adjacent or proximate to a keyboard of the electronic device.

Abstract: Embodiments related to an electronic device having an adaptive input row. The adaptive input row may be positioned within an opening of a device and include a cover for receiving a touch and a display that is configured to present an adaptable set of indicia. The adaptive input row may also include one or more sensors for detecting the location of a touch and/or the magnitude of a force of the touch. The adaptive input row may be positioned adjacent or proximate to a keyboard of the electronic device.

Abstract: An electronic device may be provided having an organic light-emitting diode display and control circuitry for operating the display. The display may include one or more display layers interposed between the control circuitry and a display layer having thin-film transistors. The electronic device may include a coupling structure interposed between the layer of thin-film transistors and the control circuitry that electrically couples the layer of thin-film transistors to the control circuitry. The coupling structure may include a dielectric member having a conductive via, a flexible printed circuit having a bent portion, or a conductive via formed in an encapsulation layer of the display. The display may include a layer of opaque masking material. The layer of opaque masking material may be formed on an encapsulation layer, an organic emissive layer, a thin-film transistor layer, or a glass layer of the organic light-emitting diode display.

Abstract: An electronic device display may have a color filter layer and a thin film transistor layer. A layer of liquid crystal material may be interposed between the color filter layer and the thin film transistor layer. A layer of polarizer may be laminated onto the surface of the color filter layer. Laser trimming may ensure that the edges of the polarizer are even with the edges of the color filter layer. The thin film transistor layer may have an array of thin film transistors that control pixels of the liquid crystal material in the display. Driver circuitry may be used to control the array. The driver circuitry may be encapsulated in a planarized encapsulant on the thin film transistor layer or may be mounted to the underside of the color filter layer. Conductive structures may connect driver circuitry on the color filter layer to the thin film transistor layer.

Abstract: An electronic device may be provided with a display. The electronic device may include a housing. A display trim may be formed from injection molded plastic that is molded directly onto the housing. The molded plastic trim may form a rectangular ring around the periphery of the housing. The housing may have angled or curved interior surfaces that are covered by the molded plastic trim. Computer-controlled positioners may be used to center the housing within an injection molding tool. Independently controlled positioners may also be used in capturing the housing between the lower die and the upper die in the injection molding tool. The injection molding tool may inject thermoplastic elastomer material into a channel in the upper die to form the plastic display trim.

Abstract: An electronic device may be provided with upper and lower housing portions that are separated by a gap. Hinge structures may allow the upper housing portion to rotate between a closed position and an open position. A flexible printed circuit in the electronic device may be coupled between components in the upper housing portion such as the display and components in the lower housing portion and may span the gap. A hinge gap cover may cover the gap and may overlap the flexible printed circuit to block the flexible printed circuit from view when the upper housing portion is in the closed position. The hinge gap cover may be formed from a layer of radio-transparent material that is rotatably coupled to the upper housing portion and that is biased towards the lower housing with a spring structure.

Abstract: An input mechanism is disclosed. The input mechanism includes a dome support structure defining an opening that extends through the dome support structure, a collapsible dome positioned in the opening and engaged with the dome support structure, and a cover member coupled to the dome support structure and covering the collapsible dome, thereby retaining the collapsible dome within the opening of the dome support structure.

Abstract: Keyboard assemblies having reduced thicknesses and methods of forming the same. A keyboard assembly may include a printed circuit board (PCB) and a single membrane sheet adhered directly to the PCB. The single membrane sheet may substantially cover the PCB. The keyboard assembly may also include a group of dome switches coupled directly to the single membrane sheet. Another keyboard assembly may include a group of conductive pads and a group of membrane pads. Each of the group of membrane pads may be adhered directly to a corresponding one of the group of conductive pads. The keyboard assembly may also include a group of dome switches coupled directly to the membrane pads. Each of the group of dome switches may be coupled directly to a corresponding one of the group of membrane pads.

Abstract: Disclosed herein is a stack-up for an input device. The stack-up may include a flexible substrate having a switch and a light source. The switch has at least two contacts that are bridged in response to actuation of a dome that is positioned above the switch. The flexible substrate includes a signal trace for detecting the actuation of the dome and a power trace for providing power to the light source.

Abstract: An electronic device may be provided having an organic light-emitting diode display and control circuitry for operating the display. The display may include one or more display layers interposed between the control circuitry and a display layer having thin-film transistors. The electronic device may include a coupling structure interposed between the layer of thin-film transistors and the control circuitry that electrically couples the layer of thin-film transistors to the control circuitry. The coupling structure may include a dielectric member having a conductive via, a flexible printed circuit having a bent portion, or a conductive via formed in an encapsulation layer of the display. The display may include a layer of opaque masking material. The layer of opaque masking material may be formed on an encapsulation layer, an organic emissive layer, a thin-film transistor layer, or a glass layer of the organic light-emitting diode display.

Abstract: An electronic device may be provided with upper and lower housing portions that are separated by a gap. Hinge structures may allow the upper housing portion to rotate between a closed position and an open position. A flexible printed circuit in the electronic device may be coupled between components in the upper housing portion such as the display and components in the lower housing portion and may span the gap. A hinge gap cover may cover the gap and may overlap the flexible printed circuit to block the flexible printed circuit from view when the upper housing portion is in the closed position. The hinge gap cover may be formed from a layer of radio-transparent material that is rotatably coupled to the upper housing portion and that is biased towards the lower housing with a spring structure.

Abstract: An input mechanism is disclosed. The input mechanism includes a dome support structure defining an opening that extends through the dome support structure, a collapsible dome positioned in the opening and engaged with the dome support structure, and a cover member coupled to the dome support structure and covering the collapsible dome, thereby retaining the collapsible dome within the opening of the dome support structure.

Abstract: Keyboard assemblies having reduced thicknesses and methods of forming the same. A keyboard assembly may include a printed circuit board (PCB) and a single membrane sheet adhered directly to the PCB. The single membrane sheet may substantially cover the PCB. The keyboard assembly may also include a group of dome switches coupled directly to the single membrane sheet. Another keyboard assembly may include a group of conductive pads and a group of membrane pads. Each of the group of membrane pads may be adhered directly to a corresponding one of the group of conductive pads. The keyboard assembly may also include a group of dome switches coupled directly to the membrane pads. Each of the group of dome switches may be coupled directly to a corresponding one of the group of membrane pads.

Abstract: A key mechanism for an electronic device includes a switch housing and a hinged structure. As one example, the hinged structure can be a butterfly hinge. The switch housing includes switch pin retaining mechanisms on opposing sides of the switch housing. The hinged structure includes two separate wings that are positioned adjacent to each other such that a cavity is formed between the two wings. The two wings are coupled together by coupling elements. The wings of the hinged structure can include switch housing pins on each arm of the wing that extend into the cavity and couple to the switch pin retaining mechanisms in the switch housing. Various configurations of switch pin retaining mechanisms and switch housing pins can be used to attach the hinged structure to the switch housing.

Abstract: Systems and methods for providing illumination to illuminable portions of keys associated with a keyboard are described. A key includes a light guide positioned below a keycap. The light guide includes one or more sidewalls that exhibit high internal reflection. In many examples, light guide sidewalls are formed with one or more prisms.

Abstract: An electronic device may be provided with upper and lower housing portions that are separated by a gap. Hinge structures may allow the upper housing portion to rotate between a closed position and an open position. A flexible printed circuit in the electronic device may be coupled between components in the upper housing portion such as the display and components in the lower housing portion and may span the gap. A hinge gap cover may cover the gap and may overlap the flexible printed circuit to block the flexible printed circuit from view when the upper housing portion is in the closed position. The hinge gap cover may be formed from a layer of radio-transparent material that is rotatably coupled to the upper housing portion and that is biased towards the lower housing with a spring structure.

Abstract: An electronic device may have a liquid crystal display with backlight structures. The backlight structures may produce backlight that passes through an array of display pixels. The display pixels may include electrode structures and thin-film transistor structures for controlling electric fields in a layer of liquid crystal material. The liquid crystal material may be formed between an outer display layer and an inner display layer. The inner display layer may be interposed between the backlight structures and the liquid crystal material. Thin-film transistor structures, electrodes, and conductive interconnection lines may be deposited in a layer on the inner surface of the outer display layer. A layer of color filter elements may be used to provide the display with color pixels. The color filter elements may be formed on top of the thin-film transistor layer or on a separate color filter array substrate such as the inner display layer.

Abstract: An electronic device may have a housing. Electrical components such as a display and other circuitry may be mounted in the housing. The housing may have portions that move with respect to each other such as a lid that rotates relative to a base. A flexible printed circuit may have metal lines that couple components in one portion of the housing to components in another portion of the housing. As the housing portions move with respect to each other, the flexible printed circuit bends. Reliability may be enhanced for the flexible printed circuit by providing the metal layer that forms the metal lines with upper and lower coating layers. The coating layers may be formed from metal with a higher Young's modulus than a metal core in the metal layer. A slot may be formed along the length of the flexible printed circuit to help increase the minimum bend radius exhibited by the flexible printed circuit. Upper and lower metal shield layers may be provided above and below the metal traces.

Abstract: An electronic device may be provided with a display. The display may be mounted in a display housing having multiple display housing layers. The display housing layers may include metal layers and fiber composite layers. A fiber composite display housing layer may have an array of dimples. The fiber composite display housing layer may be attached to a planar metal layer using adhesive. An array of openings may be formed in the metal layer to lighten the display housing. A foam layer or other core may be sandwiched between display housing layers. Components may be embedded in the foam. Edge members may run along peripheral edges of the display housing layers. Electrical components may be mounted on printed circuits and housed within cavities in the display housing. The electrical components may include light-emitting diodes for a display. Heat from the electrical components may be dissipated in the metal layer.