Patents by Inventor Ding An

Ding An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6621915
    Abstract: The present invention disclosed a method and system inspecting cotton web homogeneity by a digital image processing technique, in particular, for an on-line cotton web homogeneity test. It uses optical principles in conjunction with a charge coupled device type camera to find a theoretical equation indicating the correlation between the transmittance of cotton webs and basic weights (weights per unit area). Next, the invention makes use of a numerical analysis method to find the optimal approximation equation representing a relationship between measured transmittance and basic weights of cotton webs. When executing an on-line inspection, a system according to the invention detects the transmittance of cotton webs by means of the computer controlled visual device and then calculates correlated data of cotton web homogeneity variations according to the approximation equation acquired previously.
    Type: Grant
    Filed: February 29, 2000
    Date of Patent: September 16, 2003
    Assignee: China Textile Institute
    Inventors: Hung-Jen Chen, Hsin-Chung Lien, Chih-Hua Liu, Ding-Kuo Huang
  • Patent number: 6621778
    Abstract: This specification discloses an automatic calibration method for the output power of a pickup head for an optical information recording apparatus, which avoids laser diode thermal effects using duty cycle control and obtains the correct conversion function between the output current of a front monitor diode and the output power of the pickup head by curve fitting. This method only needs to measure one set of front monitor diode output current and output power conversion function of the pickup head. The same conversion function is applicable to all pickup heads of the same type. The optical information recording apparatus automatically detects the corresponding parameter for the pickup head. Each optical information recording apparatus can also automatically detect the specific power control parameters for each set of power control channel to obtain the optimal recording characteristics.
    Type: Grant
    Filed: November 24, 2000
    Date of Patent: September 16, 2003
    Assignee: Industrial Technology Research Institute
    Inventors: Shu-Tai Lu, Kuang-Yang Chuang, Jyh-Shong Ju, Feng-Hsiang Lo, Kuo-Ding Shin, Yong-Long Lee, Ching-Ping Kuei
  • Patent number: 6622040
    Abstract: A method and apparatus for selection of one or more ventricular chambers to stimulate for ventricular resynchronization therapy. Intrinsic intracardia electrograms that include QRS complexes, are recorded from a left and right ventricle. A timing relationship between the intrinsic intracardia electrograms recorded from the left and right ventricle is then determined. In one embodiment, the timing relationship is determined using a delay between a left ventricular and a right ventricular sensed intrinsic ventricular depolarizations and a duration interval of one or more QRS complexes. In one embodiment, the duration of QRS complexes is determined from either intracardiac electrograms or from surface ECG recordings. One or more ventricular chambers in which to provide pacing pulses are then selected based on the timing relationship between intrinsic intracardia electrograms recorded from the right and left ventricle, and the duration of one or more QRS complexes.
    Type: Grant
    Filed: December 15, 2000
    Date of Patent: September 16, 2003
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Jiang Ding, Julio C. Spinelli, Yinghong Yu, Andrew P. Kramer
  • Patent number: 6620194
    Abstract: A coating and method for a coating an implantable device or prostheses are disclosed. The coating includes an undercoat of polymeric material containing an amount of biologically active material, particularly heparin, dispersed therein. The coating further includes a topcoat which covers less than the entire surface of the undercoat and wherein the topcoat comprises a polymeric material substantially free of pores and porosigens. The polymeric material of the topcoat can be a biostable, biocompatible material which provides long term non-thrombogenicity to the device portion during and after release of the biologically active material.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: September 16, 2003
    Assignee: Boston Scientific Scimed, Inc.
    Inventors: Ni Ding, Michael N. Helmus
  • Publication number: 20030172125
    Abstract: The present invention is a common location-based service adapter interface. The common location-based service adapter interface can include a uniform input interface through which location-based services can be requested using a uniform format which is independent of any specific formatting required by a particular service adapter configured to process the location-based services. The common location-based service adapter interface also can include a uniform output interface through which specifically formatted result sets can be formatted using the uniform format.
    Type: Application
    Filed: February 15, 2002
    Publication date: September 11, 2003
    Applicant: International Business Machines Corporation
    Inventors: Virinder M. Batra, Valerie M. Bennett, Andrew N. Capella, Xiaoyan Chen, Xiao Cheng Ding, Peter R. Gamble, Steven M. Miller
  • Publication number: 20030172158
    Abstract: An information recovery system mounts partial database replications, such as selected tablespaces, on a target host.
    Type: Application
    Filed: September 4, 2001
    Publication date: September 11, 2003
    Inventors: Ananthan K. Pillai, Madhav Mutalik, Ajay Shekhar, Neil Schutzman, Thomas Dings, John E. Stockenberg, Michael H. Wright, Christophe Balczunas
  • Publication number: 20030170468
    Abstract: Acrylosilane polymers containing vinyl silanes are prepared by copolymerizing vinyl alkoxy silane monomers predominantly with, or in the alternative, only with acrylate monomers. The polymer so prepared can be used as the main component in the acid etch resistant solvent borne coating compositions and in particular in clear coating compositions for clear coat/color coat finishes for automobiles and trucks.
    Type: Application
    Filed: March 11, 2002
    Publication date: September 11, 2003
    Inventors: Donald A. Paquet, Ding-Yu Chung, Isidor Hazan
  • Publication number: 20030171583
    Abstract: The invention provides general methods for preparing 2,9-, 2,6,9-, O6-aryl- and O6-alkyl-substituted purines in a combinatorial and traceless fashion. The methods involve, in some embodiments, Mitsunobu alkylation of 2-fluoro-6-phenylsulfenylpurine at N9 with alcohols in solution, followed by C2-capture of the purine core with a resin-bound amine and subsequent oxidation and displacement of the C6 sulfonyl group with amines and anilines.
    Type: Application
    Filed: October 12, 2002
    Publication date: September 11, 2003
    Applicant: IRM LLC, a Delaware Limited Liability Company
    Inventors: Sheng Ding, Qiang Ding, Nathanael S. Gray, Peter G. Schultz
  • Publication number: 20030164090
    Abstract: The invention relates to preparation and uses of novel polymeric materials, polyimide amic acid salts (PIAAS). The use of these materials for the fabrication of fluid separation membranes is further disclosed.
    Type: Application
    Filed: January 23, 2003
    Publication date: September 4, 2003
    Inventors: Yong Ding, Benjamin Bikson, Joyce Katz Nelson, James Timothy Macheras
  • Publication number: 20030165555
    Abstract: Methods and compositions are taught that may be used to administer specific bioactive polypeptides, known as T20 and T1249 to a patient, e.g., as a method of treating a disease or disease state. In particular, the invention teaches carrier hydrogel composition that contain (a) a polymer material and (b) an effective dose of T20, T1249 or a derivative thereof. The polymer materials used in the carrier hydrogel composition preferably have reverse gelation properties and exist as a liquid, aqueous solution at temperatures below physiological temperatures (e.g., below the body temperature of a patient) but form hydrogels under physiological conditions (e.g., at temperatures at or near the body temperature of a patient). The carrier hydrogel compositions may thus be administered to a patient by injection while they are in a liquid state. Upon administration the carrier hydrogel compositions then form hydrogels with the T20 and/or T1249 polypeptides embedded therein.
    Type: Application
    Filed: January 17, 2003
    Publication date: September 4, 2003
    Applicant: Trimeris, Inc.
    Inventors: Shulin Ding, Kang Myung-Chol, Thomas Michael Venetta
  • Publication number: 20030165933
    Abstract: The invention provides human apoptosis regulators (APRG) and polynucleotides which identify and encode APRG. The invention also provides expression vectors, host cells, antibodies, agonists, and antagonists. The invention also provides methods for diagnosing, treating, or preventing disorders associated with aberrant expression of APRG.
    Type: Application
    Filed: April 7, 2003
    Publication date: September 4, 2003
    Inventors: Y. Tom Tang, Yalda Azimzai, Henry Yue, Neil Burford, Li Ding, Vicki S. Elliott, Chandra S. Arvizu, Mariah R. Baughn
  • Publication number: 20030167151
    Abstract: A set of algorithms for detecting a renewal power-tall behavior which often relates to chaotic system activities in one or more computer system resources of a distributed computing environment, i.e., an enterprise. Analysis and/or prediction software receives a set of metric data points from agent software on one or more computer systems. The analysis and/or prediction software performs three analytic tests relating to distinctive properties of power tail distributions: a first test to determine whether the set of data points exhibits large deviations from the mean, a second test to determine whether the set of data points exhibits a high variance, and a third test to determine whether the set of the largest data points exhibits properties consistent with large values in a tall portion of a power-tall distribution. The tests can be performed in any order, and in other embodiments, fewer than three can be performed.
    Type: Application
    Filed: December 12, 2002
    Publication date: September 4, 2003
    Applicant: BMC Software, Inc.
    Inventors: Yiping Ding, Pierre Fiorini
  • Patent number: 6615202
    Abstract: There is provided a method for specifying an operation via a graphical interface. The method comprises the steps of examining an image to distinguish a first bordered region within the image; examining the image to distinguish a second bordered region within the image; and determining a functional attribute of the second bordered region based on a position of the second bordered region relative to the first bordered region. There is also provided a system for specifying the operation via a graphical interface.
    Type: Grant
    Filed: December 1, 1999
    Date of Patent: September 2, 2003
    Assignee: Telesector Resources Group, Inc.
    Inventors: Yuemin Ding, Marc J. Pannone, Albert Michael Selvin, Robert F. Shapiro, Ying Sun
  • Patent number: 6613187
    Abstract: The present invention provides a method for using a polymeric cement to assemble medical devices. The method includes the steps of: (1) providing a first article of a low crystallinity polymer; (2) providing a second article of a low crystallinity polymer; (3) providing a cement composition having a first component of a cyclic olefin containing polymer or a bridged polycyclic hydrocarbon containing polymer and a second component of an effective amount of a solvent having a solubility parameter of less than about 20 (MPa)1/2; applying the cement composition to one of the first and second articles to define a bonding area; and (4) attaching the first article to the second article along the bonding area to fixedly attach the first article to the second article.
    Type: Grant
    Filed: September 9, 1999
    Date of Patent: September 2, 2003
    Assignee: Baxter International Inc
    Inventors: Yuan-pang Samuel Ding, Chuan Qin, Lecon Woo, Michael T. K. Ling
  • Patent number: 6610184
    Abstract: An array of auxiliary magnets is disclosed that is positioned along sidewalls of a magnetron sputter reactor on a side towards the wafer from the target. The magnetron preferably is a small, strong one having a stronger outer pole of a first magnetic polarity surrounding a weaker outer pole of a second magnetic polarity and rotates about the central axis of the chamber. The auxiliary magnets preferably have the first magnetic polarity to draw the unbalanced magnetic field component toward the wafer. The auxiliary magnets may be either permanent magnets or electromagnets.
    Type: Grant
    Filed: November 14, 2001
    Date of Patent: August 26, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Peijun Ding, Rong Tao, Zheng Xu
  • Patent number: 6610716
    Abstract: Provided, among other things, is a compound of the formula:
    Type: Grant
    Filed: July 13, 2001
    Date of Patent: August 26, 2003
    Assignee: Alteon Incorporated
    Inventors: Dilip R. Wagle, Sheng Ding Fang
  • Publication number: 20030156402
    Abstract: A method for making a build-up package of a semiconductor die and a structure formed from the same. A copper foil with conductive columns is bonded to an encapsulated die by thermal compression, between thereof there is a pre-curing dielectric film sandwiched. The dielectric film is cured to form a dielectric layer of a die build-up package and the copper foil on the dielectric layer is etched to form the conductive traces. At least one conductive column in one of the dielectric layers is vertically corresponding to one of conductive column in the adjacent dielectric layer.
    Type: Application
    Filed: February 15, 2002
    Publication date: August 21, 2003
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yi-Chuan Ding, In-De Ou, Kun-Ching Chen
  • Publication number: 20030157747
    Abstract: A semiconductor build-up package includes a die, a circuit board and at least a dielectric layer. The circuit board has a surface for building up the dielectric layer, and the surface has a cavity for accommodating the die. The inside of multi-layer circuit board has conductive traces for expanding the electrical function of semiconductor build-up package. Each dielectric layer has conductive columns so that the die may electrically connect with the outermost dielectric layer. At least a conductive column is bonded on the surface of the multi-layer circuit board for inner electrical connection.
    Type: Application
    Filed: February 15, 2002
    Publication date: August 21, 2003
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Kun-Ching Chen, Yi-Chuan Ding, In-De Ou
  • Publication number: 20030157799
    Abstract: A method of filling trenches or vias on a semiconductor workpiece surface with copper using sputtering techniques. A copper wetting layer and a copper fill layer may both be applied by sputtering techniques. The thin wetting layer of copper is applied at a substrate surface temperature ranging between about 20° C. to about 250° C., and subsequently the temperature of the substrate is increased, with the application of the sputtered copper fill layer beginning at above at least about 200° C. and continuing while the substrate temperature is increased to a temperature as high as about 600° C. Preferably the substrate temperature during application of the sputtered fill layer ranges between about 300° C. and about 500° C.
    Type: Application
    Filed: February 20, 2003
    Publication date: August 21, 2003
    Inventors: Peijun Ding, Tony Chiang, Barry L. Chin
  • Publication number: 20030155145
    Abstract: A semiconductor build-up package includes a die, a metal carrier, and a plurality of dielectric layers. The metal carrier has a surface with a cavity for supporting the die. The surface of metal carrier is coplanar to the active surface of die for building up a plurality of dielectric layers. Each dielectric layer has metal columns for inner electrical connection. The metal carrier covers passive surface and sides of the die with a larger area for heat dissipating, so the heat generated from the die is dissipated fast through the metal carrier.
    Type: Application
    Filed: February 15, 2002
    Publication date: August 21, 2003
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: In-De Ou, Yi-Chuan Ding, Kun-Ching Chen