Abstract: A semiconductor transistor device includes a substrate having an active area and a trench isolation region surrounding the active area, a gate oxide layer, a gate, a spacer on a sidewall of the gate, a doping region on one side of the gate, an insulating cap layer covering the gate, the spacer and the doping region, and a redistributed contact layer (RCL) on the insulating cap layer. The RCL extends from the active area to the trench isolation region. A contact plug is disposed above the trench isolation region and is electrically connected to the gate or the doping region through the RCL.

Abstract: A semiconductor array, the semiconductor memory array includes bit lines, word lines and memory cells. The bit lines are arranged in parallel in a first direction, and the word lines are arranged in parallel in a second direction which is different from the first direction. The memory cells are arranged in an array and electrically connected to corresponding bit lines and word lines respectively, and any two memory cells adjacent to each other share a same oxide semiconductor layer as a channel layer. The present invention also relates to a semiconductor memory device including two memory cells sharing a same oxide semiconductor layer as a channel layer.

Abstract: The present invention provides a layout of a semiconductor transistor device including a first and a second active area, a first and a second gate, and a metal line. The first active and the second active area are extended along a first direction. The first gate and the second gate are extended along a second direction and crossed the first active area, to define two transistors. The two transistors are electrically connected with each other through a conductive layer. The metal line is disposed on the conductive layer and is electrically connected the two transistors respectively.

Abstract: A semiconductor device is provided in the present invention, which includes a substrate, an oxide-semiconductor layer, source/drain regions, a first dielectric layer covering on the oxide-semiconductor layer and the source/drain regions, a second gate between the two source/drain regions and partially covering the oxide-semiconductor layer, and a charge storage structure between the first gate electrode and the oxide-semiconductor layer.

Abstract: A layout of a semiconductor device includes a first active area, a second active area, plural gates, a first conductive layout and plural plugs. The first and the second active areas are disposed on a substrate and surrounded by a shallow trench isolation (STI). The plural gates are parallel with one another and cross the first and the second active areas. The first conductive layer covers the plural gates, and the plural gates are electrically connected to each other through the first conductive layer. The plural plugs are disposed on the first conductive layer to electrically connect the plural gates.

Abstract: A semiconductor device is provided in the present invention, which includes a substrate, an oxide-semiconductor layer, source/drain regions, a dielectric layer, a first gate electrode, a second gate electrode and a charge storage structure. The oxide-semiconductor layer is disposed on the first gate electrode on the substrate. The source/drain regions are disposed on the oxide-semiconductor layer. The first dielectric layer covers on the oxide-semiconductor layer and source/drain regions. A second gate electrode is disposed between source/drain regions and partially covers the oxide-semiconductor layer. The oxide-semiconductor layer may be optionally disposed between the first gate electrode and the oxide-semiconductor layer or be disposed on the second gate electrode.

Abstract: An oxide semiconductor device includes an oxide semiconductor transistor including a first gate electrode, a second gate electrode, a third gate electrode, a first oxide semiconductor channel layer, a second oxide semiconductor channel layer, and two source/drain electrodes. The second gate electrode is disposed above the first gate electrode. The third gate electrode is disposed above the second gate electrode. At least a part of the first oxide semiconductor channel layer is disposed between the first gate electrode and the second gate electrode. At least a part of the second oxide semiconductor channel layer is disposed between the second gate electrode and the third gate electrode. At least a part of each source/drain electrode is disposed between the first oxide semiconductor channel layer and the second oxide semiconductor channel layer. Each source/drain electrode contacts the first oxide semiconductor channel layer and the second oxide semiconductor channel layer.

Abstract: A semiconductor transistor device includes a substrate having an active area and a trench isolation region surrounding the active area, a gate oxide layer, a gate, a spacer on a sidewall of the gate, a doping region on one side of the gate, an insulating cap layer covering the gate, the spacer and the doping region, and a redistributed contact layer (RCL) on the insulating cap layer. The RCL extends from the active area to the trench isolation region. A contact plug is disposed above the trench isolation region and is electrically connected to the gate or the doping region through the RCL.

Abstract: A semiconductor array, the semiconductor memory array includes bit lines, word lines and memory cells. The bit lines are arranged in parallel in a first direction, and the word lines are arranged in parallel in a second direction which is different from the first direction. The memory cells are arranged in an array and electrically connected to corresponding bit lines and word lines respectively, and any two memory cells adjacent to each other share a same oxide semiconductor layer as a channel layer. The present invention also relates to a semiconductor memory device including two memory cells sharing a same oxide semiconductor layer as a channel layer.

Abstract: A semiconductor device is provided in the present invention, which includes a substrate, an oxide-semiconductor layer, source/drain regions, a dielectric layer, a first gate electrode, a second gate electrode and a charge storage structure. The oxide-semiconductor layer is disposed on the first gate electrode on the substrate. The source/drain regions are disposed on the oxide-semiconductor layer. The first dielectric layer covers on the oxide-semiconductor layer and source/drain regions. A second gate electrode is disposed between source/drain regions and partially covers the oxide-semiconductor layer. The oxide-semiconductor layer may be optionally disposed between the first gate electrode and the oxide-semiconductor layer or be disposed on the second gate electrode.

Abstract: An oxide semiconductor device and a method for manufacturing the same are provided in the present invention. The oxide semiconductor device includes a back gate, an oxide semiconductor film, a pair of source and drain electrodes, agate insulating film, a gate electrode on the oxide semiconductor film with the gate insulating film therebetween, an insulating layer covering only over the gate electrode and the pair of source and drain electrodes, and a top blocking film over the insulating layer.

Abstract: A semiconductor transistor device includes a substrate having an active area and a trench isolation region surrounding the active area, a gate oxide layer, a gate, a spacer on a sidewall of the gate, a doping region on one side of the gate, an insulating cap layer covering the gate, the spacer and the doping region, and a redistributed contact layer (RCL) on the insulating cap layer. The RCL extends from the active area to the trench isolation region. A contact plug is disposed above the trench isolation region and is electrically connected to the gate or the doping region through the RCL.

Abstract: An operating method of an image sensor includes the following steps. The image sensor includes at least one pixel unit. The pixel unit includes a photoelectric conversion unit, a first control unit, a capacitor unit, and a sensing unit. The photoelectric conversion unit includes a quantum film photoelectric conversion unit, and the first control unit includes an oxide semiconductor transistor. The capacitor unit is coupled to the first control unit, and the sensing unit is configured to sense signals at a sense point coupled between the first control unit and the sensing unit. The pixel unit is discharged before a readout operation. The capacitor unit is charged by electrons emitted from the photoelectric conversion unit when the photoelectric conversion unit is excited by light. Signals at the sense point are then sensed by the sensing unit.

Abstract: The present invention provides a semiconductor structure, includes a substrate, a dielectric layer disposed on the substrate, a first gate structure and a second gate structure disposed in the dielectric layer, a hard mask disposed in the dielectric layer, where the hard mask covers a sidewall of the first gate structure, and covers the second gate structure, and a contact structure disposed in the dielectric layer. The contact structure at least crosses over the hard mask. The contact structure includes a first contact portion and a second contact portion. The first contact portion contacts the first gate structure directly, the second contact portion contacts the substrate directly, and the hard mask is disposed between the first contact portion and the second contact portion.

Abstract: An operating method of an image sensor includes the following steps. The image sensor includes at least one pixel unit. The pixel unit includes a photoelectric conversion unit, a first control unit, a capacitor unit, and a sensing unit. The photoelectric conversion unit includes a quantum film photoelectric conversion unit, and the first control unit includes an oxide semiconductor transistor. The capacitor unit is coupled to the first control unit, and the sensing unit is configured to sense signals at a sense point coupled between the first control unit and the sensing unit. The pixel unit is discharged before a readout operation. The capacitor unit is charged by electrons emitted from the photoelectric conversion unit when the photoelectric conversion unit is excited by light. Signals at the sense point are then sensed by the sensing unit.

Abstract: A method of forming a semiconductor device includes following steps. Firstly, a first transistor is formed on a first surface of a substrate. Next, a thinning process is performed on the second surface of the substrate which is opposite to the first surface, to form a third surface. Then, a second transistor is formed on the third surface, in which the second transistor and the first transistor are electrically connected to each other through a through-silicon via penetrating through the first surface and the third surface.