Abstract: A circuit board assembly with a fully embedded photosensitive chip which does not require an increase in board width for the re-routing of wires around the photosensitive chip includes a circuit board and a reinforced plate at a lower elevation which is connected to the circuit board. The circuit board defines a through hole and a plurality of conductive lines. The conductive lines or the portion of them which are cut off by the location of the through hole accommodating the chip are repeated by connecting lines carried on the reinforced plate, the plurality of connecting lines connects to and continues the conductive lines which are cut off by the hole.

Abstract: A simple and integrated imaging device for housing motor-switchable and laterally-moving filters between a camera-lens holder and an imaging chip comprises the switchable filters in a cavity and a switching mechanism, and a driving mechanism are also in the cavity. The imaging chip is carried by a flexible printed circuit board. The driving mechanism connected to the switching mechanism drives the switching mechanism to slide back and forth underneath the camera-lens holder, so that either the first or the second switchable filter covers a through hole allowing light to fall on the imaging chip. An electronic device including the imaging device is also disclosed.

Abstract: A camera module includes a circuit board, a lens assembly, and a first board. The circuit board includes a first surface, a second surface opposite to the first surface, a first sidewall, and a second sidewall opposite to the first sidewall. Each of the first sidewall and the second sidewall connects the first surface to the second surface. The lens assembly is disposed on the first surface. The first board is connected to the first sidewall. The first board is inclined or perpendicular to the first surface. The first board is disposed on a side of the lens assembly.

Abstract: A lens protection structure comprising a main body configured for defining a receiving space by being attached to a lens module, the receiving space is configured for receiving a lens of the lens module, the main body is arranged with an air escape structure for communicating the receiving space and external environment, the air escape structure comprises: an air flow channel, a diversion connected in the air flow channel for diverting the airflow therethrough, and a retention connecting to the diversion for harvesting impurities and dust carried in air flow through the air escape structure. Therefore, the lens protection structure prevents the lens from being damaged in processing and transporting while provides communication between the receiving space and the external environment.

Abstract: A zoom lens assembly for periscope use which is effectively soundless in operation includes a lens barrel defined with a through hole, a plurality of optical lenses disposed within the through hole, and a focusing member disposed between any two of the plurality of optical lenses. The focusing member in a camera module includes a bottom plate, a cover plate, a piezoelectric element, and a variable transparent body. The variable transparent body is between the bottom plate and the cover plate, the piezoelectric element is disposed on a surface of the cover plate that faces away from the variable transparent body. Electricity fed to the piezoelectric element causes movement of the element which deforms the variable transparent body and changes the focal length of the camera module.

Abstract: A camera module includes a circuit board, a photosensitive chip, a filter, a l holder, and a lens assembly. A receiving groove is recessed from a surface of the circuit board. The photosensitive chip is received in the receiving groove. The holder is mounted on the surface of the circuit board and covers the photosensitive chip. The filter is mounted in the holder and spaced from the photosensitive chip. The lens assembly is mounted on the holder and located at a side of the filter facing away from the photosensitive chip. A dustproof layer is laid on the surface of the circuit board facing the filter and surrounds the photosensitive chip. An electronic device having the camera module is also provided.

Abstract: A camera module includes a circuit board, a photosensitive chip, a filter, a lens base, and a lens. The photosensitive chip is mounted on the circuit board. The lens base is mounted on the circuit board and receives the photosensitive chip therein. The filter is mounted in the lens base and positioned above the photosensitive chip. The lens is mounted in the lens base and positioned above the photosensitive chip. A dust-absorbing film is arranged in the lens base and located above the filter. An electronic device having the camera module is also provided.

Abstract: A simplified zoom lens module includes first to third lens units, first and second driving assemblies, and a housing. The lens units are arranged along an optical axis. The first driving assembly moves the second lens unit back and forth relative to the first lens unit, the second driving assembly moves the third lens unit back and forth relative to the second lens unit. The first driving assembly includes a first magnet which interacts with a second magnet, one being a permanent magnet, the other being an electromagnet. The first magnet is fixed inside the housing, the second magnet is fixed on the second lens unit. The first and second magnets are attracted to or repelled from each other by voltage and current fed to the electromagnet, thereby moving the lens and changing the focus of the lens module. A module and image-capturing device are also disclosed.

Abstract: A lens module with inbuilt shock-absorbency includes a carrier, a lens barrel arranged on the carrier, a lens assembly accommodated in the lens barrel, and an optical filter arranged on the carrier. The lens assembly includes a buffer member arranged on a bottom of the lens assembly facing the carrier, and a reinforcing member arranged on a side wall of the lens assembly facing the lens barrel. When the lens module is dropped or otherwise impacted, the buffer member reduces the shock of impact applied to the image sensor. The reinforcing member strengths the lens assembly, reducing a risk of loosening of the lens assembly.

Abstract: A camera module includes a mounting frame defining a first through hole, a filter installed in the first through hole, and a circuit board including a first surface and a second surface. The mounting frame is on the first surface. An air escaping channel is recessed from the second surface, an air escaping hole penetrates the first surface and the second surface and communicates with the air escaping channel. The circuit board, the mounting frame, and the filter cooperate with each other to form a first cavity, the first cavity communicates with the air escaping hole. The air escaping channel includes a first channel portion and a second channel portion, an angle is formed between the first channel portion and the second channel portion. The air escaping hole communicates with the first channel portion, the second channel portion extends to an edge of the circuit board to form an opening.

Abstract: A lens module of reduced size includes a circuit board, a mounting base, and electronic components. The mounting base is disposed on the circuit board, and includes a base plate and a first flange surrounding edges of the base plate. A portion of the bottom surface of the base plate includes a first area, a second area, a third area, and a fourth area. The first flange includes a first flange portion disposed on the first area and a second flange portion disposed on the second area. The electronic components are disposed on the circuit board, and disposed under at least one of the third area and the fourth area.

Abstract: A lens module of reduced size includes a base and an adhesive body. The base includes a first base portion and a second base portion located outside the first base portion. The first base portion is made of plastic and the second base portion is made of metal. The base further comprises a slot. The adhesive body is received in the slot and connects the first base portion and the second base portion. The disclosure also provides an electronic device having the lens module.

Abstract: A camera module includes a mounting frame defining a first through hole, a filter installed in the first through hole, and a circuit board including a first surface and a second surface. The mounting frame is on the first surface. An air escaping channel is recessed from the second surface, an air escaping hole penetrates the first surface and the second surface and communicates with the air escaping channel. The circuit board, the mounting frame, and the filter cooperate with each other to form a first cavity, the first cavity communicates with the air escaping hole. The air escaping channel includes a first channel portion and a second channel portion, an angle is formed between the first channel portion and the second channel portion. The air escaping hole communicates with the first channel portion, the second channel portion extends to an edge of the circuit board to form an opening.

Abstract: An impact- and vibration-proof lens module includes a fixing assembly, a circuit board, a lens assembly, and a buffering pad. The fixing assembly defines a chamber, and the circuit board is partially disposed in the chamber. The lens assembly is disposed on the circuit board, and the lens assembly is also partially disposed in the chamber. The buffering pad made of thermally conductive silicon is disposed in the chamber and is disposed between the circuit board and the fixing assembly. In the event of being dropped or suffering vibration, the buffering pad disperses and absorbs stress on the fixing assembly to prevent breakage.

Abstract: A lens module includes a circuit board, a base mounted on the circuit board, and at least one electronic component mounted on the circuit board. The base comprises a first surface and a second surface facing away from the first surface. The second surface is mounted on the circuit board. The base further comprises at least one first hole passing through the first surface and the second surface. The at least one electronic component is received in the at least one first hole. The lens module further comprises a filling layer in each of the at least one first hole and located on a side of the at least one electronic component facing away from the circuit board. The disclosure also provides an electronic device having the lens module.

Abstract: A lens module of reduced size includes a circuit board, a mounting base, and electronic components. The mounting base is disposed on the circuit board, and includes a base plate and a first flange surrounding edges of the base plate. A portion of the bottom surface of the base plate includes a first area, a second area, a third area, and a fourth area. The first flange includes a first flange portion disposed on the first area and a second flange portion disposed on the second area. The electronic components are disposed on the circuit board, and disposed under at least one of the third area and the fourth area.

Abstract: A camera module includes a circuit board, a photosensitive chip, a filter, a lens base, and a lens. The photosensitive chip is mounted on the circuit board. The lens base is mounted on the circuit board and receives the photosensitive chip therein. The filter is mounted in the lens base and positioned above the photosensitive chip. The lens is mounted in the lens base and positioned above the photosensitive chip. A dust-absorbing film is arranged in the lens base and located above the filter. An electronic device having the camera module is also provided.

Abstract: A camera module includes a circuit board, a photosensitive chip, a filter, a 1 holder, and a lens assembly. A receiving groove is recessed from a surface of the circuit board. The photosensitive chip is received in the receiving groove. The holder is mounted on the surface of the circuit board and covers the photosensitive chip. The filter is mounted in the holder and spaced from the photosensitive chip. The lens assembly is mounted on the holder and located at a side of the filter facing away from the photosensitive chip. A dustproof layer is laid on the surface of the circuit board facing the filter and surrounds the photosensitive chip. An electronic device having the camera module is also provided.

Abstract: A camera device includes a lens assembly, a substrate assembly, and a bearing assembly. The bearing assembly includes a bearing seat, a filter, and a first adhesive layer. A protrusion protrudes from a first side of the bearing seat. A second side of the bearing seat facing away from the first side of the bearing seat is connected to the lens assembly. A through groove penetrates the first side of the bearing seat and the second side of the bearing seat. The filter is received in the through groove. The first adhesive layer is formed on the protrusion to fix the protrusion on the substrate assembly. An electronic equipment is also provided.

Abstract: A camera module includes a circuit board, a mounting bracket disposed on the circuit board, an image sensor disposed on the circuit board and received in the mounting bracket, a first lens disposed in the mounting bracket, a driving mechanism disposed in the mounting bracket, and a second lens connected to the driving mechanism, and located between the image sensor and the first lens. The driving can drive the second lens to move between the first lens and the image sensor.