Abstract: A lens module includes a circuit board, a base mounted on the circuit board, and at least one electronic component mounted on the circuit board. The base comprises a first surface and a second surface facing away from the first surface. The second surface is mounted on the circuit board. The base further comprises at least one first hole passing through the first surface and the second surface. The at least one electronic component is received in the at least one first hole. The lens module further comprises a filling layer in each of the at least one first hole and located on a side of the at least one electronic component facing away from the circuit board. The disclosure also provides an electronic device having the lens module.

Abstract: A camera module with a strong and stable mounting which is geometrically precise includes a printed circuit board, an optical bearing structure, and an image sensor. The printed circuit board includes a mounting surface, the mounting surface defining a conductive circuit area and a surrounding non-conductive peripheral area. The peripheral area comprises a first contact layer, the first contact layer is frame-like and a size of the first contact layer is same as a size of bottom of the optical bearing structure. The optical bearing structure is on the first contact layer and carries a lens module. The image sensor is mounted on the conductive circuit area.

Abstract: A camera module comprises a circuit board and a base. A circuit board comprises a first surface and a second surface opposite to the first surface. At least one receiving groove is defined in the first surface. The receiving groove has not extended through the second surface. Each the at least one receiving groove receives an electronic component, and a height of the electronic component is less than a depth of the receiving groove. A base is fixed on the top surface. The at least one receiving groove is covered by the base to seal electronic components. A side surface of the base is aligned with a wall of the receiving groove.

Abstract: An encapsulation structure to protect an image sensor chip at all times includes a printed circuit board, an image sensor chip, a protecting structure, and a package portion. The image sensor chip is mounted on the printed circuit board and the protecting structure is mounted on the image sensor chip. The protecting structure comprises a filter sheet. The package portion is entirely opaque and is formed on the printed circuit board, wrapping side wall of the printed circuit board, side wall of the protecting structure, and a portion of surface of the filter sheet which is away from the image sensor chip.

Abstract: A camera module comprises a circuit board and a base. A circuit board comprises a first surface and a second surface opposite to the first surface. At least one receiving groove is defined in the first surface. The receiving groove has not extended through the second surface. Each the at least one receiving groove receives an electronic component, and a height of the electronic component is less than a depth of the receiving groove. A base is fixed on the top surface. The at least one receiving groove is covered by the base to seal electronic components. A side surface of the base is aligned with a wall of the receiving groove.

Abstract: A reduced size of camera module includes a camera lens, an optical filter, a sensor, an optical filter trestle, and a module trestle. The camera lens lies on a light path of the camera module towards the sensor. The camera lens is mounted on the optical filter trestle. The optical filter is received is the optical filter trestle. The optical filter trestle is mounted on the module trestle. The sensor is received in the in the module trestle.

Abstract: A reduced size of camera module includes a camera lens, an optical filter, a sensor, an optical filter trestle, and a module trestle. The camera lens lies on a light path of the camera module towards the sensor. The camera lens is mounted on the optical filter trestle. The optical filter is received is the optical filter trestle. The optical filter trestle is mounted on the module trestle. The sensor is received in the in the module trestle.