Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: A drone includes a drone body, a drone body battery provided in the drone body and responsible for supplying power to the drone body, a parachute kit detachably coupled to the drone body and including a parachute therein, a battery detector provided in the parachute kit and responsible for checking the state of the drone body battery, and a parachute controller for controlling the parachute kit depending on the state of the drone body battery detected by the battery detector.

Abstract: A selectively shielded and/or three-dimensional semiconductor device and a method of manufacturing thereof. For example and without limitation, various aspects of this disclosure provide a semiconductor device that comprises a composite plate for selective shielding and/or a three-dimensional embedded component configuration.

Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: A semiconductor device includes a first semiconductor die, a first encapsulant surrounding the first semiconductor die, and a first redistribution structure formed on the first semiconductor die and the first encapsulant. The semiconductor device further includes a second semiconductor die, a second encapsulant surrounding the second semiconductor die, and a second redistribution structure formed on the second semiconductor die and the second encapsulant. The semiconductor device also include a conductive via electrically connecting the first redistribution structure to the second redistribution structure.

Abstract: Disclosed is a composition for inhibiting the growth of virus. More particularly, the composition for inhibiting the growth of virus includes MDPX-V2021 represented by Formula 1, wherein MDPX-V2021 serves to inhibit a post-translational modification (PTM) stage in cells after SARS-CoV-2 penetrates into the body.

Abstract: Disclosed is a composition for inhibiting the growth of virus. More particularly, the composition for inhibiting the growth of virus includes MDPX-V2021 represented by Formula 1, wherein MDPX-V2021 serves to inhibit a post-translational modification (PTM) stage in cells after SARS-CoV-2 penetrates into the body.

Abstract: The present disclosure relates to a composition for preventing or treating metabolic diseases, the composition containing Artemisiae capillaris Herba and Citrus unshiu Peel complex extracts as active ingredients. Specifically, in the Artemisiae capillaris Herba and Citrus unshiu Peel complex extracts according to the present disclosure, the content of ingredients useful for prevention of metabolic diseases including obesity is much higher than in extracts obtained only from Artemisiae capillaris Herba. In addition, when a high-fat diet mouse model is administered the complex extracts, the levels of total cholesterol, LDL, and triglycerides in the blood are reduced. Accordingly, the complex extracts of the present disclosure may be used as a composition or functional material for preventing or treating metabolic diseases including obesity, hyperlipidemia, and hypercholesterolemia.

Abstract: The present disclosure relates to a drone including a drone body; a drone body battery provided in the drone body and responsible for supplying power to the drone body; a parachute kit detachably coupled to the drone body and including a parachute therein; a battery detector provided in the parachute kit and responsible for checking the state of the drone body battery; and a parachute controller for controlling the parachute kit depending on the state of the drone body battery detected by the battery detector, and to a parachute kit for drones. According to the present disclosure, the drone is configured so that, when the power of the parachute kit capable of being attached to or detached from the drone and the power of the drone body are cut off, the parachute is unfolded by spring elasticity or compressed air. Therefore, breakage of the drone may be prevented, and damage caused by drone crashes may be minimized.

Abstract: The present disclosure relates to a composition for preventing or treating metabolic diseases, the composition containing Artemisiae capillaris Herba and Citrus unshiu Peel complex extracts as active ingredients. Specifically, in the Artemisiae capillaris Herba and Citrus unshiu Peel complex extracts according to the present disclosure, the content of ingredients useful for prevention of metabolic diseases including obesity is much higher than in extracts obtained only from Artemisiae capillaris Herba. In addition, when a high-fat diet mouse model is administered the complex extracts, the levels of total cholesterol, LDL, and triglycerides in the blood are reduced. Accordingly, the complex extracts of the present disclosure may be used as a composition or functional material for preventing or treating metabolic diseases including obesity, hyperlipidemia, and hypercholesterolemia.

Abstract: A semiconductor device includes a first semiconductor die, a first encapsulant surrounding the first semiconductor die, and a first redistribution structure formed on the first semiconductor die and the first encapsulant. The semiconductor device further includes a second semiconductor die, a second encapsulant surrounding the second semiconductor die, and a second redistribution structure formed on the second semiconductor die and the second encapsulant. The semiconductor device also include a conductive via electrically connecting the first redistribution structure to the second redistribution structure.

Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: Disclosed is a semiconductor device including a conductive shield layer formed within a cavity of a molding part and a manufacturing method thereof. Various aspects of the present invention, for example and without limitation, includes a semiconductor device including a conductive shield layer formed along the wall of a cavity to of a molding part to improve EMI shielding performance, and a manufacturing method thereof.

Abstract: In one embodiment, a microfluidic sensor device includes microfluidic sensor mounted on and electrically connected a micro lead frame substrate. The microfluidic sensor is molded to form a package body. The package body includes a molded panel portion and, in some embodiments, a mask portion having one or more open channels, sealed channels, and/or a sealed chamber exposing an active surface of the microfluidic sensor. The molded panel portions and mask portions are configured to allow a material to dynamically or statically contact the microfluidic sensor for analysis.

Abstract: In one embodiment, a semiconductor package includes a first semiconductor die having a first surface facing upwardly to expose a bond pad, a second semiconductor die having a first surface facing downwardly to expose a bond pad and disposed to be offset with the first surface of the first semiconductor die, and an encapsulant encapsulating the first semiconductor die and the second semiconductor die together. Throughholes are disposed in the encapsulant adjacent the bond pad of the first semiconductor die and adjacent the bond pad of the second semiconductor die.

Abstract: A selectively shielded and/or three-dimensional semiconductor device and a method of manufacturing thereof. For example and without limitation, various aspects of this disclosure provide a semiconductor device that comprises a composite plate for selective shielding and/or a three-dimensional embedded component configuration.

Abstract: In one embodiment, a semiconductor package includes a first semiconductor die having a first surface facing upwardly to expose a bond pad, a second semiconductor die having a first surface facing downwardly to expose a bond pad and disposed to be offset with the first surface of the first semiconductor die, and an encapsulant encapsulating the first semiconductor die and the second semiconductor die together. Throughholes are disposed in the encapsulant adjacent the bond pad of the first semiconductor die and adjacent the bond pad of the second semiconductor die.

Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: In one embodiment, a microfluidic sensor device includes microfluidic sensor mounted on and electrically connected a micro lead frame substrate. The microfluidic sensor is molded to form a package body. The package body includes a molded panel portion and, in some embodiments, a mask portion having one or more open channels, sealed channels, and/or a sealed chamber exposing an active surface of the microfluidic sensor. The molded panel portions and mask portions are configured to allow a material to dynamically or statically contact the microfluidic sensor for analysis.