Patents by Inventor Do Hyung Kim
Do Hyung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240127587Abstract: Disclosed herein is a method for integrated anomaly detection. The method includes detecting a thing object and a human object in input video using a first neural network, and tracking the human object, and detecting an anomalous situation based on an object detection result and a human object tracking result.Type: ApplicationFiled: October 2, 2023Publication date: April 18, 2024Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Do-Hyung KIM, Ho-Beom JEON, Hyung-Min KIM, Jae-Hong KIM, Jeong-Dan CHOI
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Patent number: 11951722Abstract: A display device includes a display panel comprises a display area and a non-display area surrounding the display area; a cover panel disposed on a rear surface of the display panel and comprising a front surface, a first side surface connected to the front surface and bent along a first bending line, a second side surface connected to the front surface and bent along a second bending line intersecting the first bending line, and a first corner located between the first side surface and the second side surface; and an alignment notch defined at the first corner of the cover panel.Type: GrantFiled: May 12, 2021Date of Patent: April 9, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Dae Hyun Hwang, Won Ju Kim, Do Hyung Ryu, Wu Hyeon Jung
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Publication number: 20240079280Abstract: There is provided a nonvolatile memory device having improved crack detection reliability. The nonvolatile memory device comprises word lines that extend in a first direction, cell contact plugs that are electrically connected to the word lines and extend in a second direction intersecting the first direction, a net crack detection circuit that is on the word lines and is not in contact with the word lines, and a ring crack detection circuit that is on the word lines and is not in contact with the word lines, wherein the net crack detection circuit is electrically connected to a crack detection transistor in a peripheral circuit region, the ring crack detection circuit includes a first crack detection metal wiring that extends in a third direction intersecting the first direction and the second direction, and a second crack detection metal wiring that extends in the third direction.Type: ApplicationFiled: May 24, 2023Publication date: March 7, 2024Inventors: Do Hyung Kim, Ji Young Kim, Ji Won Kim, Suk Kang Sung, Woo Sung Yang
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Publication number: 20240066564Abstract: Proposed are a substrate processing apparatus and a substrate processing method capable of efficiently preventing contamination of a substrate and a processing space caused by a reverse flow of purge gas.Type: ApplicationFiled: March 27, 2023Publication date: February 29, 2024Applicant: SEMES CO., LTD.Inventors: Do Hyung KIM, Dae Hun KIM, Young Jin KIM, Tae Ho KANG, Young Joon HAN, Eun Hyeok CHOI, Jun Gwon LEE
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Patent number: 11915782Abstract: An electronic device including a memory device with improved reliability is provided. The semiconductor device comprises a data pin configured to transmit a data signal, a command/address pin configured to transmit a command and an address, a command/address receiver connected to the command/address pin, and a computing unit connected to the command/address receiver, wherein the command/address receiver receives a first command and a first address from the outside through the command/address pin and generates a first instruction on the basis of the first command and the first address, and the computing unit receives the first instruction and performs computation based on the first instruction.Type: GrantFiled: August 20, 2021Date of Patent: February 27, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chang Min Lee, Nam Hyung Kim, Dae Jeong Kim, Do Han Kim, Min Su Kim, Deok Ho Seo, Won Jae Shin, Yong Jun Yu, Il Gyu Jung, In Su Choi
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Publication number: 20240050990Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having a treating space; a support unit configured to support a substrate in the treating space; and a brush unit configured to clean the substrate supported on the support unit, and wherein the brush unit includes: a body having a circular-shaped cross-section; and a plurality of contact pads protruding from the body and defining a plurality of groove portions for discharging foreign substances dropped from a substrate, each groove portion defined between adjacent contact pads, and wherein a width of the groove portion near a center of the body is different from a width of the groove portion near an edge of the body.Type: ApplicationFiled: February 15, 2023Publication date: February 15, 2024Applicant: SEMES CO., LTD.Inventors: Do Hyung Kim, Dae Hun Kim, Young Jin Kim, Tae Ho Kang, Jun Gwon Lee, Young Joon Han, Eun Hyeok Choi
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Patent number: 11901332Abstract: A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.Type: GrantFiled: June 7, 2021Date of Patent: February 13, 2024Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Yeong Beom Ko, Jin Han Kim, Dong Jin Kim, Do Hyung Kim, Glenn Rinne
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Patent number: 11895287Abstract: Disclosed are an electronic device generating a multi-plane image of an arbitrary viewpoint and an operating method thereof. The electronic device includes a memory that stores a plurality of images, and at least one processor that executes a machine learning-based multi-plane image generating module generating an image of an arbitrary viewpoint from the plurality of images stored in the memory. When the multi-plane image generating module is executed, the processor selects at least two images from the plurality of images, by performing geometric calibration on the plurality of images, calculates a plane sweep volume including at least two layer images, performs an operation of a deep neural network to generate a plurality of multi-plane images having probability values, and generates the image of the arbitrary viewpoint by composing the plurality of multi-plane images and stores the image of the arbitrary viewpoint in the memory.Type: GrantFiled: October 28, 2021Date of Patent: February 6, 2024Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Seongjin Park, Do Hyung Kim
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Publication number: 20240019101Abstract: A lighting apparatus for a vehicle may include a lamp housing part mounted on a vehicle body, a projection optical system disposed within the lamp housing part and configured to radiate light, and a reflection part rotatably disposed in a light path of the light that is radiated by the projection optical system and configured to reflect, toward a lighting-up surface of the vehicle, the light that is radiated by the projection optical system.Type: ApplicationFiled: July 11, 2023Publication date: January 18, 2024Applicant: HYUNDAI MOBIS CO., LTD.Inventors: Chan Ho JOO, Do Hyung KIM, Ban Suk choi
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Publication number: 20240019096Abstract: A lighting device for a vehicle includes a center body unit, a driving lens unit disposed on first and second sides of the center body unit and configured to provide driving lighting, a grill lens unit disposed between the center body unit and the driving lens unit and configured to provide grill lighting, and a light source unit configured to selectively emit light to the driving lens unit and the grill lens unit.Type: ApplicationFiled: July 10, 2023Publication date: January 18, 2024Applicant: HYUNDAI MOBIS CO., LTD.Inventors: Do Hyung KIM, Seung Woo BAEK
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Publication number: 20240017665Abstract: A vehicular active spoiler-type lighting device and a vehicular active spoiler-type lighting method includes an insertion recess formed in a vehicle body, an air current adjustment module inserted into the insertion recess and protruding out of the insertion recess, thereby changing a direction of air current flowing along a surface of the vehicle body, a drive module mounted in the insertion recess, connected to the air current adjustment module, and configured to insert the air current adjustment module into the insertion recess or to pull the air current adjustment module out of the insertion recess, and a lamp module configured to provide lighting to the air current adjustment module.Type: ApplicationFiled: July 10, 2023Publication date: January 18, 2024Applicant: HYUNDAI MOBIS CO., LTD.Inventor: Do Hyung KIM
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Publication number: 20240019097Abstract: A lighting apparatus for a vehicle may include a lamp housing part mounted on a vehicle body, a projection optical system disposed within the lamp housing part and configured to radiate light, and a reflection part rotatably disposed in a light path of the light radiated by the projection optical system and configured to reflect, toward a lighting-up surface of the vehicle, the light radiated by the projection optical system.Type: ApplicationFiled: July 11, 2023Publication date: January 18, 2024Applicant: HYUNDAI MOBIS CO., LTD.Inventors: Chan Ho JOO, Do Hyung KIM, Ban Suk CHOI
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Patent number: 11869879Abstract: A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the CSDS via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the CSDS via the second bond pad. The semiconductor package may further include a metal post electrically coupled to the first surface of the CSDS, and a first encapsulant material encapsulating side surfaces and a surface opposite the first die surface of the first semiconductor die, the metal post, and a portion of the first surface of the CSDS.Type: GrantFiled: October 13, 2022Date of Patent: January 9, 2024Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Do Hyung Kim, Jung Soo Park, Seung Chul Han
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Publication number: 20230418743Abstract: A data storage device may include a storage and a controller. The storage a storage including a first region of a first physical address range and a second region of a second physical address range. The controller may generate map data including a plurality of map segments, a first segment entry and a second segment entry, and store, in the second region, the map data except for a first map segment. Each of the map segments includes a set of physical addresses corresponding to a plurality of sequential logical addresses. The first segment entry includes a first segment physical address associated with the first map segment and belonging to the first physical address range, and the second segment entry includes a second segment physical address associated with a second map segment and belonging to the second physical address range.Type: ApplicationFiled: September 13, 2023Publication date: December 28, 2023Inventors: Do Hyung KIM, Chi Heon KIM, Joo Young Lee, Hoe Seung JUNG, Hye Mi KANG
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Publication number: 20230403854Abstract: According to some implementations of the present disclosure, a semiconductor memory device includes a semiconductor layer including a first face and a second face opposite to the first face in a first direction directed upward from the first face to the second face; a source structure including: a plate disposed on the second face of the semiconductor layer; and a plug extending from the plate through the semiconductor layer; a plurality of gate electrodes disposed on the first face of the semiconductor layer and sequentially stacked on one an other; and a channel structure that extends through the plurality of gate electrodes and that is disposed on the plug, wherein the channel structure is electrically connected to the source structure.Type: ApplicationFiled: March 8, 2023Publication date: December 14, 2023Inventors: Ji Young Kim, Do Hyung Kim, Ji Won Kim, Suk Kang Sung
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Publication number: 20230400165Abstract: A mobile lighting device includes a housing unit inserted into a vehicle body, a light source unit mounted in the housing unit and configured to generate light, a lens unit mounted in the housing unit and configured to transmit the light generated in the light source unit, and a drive unit configured to move the housing unit in such a manner that the lens unit is selectively inserted into y or protrudes out of the vehicle body.Type: ApplicationFiled: December 23, 2022Publication date: December 14, 2023Applicant: HYUNDAI MOBIS CO., LTD.Inventor: Do Hyung KIM
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Patent number: 11840760Abstract: In a layer deposition method, a substrate is loaded into a process chamber. A gas filling tank is charged with a gas to a predetermined charge pressure. The pressure of the gas is elevated to a pressure greater than the predetermined charge pressure. The gas is introduced into the process chamber.Type: GrantFiled: December 3, 2018Date of Patent: December 12, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Shin-Jae Kang, Dong-Hoon Han, Do-Hyung Kim, Kyung-Wook Park, Kevin Bae, Sun-Soo Lee, In-Jae Lee, Jeon-Il Lee, Chae-Mook Lim
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Publication number: 20230371237Abstract: A semiconductor device and a method of fabricating a semiconductor device, the device including a substrate including an element isolation film and an active region defined by the element isolation film; a word line crossing the active region in a first direction; and a bit line structure on the substrate and connected to the active region, the bit line structure extending in a second direction crossing the first direction, wherein the bit line structure includes a first cell interconnection film including an amorphous material or ruthenium, a second cell interconnection film on and extending along the first cell interconnection film and including ruthenium, and a cell capping film on and extending along the second cell interconnection film.Type: ApplicationFiled: July 27, 2023Publication date: November 16, 2023Inventors: Eun Young LEE, Do Hyung KIM, Taek Jung KIM, Seung Jong PARK, Jae Wha PARK, Youn Jae CHO
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Patent number: 11813975Abstract: A lighting apparatus for a vehicle may include: a housing installed inside the front of a vehicle and formed one side thereof with an opening, a plurality of light emitting units installed inside the housing and configured to emit light toward the opening, and a plurality of flap units rotatably installed in the housing, disposed to face the plurality of light emitting units, and configured to open or close the opening.Type: GrantFiled: December 6, 2022Date of Patent: November 14, 2023Assignee: HYUNDAI MOBIS CO., LTD.Inventors: Do Hyung Kim, Soon Mo Lee, Moo Kwan Kim
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Publication number: 20230357956Abstract: A method of forming single crystal perovskite according to an exemplary embodiment of the present invention includes: forming a preliminary thin film by applying a perovskite precursor solution containing an additive on a substrate; exposing the preliminary thin film to a vacuum state by transferring the preliminary thin film to a vacuum chamber; and switching an internal pressure of the vacuum chamber to an atmospheric pressure, wherein the additive includes a substituted or unsubstituted C1 to C30 aliphatic ammonium salt, a substituted or unsubstituted C6 to C30 aromatic ammonium salt, a substituted or unsubstituted C1 to C30 aliphatic amine salt, a substituted or unsubstituted C6 to C30 aromatic amine salt, or a combination thereof.Type: ApplicationFiled: November 8, 2022Publication date: November 9, 2023Inventors: Do Hyung KIM, Hyun Shil KIM, JAE SEOB YOO, Yu Jin KANG