Patents by Inventor Do Hyung Kim

Do Hyung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230077103
    Abstract: Disclosed herein are a cloud server, an edge server, and a method for generating an intelligence model using the same. The method for generating an intelligence model includes receiving, by the edge server, an intelligence model generation request from a user terminal, generating an intelligence model corresponding to the intelligence model generation request, and adjusting the generated intelligence model.
    Type: Application
    Filed: June 9, 2022
    Publication date: March 9, 2023
    Inventors: Min-Su JANG, Do-Hyung KIM, Jae-Hong KIM, Woo-Han YUN
  • Publication number: 20230053151
    Abstract: Disclosed herein are an apparatus and method for classifying clothing attributes based on deep learning. The apparatus includes memory for storing at least one program and a processor for executing the program, wherein the program includes a first classification unit for outputting a first classification result for one or more attributes of clothing worn by a person included in an input image, a mask generation unit for outputting a mask tensor in which multiple mask layers respectively corresponding to principal part regions obtained by segmenting a body of the person included in the input image are stacked, a second classification unit for outputting a second classification result for the one or more attributes of the clothing by applying the mask tensor, and a final classification unit for determining and outputting a final classification result for the input image based on the first classification result and the second classification result.
    Type: Application
    Filed: October 7, 2021
    Publication date: February 16, 2023
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Chan-Kyu PARK, Do-Hyung KIM, Jae-Hong KIM, Jae-Yeon LEE, Min-Su JANG
  • Publication number: 20230031664
    Abstract: An automotive crash pad and a method for manufacturing the same. The automotive crash pad includes: a skin layer forming the outer surface of the crash pad including an airbag module; a fiber-based layer formed on the lower surface of the skin layer; a cushion layer formed on the lower surface of the fiber-based layer and including slab foam; and a core layer formed on the lower surface of the cushion layer, wherein a laminate of the skin layer and the fiber-based layer has a tensile strength in a transverse direction (TD) of 5 to 50 kgf/3 cm and an elongation at break in the transverse direction (TD) of 40 to 220%.
    Type: Application
    Filed: September 21, 2022
    Publication date: February 2, 2023
    Inventors: Do Hyung Kim, Chang Wan Son
  • Publication number: 20220396198
    Abstract: A control method of a lighting apparatus for a vehicle may include: sensing, by a sensing unit, a distance between the vehicle and a pedestrian; determining, by a control unit, whether the distance between the vehicle and the pedestrian falls within a first distance; determining, by the control unit, a walking direction of the pedestrian when the distance between the vehicle and the pedestrian falls within the first distance; and indicating, by the control unit, the walking direction to the pedestrian by operating a plurality of flap units.
    Type: Application
    Filed: June 8, 2022
    Publication date: December 15, 2022
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventors: Do Hyung KIM, Soon Mo LEE, Moo Kwan KIM
  • Publication number: 20220371507
    Abstract: A lighting apparatus for a vehicle may include: a housing installed inside the front of a vehicle and formed one side thereof with an opening, a plurality of light emitting units installed inside the housing and configured to emit light toward the opening, and a plurality of flap units rotatably installed in the housing, disposed to face the plurality of light emitting units, and configured to open or close the opening.
    Type: Application
    Filed: January 4, 2022
    Publication date: November 24, 2022
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventors: Do Hyung KIM, Soon Mo LEE, Moo Kwan KIM
  • Patent number: 11476233
    Abstract: A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the CSDS via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the CSDS via the second bond pad. The semiconductor package may further include a metal post electrically coupled to the first surface of the CSDS, and a first encapsulant material encapsulating side surfaces and a surface opposite the first die surface of the first semiconductor die, the metal post, and a portion of the first surface of the CSDS.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: October 18, 2022
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Do Hyung Kim, Jung Soo Park, Seung Chul Han
  • Publication number: 20220292709
    Abstract: A method for calculating a position of a dart pin attached to a dart board divided into a plurality of segments in an apparatus for calculating a position of a dart pin is provided. The method includes obtaining a plurality of optical data from a plurality of optical devices corresponding to at least one of a plurality of holes formed in each segment and installed on the rear surface of the dart board; and calculating a position of a dart pin attached to the dart board using the plurality of optical data.
    Type: Application
    Filed: March 14, 2022
    Publication date: September 15, 2022
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventor: Do Hyung KIM
  • Publication number: 20220288717
    Abstract: The present disclosure discloses a pipe welding ring and a pipe welding method using the same. The disclosed pipe welding ring is a plate-type welding ring which is disposed between two corresponding pipes to join the pipes, comes in contact with a welding surface of each of the pipes, and joins the pipes when melted by heating with a welding torch, and the disclosed pipe welding method includes a welding ring placing operation in which the welding ring is disposed between a first pipe and a second pipe to be joined with each other, a centering operation in which, while the center of the welding ring is aligned with the center of the first pipe and the second pipe, the first pipe and the second pipe are brought into close contact with the welding ring to support the welding ring, and a welding operation in which a welding torch is used to heat the welding ring.
    Type: Application
    Filed: March 8, 2022
    Publication date: September 15, 2022
    Inventors: DO HYUNG KIM, SUNG MOK RYU, BONG JU KIM
  • Publication number: 20220285135
    Abstract: Disclosed herein is a substrate processing apparatus capable of adjusting positions of first and second electrodes in advance in consideration of the difference in thermal expansion in order to prevent a short-circuit from occurring due to the contact between the first and second electrodes even if the first and second electrodes are thermally expanded during the process. The substrate processing apparatus is advantageous in that it can prevent the short-circuit between the first and second electrodes even if the first and second electrodes are thermally expanded due to the increase in temperature during the process and can maintain the uniformity of a thin film in the large-area substrate processing apparatus.
    Type: Application
    Filed: July 9, 2020
    Publication date: September 8, 2022
    Inventors: Woong Kyo OH, Young Woon KIM, Kwang Su YOO, Do Hyung KIM, Yun Gyu HA
  • Publication number: 20220262753
    Abstract: A semiconductor device with thin redistribution layers is disclosed and may include forming a first redistribution layer on a dummy substrate, electrically coupling a semiconductor die to the first redistribution layer, and forming a first encapsulant layer on the redistribution layer and around the semiconductor die. The dummy substrate may be removed thereby exposing a second surface of the first redistribution layer. A dummy film may be temporarily affixed to the exposed second surface of the redistribution layer and a second encapsulant layer may be formed on the exposed top surface of the semiconductor die, a top surface and side edges of the first encapsulant layer, and side edges of the first redistribution layer. The dummy film may be removed to again expose the second surface of the first redistribution layer, and a second redistribution layer may be formed on the first redistribution layer and on the second encapsulant layer.
    Type: Application
    Filed: March 8, 2022
    Publication date: August 18, 2022
    Inventors: Dong Hoon Lee, Do Hyung Kim, Seung Chul Han
  • Patent number: 11405547
    Abstract: Disclosed herein is a method for operating an apparatus for generating an all-in-focus image. The method may include generating a focus-map-calculating model through deep learning for images having different focuses and a reference all-in-focus image corresponding thereto, calculating a focus map for each of multi-focus images, which are captured by a camera, using the focus-map-calculating model, and generating an all-in-focus image for the multi-focus images using the focus map.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: August 2, 2022
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Seong-Jin Park, Do-Hyung Kim, Jae-Woo Kim, Seong-Jun Bae, Ho-Wook Jang
  • Publication number: 20220235356
    Abstract: Provided are an aptamer specifically binding to KRAS protein, and a method of using the same. An aptamer of one aspect has excellent binding affinity to KRAS, which is a major factor regulating a cell growth signaling system in vivo, to inhibit binding between KRAS mutant in cancer cells and a Raf-1 kinase protein which is a downstream protein constituting the cell growth signaling system, thereby effectively suppressing cancer cell growth and cancer development. Further, the aptamer may specifically bind to KRAS in cancer cells, and thus may be widely applied to a pharmaceutical composition for treating or preventing cancer, a diagnostic agent, a reagent, etc.
    Type: Application
    Filed: July 9, 2020
    Publication date: July 28, 2022
    Inventors: Ho Young KANG, Do Hyung KIM, Kyoung Ryoung PARK, Seol Hwa BAEK
  • Patent number: 11397041
    Abstract: A refrigerator and a method for controlling the same. The refrigerator includes a main body; a first storage chamber and a second storage chamber provided in the main body; a first evaporator provided in the first storage chamber, configured to generate cool air; a second evaporator provided in the second storage chamber, configured to generate the cool air; a switching valve configured to supply a refrigerant to at least one of the first evaporator or the second evaporator; and a controller configured to generate a control signal for controlling the switching valve so that the refrigerant supplied to at least one of the first evaporator or the second evaporator is distributed according to a predetermined reference, and lower the temperature of the first storage chamber and the second storage chamber to a predetermined temperature based on the generated control signal.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: July 26, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Do-Hyung Kim, Su-Cheol Yoo, Jung Woo Yoo, Kook Jeong Seo, Chang-Hern Lee, Ha-Jin Jeong
  • Patent number: 11378249
    Abstract: A head lamp for a vehicle includes: a lamp housing; a light source disposed in the lamp housing and configured to emit light to a forward area of a vehicle; a bezel disposed on the lamp housing, spaced apart from the light source, and shaped to cover the light source; and a plurality of flip-dot units disposed in the bezel. Each flip-dot unit among the plurality of flip-dot units includes: a housing having an opening formed on one side the housing, and a space formed in the housing; and a flip disk rotatably installed in the housing and configured to selectively open and close the opening.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: July 5, 2022
    Assignee: HYUNDAI MOBIS CO., LTD.
    Inventors: Do Hyung Kim, Tae Kyoung Jin, Moo Kwan Kim
  • Publication number: 20220173108
    Abstract: A semiconductor device and a method of fabricating a semiconductor device, the device including a substrate including an element isolation film and an active region defined by the element isolation film; a word line crossing the active region in a first direction; and a bit line structure on the substrate and connected to the active region, the bit line structure extending in a second direction crossing the first direction, wherein the bit line structure includes a first cell interconnection film including an amorphous material or ruthenium, a second cell interconnection film on and extending along the first cell interconnection film and including ruthenium, and a cell capping film on and extending along the second cell interconnection film.
    Type: Application
    Filed: July 12, 2021
    Publication date: June 2, 2022
    Inventors: Eun Young LEE, Do Hyung KIM, Taek Jung KIM, Seung Jong PARK, Jae Wha PARK, Youn Jae CHO
  • Publication number: 20220165582
    Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.
    Type: Application
    Filed: December 6, 2021
    Publication date: May 26, 2022
    Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
  • Publication number: 20220158030
    Abstract: A method of manufacturing a light-emitting element, and a light-emitting element array substrate and a display device including the same are provided. A method of manufacturing a light-emitting element includes: forming a base substrate including a plurality of protrusions and a rod area which is a remaining area except for the plurality of protrusions; forming a buffer layer on the base substrate; forming a semiconductor structure including a first semiconductor material layer, a light-emitting material layer, and a second semiconductor material layer on the buffer layer; forming a plurality of mask patterns overlapping the rod area on the semiconductor structure; forming element rods by removing the semiconductor structure overlapping the plurality of protrusions using the plurality of mask patterns; forming an insulating film around an outer surface of each of the element rods. and separating the element rods from the buffer layer.
    Type: Application
    Filed: September 20, 2021
    Publication date: May 19, 2022
    Inventors: Mi Hyang SHEEN, Ki Young YEON, Do Hyung KIM, Kyung Lae RHO, Na Ri AHN
  • Patent number: 11327592
    Abstract: A display device that is capable of being manufactured through a simplified process and at reduced cost is disclosed. The display device is configured such that a plurality of grouped cathode electrodes and a plurality of grouped black matrices intersect each other in the state in which an encapsulation unit is disposed therebetween in order to form a touch sensor, so that a process of forming first and second touch electrodes is omitted and a separate adhesion process becomes unnecessary, whereby structural simplification is achieved while costs are reduced.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: May 10, 2022
    Assignee: LG Display Co., Ltd.
    Inventors: Saemleenuri Lee, Joon-Suk Lee, Do-Hyung Kim, Seung-Han Paek, Seong-Woo Park, Seung-Won Yoo
  • Patent number: 11304044
    Abstract: Disclosed herein are a Bluetooth connection device and method based on estimation of a relative angle. The Bluetooth connection method based on estimation of a relative angle is performed by a Bluetooth connection device based on estimation of a relative angle, and includes estimating relative angles using relative angle estimation information included in packets received from one or more communication target devices that are scanned for a Bluetooth connection, determining a communication target device with which a communication link is to be established based on the estimated relative angles, and establishing a communication link through a Bluetooth connection to the determined communication target device, and reestablishing the communication link to any one of additional communication target devices, relative angles of which have been estimated, depending on a change in a relative angle to the communication target device with which the communication link has been established.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: April 12, 2022
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jae-Ho Lee, Do-Hyung Kim, Jin-Kyeong Kim, Cheol Ryu, Hyung-Seok Lee
  • Patent number: 11296088
    Abstract: Disclosed are a semiconductor device capable of reducing parasitic capacitance between adjacent conductive structures and a method for fabricating the same. The semiconductor device includes a plurality of bit line structures each comprising a first contact plug formed over a substrate and a bit line formed over the first contact plug. A spacer structure having air gaps is formed on sidewalls of the first contact plug and on sidewalls of the bit line. An plug isolation layer is formed between the plurality of bit line structures. The isolation layer includes an opening. A second contact plug is formed in the opening and a memory element is formed over the second contact plug.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: April 5, 2022
    Assignee: SK hynix Inc.
    Inventors: Chang-Youn Hwang, Noh-Jung Kwak, Hong-Gu Yi, Yun-Je Choi, Se-Han Kwon, Ki-Soo Choi, Seung-Bum Kim, Do-Hyung Kim, Doo-Sung Jung, Dae-Sik Park