Patents by Inventor Dominik Heiss

Dominik Heiss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240404774
    Abstract: A switch device includes a phase change switch and a memory for storing a target state of the phase change switch. A controller determines a phase state of the phase change switch, and, if the state of the phase change switch does not correspond to the target state, controls a heater of the phase change switch to change the state of the phase changes switch to the target state.
    Type: Application
    Filed: August 12, 2024
    Publication date: December 5, 2024
    Inventors: Hans Taddiken, Dominik Heiss, Christoph Kadow
  • Patent number: 12156488
    Abstract: A method includes providing a substrate having a main surface, forming a layer of thermally insulating material on the main surface, forming strips of phase change material on the layer of thermally insulating material such that strips of phase change material are separated from the main surface by thermally insulating material, forming first and second RF terminals on the main surface that are laterally spaced apart from one another and connected to the strips of phase change material, and forming a heater structure having heating elements that are configured to control a conductive connection between the first and second RF terminals by applying heat to the one or more strips of phase change material, wherein each of the strips of phase change material includes multiple outer faces, and wherein portions of both outer faces from the strips of phase change material are disposed against one of the heating elements.
    Type: Grant
    Filed: December 21, 2022
    Date of Patent: November 26, 2024
    Assignee: Infineon Technologies AG
    Inventors: Dominik Heiss, Martin Bartels, Christoph Glacer, Christoph Kadow, Matthias Markert, Hans Taddiken, Hans-Dieter Wohlmuth
  • Patent number: 12151571
    Abstract: An adapter system for the electrical connection of a connector of a cabling to different contact arrangements of different charging sockets along a connection axis includes an adapter housing and a fastening element attaching the adapter housing to one of the charging sockets. The adapter housing has a contact surface extending perpendicularly to the connection axis and a plurality of contact openings extending along the connection axis. The contact surface is disposed at an end of the adapter housing on a socket side. An end of the adapter housing on a cable side has a cabling interface connecting to the connector. The end of the adapter housing on the socket side is attachable to each of the charging sockets by the fastening element with the contact surface in a predetermined rotational position relative to the connection axis.
    Type: Grant
    Filed: June 9, 2022
    Date of Patent: November 26, 2024
    Assignee: TE Connectivity Germany GmbH
    Inventors: Dirk Weyrauch, Philipp Kowarsch, Dominik Heiss
  • Patent number: 12088049
    Abstract: A high current contact device for transmitting electric energy includes a contact housing, a first contact element arranged in the contact housing, the first contact element extends at least in portions along a mating axis, and a temperature measuring device having a circuit carrier with a first temperature sensor and a first heat conducting path. The first temperature sensor is arranged on the circuit carrier and the circuit carrier is arranged laterally adjacent to the first contact element. The first heat conducting path has a first heat conducting element that is elastic and heat conductive with a contact surface. The contact surface abuts against a first outer circumferential side of the first contact element. The first heat conducting element thermally couples the first contact element to the first temperature sensor. The first temperature sensor measures a temperature of the first contact element.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: September 10, 2024
    Assignee: TE Connectivity Germany GmbH
    Inventors: Sebastian Zabeck, Alexander Mueller, Sandeep Giri, Philipp Kowarsch, Dominik Heiss, Tobias Meissner
  • Patent number: 12068123
    Abstract: A switch device includes a phase change switch and a memory for storing a target state of the phase change switch. A controller determines a phase state of the phase change switch, and, if the state of the phase change switch does not correspond to the target state, controls a heater of the phase change switch to change the state of the phase changes switch to the target state.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: August 20, 2024
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Hans Taddiken, Dominik Heiss, Christoph Kadow
  • Publication number: 20240145253
    Abstract: A device includes a thinned semiconductor substrate having a first side and a second side opposite to the first side; and at least one radio frequency device at the first side, wherein the second side of the thinned semiconductor substrate is processed to reduce leakage currents or to improve a radio frequency linearity of the at least one radio frequency device through Bosch etchin
    Type: Application
    Filed: January 9, 2024
    Publication date: May 2, 2024
    Inventors: Hans Taddiken, Christian Butschkow, Andrea Cattaneo, Henning Feick, Dominik Heiss, Christoph Kadow, Uwe Seidel, Valentyn Solomko, Anton Steltenpohl
  • Patent number: 11963466
    Abstract: A switch device including a semiconductor substrate is provided. A trench is formed in the substrate, and a phase change material is provided at least partially in the trench. A heater for heating the phase change material is also provided.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: April 16, 2024
    Assignee: Infineon Technologies AG
    Inventors: Dominik Heiss, Christoph Kadow, Matthias Markert
  • Publication number: 20240122081
    Abstract: A phase change switching device includes a substrate comprising a main surface, an RF input pad and a plurality of RF output pads disposed over the main surface, and phase change switch connections between the RF input pad and each of the RF output pads, wherein the phase change switch connections each include a phase change material and a heating element thermally coupled to the phase change material, wherein each of the RF output pads are arranged outside of an outer perimeter of the RF input pad, and wherein plurality of RF output pads at least partially surrounds the outer perimeter of the RF input pad.
    Type: Application
    Filed: October 7, 2022
    Publication date: April 11, 2024
    Inventors: Valentyn Solomko, Semen Syroiezhin, Dominik Heiss, Christian Butschkow, Jochen Braumueller
  • Patent number: 11948802
    Abstract: A device includes a thinned semiconductor substrate having a first side and a second side opposite to the first side; and at least one radio frequency device at the first side, wherein the second side of the thinned semiconductor substrate is processed to reduce leakage currents or to improve a radio frequency linearity of the at least one radio frequency device through Bosch etching.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: April 2, 2024
    Assignee: Infineon Technologies Dresden GmbH & Co. KG
    Inventors: Hans Taddiken, Christian Butschkow, Andrea Cattaneo, Henning Feick, Dominik Heiss, Christoph Kadow, Uwe Seidel, Valentyn Solomko, Anton Steltenpohl
  • Publication number: 20240079815
    Abstract: A housing includes a first partial housing and a second partial housing which complement each other in an assembled state to form the housing. The first partial housing has a first conductor receptacle that receives a first electrical conductor and a first connection assembly for connecting the first electrical conductor to a first contact element, and is provided with a passage opening for a second contact element. The second partial housing has a second conductor receptacle that receives a second electrical conductor and a second connection assembly for connecting the second electrical conductor to the second contact element. The second partial housing is configured to abut against the first partial housing in the region of the passage opening. In the assembled state, the second conductor receptacle forms a common cavity with the passage opening.
    Type: Application
    Filed: September 5, 2023
    Publication date: March 7, 2024
    Inventors: Ralf Schwan, Dominik Heiss, Mike Iskra
  • Publication number: 20240056072
    Abstract: In an embodiment, a phase change switch device is provided. The phase change switch includes a phase change material, a set of heaters arranged to heat the phase change material, and a switch arrangement. The switch arrangement includes a plurality of switches, and is configured to selectively provide electrical power to the set of the heaters.
    Type: Application
    Filed: October 27, 2023
    Publication date: February 15, 2024
    Inventors: Dominik Heiss, Christoph Kadow, Hans Taddiken
  • Publication number: 20240040803
    Abstract: An integrated circuit includes a transistor, a first metallization layer above the transistor and electrically connected to the transistor, and a phase change switch, wherein at least a part of the phase change switch is provided below the first metallization layer, wherein the first metallization layer is provided laterally adjacent to the phase change switch, wherein the phase change switch comprises a heater, and wherein the heater and a part of the transistor are each provided in a lower-level interconnect layer of the integrated circuit.
    Type: Application
    Filed: October 12, 2023
    Publication date: February 1, 2024
    Inventors: Hans Taddiken, Christoph Glacer, Dominik Heiss, Christoph Kadow
  • Publication number: 20240034162
    Abstract: A charging socket of an electric or hybrid vehicle is adapted to connect to a charging plug. The charging socket comprises a socket wall, and at least one heating module shaft extending into the socket wall and adapted to receive a heating module.
    Type: Application
    Filed: July 27, 2023
    Publication date: February 1, 2024
    Applicant: TE Connectivity Germany GmbH
    Inventors: Mike Iskra, Ralf Schwan, Dominik Heiss
  • Publication number: 20240032445
    Abstract: A phase change material switch device is provided. In one implementation, the phase change material switch device includes a phase change material and a heater device thermally coupled to the phase change material. During heating phases, a coupling device provides a first electrical impedance between a power source and the heater device. Outside the heating phases, the coupling device provides a second, higher, impedance.
    Type: Application
    Filed: July 14, 2023
    Publication date: January 25, 2024
    Inventors: Valentyn Solomko, Dominik Heiss, Hans Taddiken
  • Patent number: 11863168
    Abstract: In an embodiment, a phase change switch device is provided. The phase change switch includes a phase change material, a set of heaters arranged to heat the phase change material and a power source. A switch arrangement including a plurality of switches is provided, which is configured to selectively provide electrical power from the power source to the set of the heaters.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: January 2, 2024
    Assignee: Infineon Technologies AG
    Inventors: Dominik Heiss, Christoph Kadow, Hans Taddiken
  • Publication number: 20230389451
    Abstract: A method includes providing a semiconductor substrate comprising a main surface, forming a dielectric region on the main surface, forming a recess in the dielectric region, forming a strip of phase change material within the recess, forming a heating element that is thermally coupled to the strip of phase change material, forming an interconnection region over the main surface before or after forming the recess, the interconnection region including a metallization layer and a dielectric layer, electrically connecting the strip of phase change material to a connecting one of the metallization layers from the interconnection region, and completing formation of the interconnection region after electrically connecting the strip of phase change material, wherein completing formation of the interconnection region includes forming an outer one of the dielectric layers from the interconnection region that is disposed over the connecting one of the metallization layers and comprises a planar upper surface.
    Type: Application
    Filed: May 27, 2022
    Publication date: November 30, 2023
    Inventors: Dominik Heiss, Matthias Markert
  • Patent number: 11818900
    Abstract: An integrated circuit is provided. The integrated circuit includes a transistor, a first metallization layer above the transistor and electrically connected to the transistor, and a phase change switch. At least a part of the phase change switch is provided below the first metallization layer. The first metallization layer is provided laterally adjacent to the phase change switch. Moreover, a method is provided for manufacturing an integrated circuit. Further provided is a wafer for manufacturing an integrated circuit, and a method for manufacturing a wafer for manufacturing an integrated circuit.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: November 14, 2023
    Assignee: Infineon Technologies AG
    Inventors: Hans Taddiken, Christoph Glacer, Dominik Heiss, Christoph Kadow
  • Publication number: 20230356610
    Abstract: A plug cover hinge of a charging connection of an electric vehicle includes a cover or cover flap for selectively covering a socket or plug of the charging connection, and a four-joint hinge. The four-joint hinge defines two flap-side joints attached to the cover flap, and two fastening-side joints attachable to a frame. The four-joint hinge includes two joint elements, with each joint element connecting one of the flap-side joints to one of the fastening-side joints.
    Type: Application
    Filed: May 4, 2023
    Publication date: November 9, 2023
    Applicant: TE Connectivity Germany GmbH
    Inventors: Ralf Schwan, Dominik Heiss, Mike Iskra, Talat Salman
  • Publication number: 20230343531
    Abstract: A phase change material switch device is provided. The phase change material switch device includes a phase change material, a first electrode electrically coupled to the phase change material, and at least one heater thermally coupled to the phase change material. An equalization device is configured to provide an impedance coupling between the first electrode and the phase change material. The impedance coupling varies over the phase change material.
    Type: Application
    Filed: April 4, 2023
    Publication date: October 26, 2023
    Inventors: Valentyn Solomko, Dominik Heiss, Semen Syroiezhin
  • Publication number: 20230337554
    Abstract: A phase change switch device includes a phase change material and a heater device thermally coupled to the phase change material. The heater device is configured to have a first electrical resistance in a first state where current is applied to the heater device for heating the phase change material, and have a second electrical resistance higher than the first electrical resistance in a second state outside heating phases of the heater device.
    Type: Application
    Filed: April 4, 2023
    Publication date: October 19, 2023
    Inventors: Hans-Dieter Wohlmuth, Dominik Heiss, Valentyn Solomko