Abstract: In an embodiment, a phase change switch device is provided. The phase change switch includes a phase change material, a set of heaters arranged to heat the phase change material and a power source. A switch arrangement including a plurality of switches is provided, which is configured to selectively provide electrical power from the power source to the set of the heaters.

Abstract: A switching device includes first and second RF terminals disposed over a substrate, one or more strips of phase change material connected between the first and second RF terminals, a region of thermally insulating material that separates the one or more strips of phase change material from the substrate, and a heater structure comprising one or more heating elements that are configured to control a conductive connection between the first and second RF terminals by applying heat to the one or more strips of phase change material. Each of the one or more strips of phase change material includes a first outer face and a second outer face opposite from the first outer face. For each of the one or more strips of phase change material, at least portions of both of the first and second outer faces are disposed against one of the heating elements.

Abstract: A method of forming a phase change switching device includes providing a substrate, forming first and second RF terminals on the substrate, forming a strip of phase change material on the substrate that is connected between the first and second RF terminals, forming a heating element adjacent to the strip of phase change material such that the heating element is configured to control a conductive state of the strip of phase change material.

Abstract: An adapter system for the electrical connection of a connector of a cabling to different contact arrangements of different charging sockets along a connection axis includes an adapter housing and a fastening element attaching the adapter housing to one of the charging sockets. The adapter housing has a contact surface extending perpendicularly to the connection axis and a plurality of contact openings extending along the connection axis. The contact surface is disposed at an end of the adapter housing on a socket side. An end of the adapter housing on a cable side has a cabling interface connecting to the connector. The end of the adapter housing on the socket side is attachable to each of the charging sockets by the fastening element with the contact surface in a predetermined rotational position relative to the connection axis.

Abstract: A switch device includes a phase change switch and a memory for storing a target state of the phase change switch. A controller determines a phase state of the phase change switch, and, if the state of the phase change switch does not correspond to the target state, controls a heater of the phase change switch to change the state of the phase changes switch to the target state.

Abstract: A device includes a thinned semiconductor substrate having a first side and a second side opposite to the first side; and at least one radio frequency device at the first side, wherein the second side of the thinned semiconductor substrate is processed to reduce leakage currents or to improve a radio frequency linearity of the at least one radio frequency device through Bosch etching.

Abstract: A method includes providing a semiconductor substrate having a first side and a second side opposite to the first side, forming at least one radio frequency device at the first side; thinning the semiconductor substrate from the second side; and processing the second side of the thinned semiconductor substrate to reduce leakage currents or to improve a radio frequency linearity of the at least one radio frequency device.

Abstract: A high-current contact device includes a first contact element transmitting electrical energy, a circuit carrier, a first data contact transmitting data, and a data interface. The first contact element extends through the circuit carrier along a mating axis at a feedthrough. A conductor track of the circuit carrier electrically connects the first data contact to the data interface. A carrier of the circuit carrier is injection-molded and mechanically supports the first data contact, the conductor track, and the data interface.

Abstract: A high current contact device for transmitting electric energy includes a contact housing, a first contact element arranged in the contact housing, the first contact element extends at least in portions along a mating axis, and a temperature measuring device having a circuit carrier with a first temperature sensor and a first heat conducting path. The first temperature sensor is arranged on the circuit carrier and the circuit carrier is arranged laterally adjacent to the first contact element. The first heat conducting path has a first heat conducting element that is elastic and heat conductive with a contact surface. The contact surface abuts against a first outer circumferential side of the first contact element. The first heat conducting element thermally couples the first contact element to the first temperature sensor. The first temperature sensor measures a temperature of the first contact element.

Abstract: A switch device including a semiconductor substrate is provided. A trench is formed in the substrate, and a phase change material is provided at least partially in the trench. A heater for heating the phase change material is also provided.

Abstract: A housing part for an electrical connector includes a cable channel receiving a cable, a flange surface adapted to abut a complementary housing part, and a sealing gasket extending along the flange surface. The sealing gasket has a pair of cable sealing portions extending across the cable channel. The cable sealing portions are spaced apart from one another in an axial direction of the cable channel.

Abstract: A switching device includes first and second RF terminals disposed over a substrate, one or more strips of phase change material connected between the first and second RF terminals, a region of thermally insulating material that separates the one or more strips of phase change material from the substrate, and a heater structure comprising one or more heating elements that are configured to control a conductive connection between the first and second RF terminals by applying heat to the one or more strips of phase change material. Each of the one or more strips of phase change material includes a first outer face and a second outer face opposite from the first outer face. For each of the one or more strips of phase change material, at least portions of both of the first and second outer faces are disposed against one of the heating elements.

Abstract: An integrated circuit is provided. The integrated circuit includes a transistor, a first metallization layer above the transistor and electrically connected to the transistor, and a phase change switch. At least a part of the phase change switch is provided below the first metallization layer. The first metallization layer is provided laterally adjacent to the phase change switch. Moreover, a method is provided for manufacturing an integrated circuit. Further provided is a wafer for manufacturing an integrated circuit, and a method for manufacturing a wafer for manufacturing an integrated circuit.

Abstract: A method includes providing a semiconductor substrate having a first side and a second side opposite to the first side, forming at least one radio frequency device at the first side; thinning the semiconductor substrate from the second side; and processing the second side of the thinned semiconductor substrate to reduce leakage currents or to improve a radio frequency linearity of the at least one radio frequency device.

Abstract: A drive element for an electrical connector comprises a gear wheel and an overload coupler. The overload coupler is between the gear wheel and a hub.

Abstract: A drive element for an electrical connector comprises a gear wheel and an overload coupler. The overload coupler is between the gear wheel and a hub.

Abstract: An actuator module for locking an electrical connection comprises a lock, a drive unit, and a position detection unit. The lock is movable between an unlocked position and a locked position along a direction of movement. The lock has a trigger. The drive unit moves the lock from the unlocked position to the locked position. The position detection unit has an optical sensor detecting the trigger and determining a position of the lock.

Abstract: An actuator module for locking an electrical connection comprises a lock, a drive unit, and a position detection unit. The lock is movable between an unlocked position and a locked position along a direction of movement. The lock has a trigger. The drive unit moves the lock from the unlocked position to the locked position. The position detection unit has an optical sensor detecting the trigger and determining a position of the lock.