Patents by Inventor Dominik Scholz
Dominik Scholz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145633Abstract: In an embodiment an optoelectronic semiconductor component includes a layer stack having a side face or a plurality of side faces including a first side region delimiting a first semiconductor region sideways and a second side region partially delimiting a second side region sideways and a first main face and a second main face lying opposite the first main face, the one or more side faces connecting the first main face and the second main face to one another. The component further includes a first contact configured for electrical contacting the first semiconductor region, a second contact configured for the electrical contacting of the second semiconductor region and a dielectric layer arranged between the second contact and the layer stack, wherein the second contact is configured for horizontal current injection into the second semiconductor region.Type: ApplicationFiled: February 15, 2022Publication date: May 2, 2024Inventors: Matin Mohajerarni, Alexander Pfeuffer, Dominik Scholz
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Publication number: 20230378398Abstract: The invention relates to an LED package for UV light comprising an optoelectronic device which, in particular as a volume emitter, is designed to emit light in the ultraviolet spectrum during operation. The component is arranged on a carrier with two contact pads for electrical contacting. Furthermore, a frame surrounding the component and arranged on the carrier is provided with a gas-impermeable outlet region lying in a main radiation direction, so that a hermetically sealed cavity comprising an inner region of the carrier is formed, the side walls of the frame facing the optoelectronic device being bevelled and opening towards the main radiation direction. An ESD protection element arranged outside the inner area on the carrier is electrically connected to at least one of the two contact pads.Type: ApplicationFiled: October 8, 2021Publication date: November 23, 2023Inventors: Andreas REITH, Joerg SORG, Nikolaus GMEINWIESER, Dominik SCHOLZ, Manfred WOLF
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Publication number: 20230187588Abstract: The invention relates to an LED package for UV light comprising an optoelectronic device which, in particular as a volume emitter, is designed to emit light in the ultraviolet spectrum during operation. The component is arranged on a carrier with two contact pads for electrical contacting. Furthermore, a frame surrounding the component and arranged on the carrier is provided with a gas-impermeable outlet region lying in a main radiation direction, so that a hermetically sealed cavity comprising an inner region of the carrier is formed, the side walls of the frame facing the optoelectronic device being beveled and opening towards the main radiation direction. An ESD protection element arranged outside the inner area on the carrier is electrically connected to at least one of the two contact pads.Type: ApplicationFiled: February 3, 2023Publication date: June 15, 2023Inventors: Andreas REITH, Joerg SORG, Nikolaus GMEINWIESER, Dominik SCHOLZ, Manfred WOLF
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Patent number: 11658277Abstract: A method for producing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing a semiconductor chip having an active region for radiation emission, applying a seed layer on the semiconductor chip, wherein the seed layer includes a first metal and a second metal being different from the first metal, and wherein the second metal is less noble than the first metal, applying a structured photoresist layer directly to the seed layer, applying a solder layer at least to regions of the seed layer which are not covered by the photoresist layer and wherein a proportion of the second metal in the seed layer is between 0.5 wt % and 10 wt %.Type: GrantFiled: July 2, 2021Date of Patent: May 23, 2023Assignee: OSRAM OLED GmbHInventors: Guido Weiss, Christoph Schwarzmaier, Dominik Scholz, Nicole Heitzer
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Patent number: 11644538Abstract: An optical distance measuring device and a method for operating an optical distance measuring device are disclosed. In an embodiment an optical distance measuring device includes a pixelated radiation source with at least two pixels, a radiation detector configured to detect electromagnetic radiation emitted by the radiation source and reflected in measuring regions and a control unit configured to operate the radiation source and to receive electrical signals from the radiation detector, wherein the pixelated radiation source is configured to illuminate different measuring regions with electromagnetic radiation with pairwise different properties.Type: GrantFiled: June 28, 2018Date of Patent: May 9, 2023Assignee: OSRAM OLED GmbHInventors: Michael Schumann, Dominik Schulten, Dominik Scholz
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Patent number: 11404471Abstract: An optoelectronic semiconductor component may have a semiconductor body comprising a first region of an n-type conductivity, a second region of a p-type conductivity, an active region capable of generating electromagnetic radiation, a marker layer, a plurality of emission regions and a plurality of recesses. The active region is disposed between the first region and the second region in a plane parallel to the main extension plane of the semiconductor body. The recesses delimit the emission regions in lateral direction. Starting from the side of the first region facing away from the active region, the recesses extend transversely to the main plane of the semiconductor body in the direction of the second region and adjoin the marker layer or penetrate the marker layer completely. The recesses are formed only in the first region or the recesses extend into the second region and completely penetrate the active region.Type: GrantFiled: March 22, 2019Date of Patent: August 2, 2022Assignee: OSRAM OLED GMBHInventors: Christian Mueller, Dominik Scholz, Joachim Hertkorn
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Patent number: 11402725Abstract: An assembly is disclosed. In an embodiment an assembly includes a light source configured to illuminate a field of view, a control circuit configured to operate the light source and a camera configured to record a scene in the field of view, wherein the light source comprises at least one semiconductor component having at least one semiconductor chip, wherein the semiconductor chip has an semiconductor layer sequence with an active region, wherein the semiconductor chip comprises the plurality of pixels, wherein the plurality of pixels are configured to generate radiation of the light source, wherein the control circuit has a memory configured to store operational data of the light source, wherein the control circuit is configured to operate the pixels on basis of the operational data, and wherein the arrangement is configured to perform an adaptation of at least a part of the operational data in the memory during operation of the arrangement.Type: GrantFiled: February 22, 2018Date of Patent: August 2, 2022Assignee: OSRAM OLED GMBHInventors: Dominik Schulten, Michael Schumann, Dominik Scholz
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Patent number: 11316068Abstract: An optoelectronic semiconductor chip and a method for producing an optoelectronic semiconductor chip are disclosed. In an embodiment, a chip includes a semiconductor body comprising a plurality of emission regions, first and second contact points, a rewiring structure and first and second connection points, wherein each emission region is contacted via the first and second contact points and configured to be operated separately from one another, wherein the rewiring structure electrically conductively connects each first contact point to an associated first connection point, wherein the rewiring structure electrically conductively connects every second contact point to an associated second connection point, wherein at least one of the connection points does not overlap with a contact point which is electrically conductively connected to this connection point in a vertical direction, and wherein each first connection point is disposed laterally directly adjacent to a further first connection point.Type: GrantFiled: July 12, 2017Date of Patent: April 26, 2022Assignee: OSRAM OLED GMBHInventors: Dominik Scholz, Alexander F. Pfeuffer
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Patent number: 11164850Abstract: An arrangement having a plurality of lighting modules and a method for producing an arrangement having a plurality of lighting modules are disclosed.Type: GrantFiled: June 13, 2018Date of Patent: November 2, 2021Assignee: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Dominik Scholz, Siegfried Herrmann
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Publication number: 20210336111Abstract: A method for producing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing a semiconductor chip having an active region for radiation emission, applying a seed layer on the semiconductor chip, wherein the seed layer includes a first metal and a second metal being different from the first metal, and wherein the second metal is less noble than the first metal, applying a structured photoresist layer directly to the seed layer, applying a solder layer at least to regions of the seed layer which are not covered by the photoresist layer and wherein a proportion of the second metal in the seed layer is between 0.5 wt % and 10 wt %.Type: ApplicationFiled: July 2, 2021Publication date: October 28, 2021Inventors: Guido Weiss, Christoph Schwarzmaier, Dominik Scholz, Nicole Heitzer
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Patent number: 11133250Abstract: A semiconductor component may have a semiconductor body and an electrically conductive carrier layer. The semiconductor body may include a first semiconductor layer and a second semiconductor layer, a first main face and a second main face, situated opposite the first main face, wherein the first main face is formed by a surface of the first semiconductor layer and the second main face is formed by a surface of the second semiconductor layer. The semiconductor body may further include at least one side face connecting the first main face to the second main face. The electrically conductive carrier layer may regionally cover the second main face the carrier layer is structured in such a way that it has at least one contact-free depression. Furthermore, a method for producing such a semiconductor component is disclosed.Type: GrantFiled: May 17, 2018Date of Patent: September 28, 2021Assignee: OSRAM Opto Semiconductors GmbHInventors: Isabel Otto, Dominik Scholz, Christian Leirer
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Patent number: 11121124Abstract: A display device is disclosed. In an embodiment a display device having a plurality of pixels separately operable from each other includes a semiconductor layer sequence including a first semiconductor layer, an active layer and a second semiconductor layer, a first contact structure contacting the first semiconductor layer and a second contact structure contacting the second semiconductor layer and at least one separating region extending through the first contact structure, the first semiconductor layer and the active layer into the second semiconductor layer, wherein the semiconductor layer sequence and the first contact structure have at least one first recess laterally adjacent with respect to a respective pixel, the first recess extending through the first contact structure, the first semiconductor layer and the active layer into the second semiconductor layer, and wherein the second contact structure includes second contacts extending through the at least one first recess.Type: GrantFiled: November 23, 2017Date of Patent: September 14, 2021Assignee: OSRAM OLED GMBHInventors: Alexander F. Pfeuffer, Dominik Scholz
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Patent number: 11094866Abstract: A method for producing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing a semiconductor chip having an active region for radiation emission, applying a seed layer on the semiconductor chip, wherein the seed layer includes a first metal and a second metal being different from the first metal, and wherein the second metal is less noble than the first metal, applying a structured photoresist layer directly to the seed layer and applying a solder layer at least to regions of the seed layer which are not covered by the photoresist layer, wherein a ratio of the first metal to the second metal in the seed layer is between 95:5 to 99:1.Type: GrantFiled: March 20, 2018Date of Patent: August 17, 2021Assignee: OSRAM OLED GMBHInventors: Guido Weiss, Christoph Schwarzmaier, Dominik Scholz, Nicole Heitzer
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Patent number: 11081620Abstract: A method of producing a semiconductor component includes applying an auxiliary carrier at a first side of a semiconductor body, the auxiliary carrier having a first lateral coefficient of thermal expansion, and applying a connection carrier at a second side of the semiconductor body facing away from the auxiliary carrier, the connection carrier having a second lateral coefficient of thermal expansion, wherein the semiconductor body is grown on a growth substrate different from the auxiliary carrier, the first and the second lateral coefficient of thermal expansion differ by at most 50%, and the growth substrate is removed prior to application of the auxiliary carrier.Type: GrantFiled: December 15, 2017Date of Patent: August 3, 2021Assignee: OSRAM OLED GmbHInventors: Andreas Plössl, Norwin von Malm, Dominik Scholz, Christoph Schwarzmaier, Martin Rudolf Behringer, Alexander F. Pfeuffer
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Patent number: 11050002Abstract: A method for producing a semiconductor chip and a semiconductor chip are disclosed. In an embodiment, the method includes providing a semiconductor layer sequence having a first semiconductor layer and a second semiconductor layer, wherein the first semiconductor layer is formed as a p-conducting semiconductor region and the second semiconductor layer is formed as an n-conducting semiconductor region, or vice versa, forming at least one recess in the semiconductor layer sequence so that side surfaces of the first and second semiconductor layers are exposed, wherein the recess is multiple times wider than deep and applying an auxiliary layer for electrically contacting the second semiconductor layer, wherein the auxiliary layer at the side surfaces exposed.Type: GrantFiled: September 29, 2016Date of Patent: June 29, 2021Assignee: OSRAM OLED GMBHInventors: Alexander F. Pfeuffer, Dominik Scholz
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Patent number: 10923400Abstract: The invention relates to a method for producing a plurality of components (100), wherein a carrier composite (10) is provided with a coherent base body (13) and a wafer composite (200) is provided with a coherent semiconductor body composite (20) and a substrate (9). The wafer composite is connected to the carrier composite to form a common composite. In a subsequent method step, a plurality of separation channels (60) are generated at least through the base body (13) to form a grid structure (6), which determines the dimensions of the components (100) to be produced. A passivation layer (61) is shaped in such a way that it covers the side surfaces of the separation channels (60). Finally, the common composite is separated, wherein the substrate (9) is removed from the semiconductor body composite (20) and the common composite is separated along the separation channels (60) to form a plurality of components (100).Type: GrantFiled: January 24, 2017Date of Patent: February 16, 2021Assignee: OSRAM OLED GMBHInventors: Sophia Huppmann, Dominik Scholz, Simeon Katz
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Publication number: 20210028223Abstract: An optoelectronic semiconductor component may have a semiconductor body comprising a first region of an n-type conductivity, a second region of a p-type conductivity, an active region capable of generating electromagnetic radiation, a marker layer, a plurality of emission regions and a plurality of recesses. The active region is disposed between the first region and the second region in a plane parallel to the main extension plane of the semiconductor body. The recesses delimit the emission regions in lateral direction. Starting from the side of the first region facing away from the active region, the recesses extend transversely to the main plane of the semiconductor body in the direction of the second region and adjoin the marker layer or penetrate the marker layer completely. The recesses are formed only in the first region or the recesses extend into the second region and completely penetrate the active region.Type: ApplicationFiled: March 22, 2019Publication date: January 28, 2021Inventors: Christian Mueller, Dominik Scholz, Joachim Hertkorn
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Patent number: 10893588Abstract: A method of operating a lighting device with a light-emitting component, in which the light-emitting component includes a plurality of pixels configured to illuminate a plurality of zones in a field of view, the light-emitting component includes a processing device including characterization data of the light-emitting component, and the pixels of the light-emitting component are operated as a function of the characterization data, wherein to determine characterization data prior to intended operation of the lighting device an intensity and/or a color location of the emitted light of a pixel or of each pixel is measured as a function of an operating current.Type: GrantFiled: February 22, 2018Date of Patent: January 12, 2021Assignee: OSRAM OLED GmbHInventors: Dominik Schulten, Michael Schumann, Dominik Scholz
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Patent number: 10811579Abstract: An optoelectronic component includes a light emitting semiconductor chip, including an emission side and comprising an underside, wherein the optoelectronic component is configured to emit light via the emission side, the optoelectronic component including an insulating layer, the light emitting semiconductor chip is embedded into the insulating layer, the light emitting semiconductor chip including two electrical contact locations, the contact locations face away from the emission side, a first and a second electrically conductive contact layer are provided, respectively, an electrically conductive contact layer electrically conductively connects to a contact location of the semiconductor chip, the electrically conductive contact layers are arranged in the insulating layer, the first electrically conductive contact layer adjoins a first side face of the optoelectronic component, and the second electrically conductive contact layer adjoins a second side face of the optoelectronic component.Type: GrantFiled: January 26, 2017Date of Patent: October 20, 2020Assignee: OSRAM OLED GmbHInventors: Dominik Scholz, Siegfried Herrmann
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Publication number: 20200251450Abstract: An arrangement having a plurality of lighting modules and a method for producing an arrangement having a plurality of lighting modules are disclosed.Type: ApplicationFiled: June 13, 2018Publication date: August 6, 2020Inventors: Dominik Scholz, Siegfried Herrmann