Abstract: The invention relates to a method for fabricating chip elements provided with a groove from devices formed on a wafer. The method comprises the steps consisting in, depositing a sacrificial film on the wafer so as to leave a central part of each device exposed and to cover an edge of the device at the level of which the groove is to be formed; applying a mold on the sacrificial film; injecting a hardenable material into the mold; hardening the hardenable material; dicing the wafer between the devices; and eliminating the sacrificial film.

Abstract: The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection.

Abstract: An apparatus for assembling chip devices on a wire, each chip device comprising two substantially parallel lateral walls, and a groove in one of the lateral walls for receiving said wire. The apparatus includes a pinching device having two opposing surfaces, the distance between the opposing surfaces being substantially constant and substantially equal to the distance between the two lateral walls of a chip device. A wire feeder is adapted to continuously feed the wire in contact with one of the opposing surfaces of the pinching device. A chip device feeder is adapted to drive chip devices, one at a time, between the opposing surfaces, with their grooves turned towards the wire. The pinching device may comprise two cylindrical rollers having rotation axes substantially perpendicular to the wire, the opposing surfaces being formed by respective surfaces of the rollers.

Abstract: A microelectronic chip comprises two parallel main faces and side faces. At least one of the faces comprises a recess provided with at least one electrical connection element and forming a housing for a wire element. The wire element simultaneously constitutes both an electrical connection between the chip and the outside via said connection element and a flexible mechanical support for said chip.

Abstract: The invention relates to a method for fabricating chip elements provided with a groove from devices formed on a wafer. The method comprises the steps consisting in, depositing a sacrificial film on the wafer so as to leave a central part of each device exposed and to cover an edge of the device at the level of which the groove is to be formed; applying a mold on the sacrificial film; injecting a hardenable material into the mold; hardening the hardenable material; dicing the wafer between the devices; and eliminating the sacrificial film.

Abstract: A method for making an assembly of chips equipped with radiofrequency transmission-reception means, including successively: making a plurality of chips, on a substrate, each chip having at least one reception area, connecting the reception areas of the chips of the assembly in series with an electrically insulating flat ribbon having a plurality of metallic patterns electrically insulated from one another, each pattern forming at least a part of a flat antenna electrically connected at the level of at least one connection area of the antenna to a corresponding reception area, and separating the chips at the level of the substrate, the chips being mechanically connected to one another by the ribbon.

Abstract: The method enables an assembly of chips, initially formed on a wafer, to be formed. Each chip comprises two parallel main faces joined by side faces. At least one of the side faces comprises at least one groove for housing a thread element. The wafer is first of all stuck onto a flexible film and the chips are then cut. The film is then deformed to space the chips apart from one another and to make the grooves accessible. A daisy chain is then formed joining the chips via at least one thread element, each chip being inserted in the daisy chain by inserting the thread in the groove of said chip and then removing the chip from the deformable film.

Abstract: Assembly of at least one microelectronic chip with a wire element, the chip comprising a groove for embedment of the wire element. The wire element is a strand with a longitudinal axis substantially parallel to the axis of the groove, comprising at least two electrically conducting wires covered with insulator. The chip comprises at least one electrically conducting bump in the groove, this bump being in electric contact with a stripped area of a single one of the electrically conducting wires of the strand.

Abstract: A first step of the method for assembling a wire element with an electronic chip comprises arranging the wire element in a groove of the chip delineated by a first element and a second element, joined by a link element comprising a plastically deformable material, and a second step then comprises clamping the first and second elements to deform the link element until the wire element is secured in the groove.

Abstract: The assembly comprises at least one microelectronic chip having two parallel main surfaces and lateral surfaces, at least one of the lateral faces comprising a longitudinal groove housing a wire element having an axis parallel to the longitudinal axis of the groove. The groove is delineated by at least two side walls. The wire element is secured to the chip at the level of a clamping area between at least one bump arranged on one of the side walls, and the side wall of the groove opposite said bump. The clamping area has a smaller height than the diameter of the wire element and a free area is arranged laterally to the bump along the longitudinal axis of the groove. The free area has a height, corresponding to the distance separating the two side walls, that is greater than the diameter of the wire element.

Abstract: The invention relates to the fabrication of radiofrequency transmission/reception devices. The invention makes provision for: the making of radiofrequency transmission/reception chips devoid of antennas; the connecting in series of the chips by at least two conducting wire elements whose respective lengths between two neighboring chips are chosen as a function of the transmission/reception frequency, each element contacting electrically at least one terminal of a chip and ensuring an at least temporary function of mechanical holding of the chips chainwise; and the cutting at regular intervals of the serial connection to form, for each chip, two strands of an antenna of the device.

Abstract: The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection.

Abstract: The method enables an assembly of chips, initially formed on a wafer, to be formed. Each chip comprises two parallel main faces joined by side faces. At least one of the side faces comprises at least one groove for housing a thread element. The wafer is first of all stuck onto a flexible film and the chips are then cut. The film is then deformed to space the chips apart from one another and to make the grooves accessible. A daisy chain is then formed joining the chips via at least one thread element, each chip being inserted in the daisy chain by inserting the thread in the groove of said chip and then removing the chip from the deformable film.

Abstract: A microelectronic chip comprises two parallel main faces and side faces. At least one of the faces comprises a recess provided with at least one electrical connection element and forming a housing for a wire element. The wire element simultaneously constitutes both an electrical connection between the chip and the outside via said connection element and a flexible mechanical support for said chip.

Abstract: The suitability of a service provider for performing a task having a sensitivity level is gauged by using a trust level associated with the provider, in conjunction with the sensitivity level, to gauge whether or not to allocate the task to the service provider.

Abstract: The present invention relates to a distributed computing system and method. Conventional distributed computing environments require complex arrangements to distribute tasks and to collate the results of any distributed processing. There has been a recent trend towards using the spare computing capacity of computers connected to the Internet to provide distributed computing resources. However, various security issues have been identified in relation to such an arrangement. Suitably, the present invention uses a power management system in which a user or system context, which is created and saved when an associated computing system enters a power management state, to provide a distributed computing platform. Once a computer system has entered a power saving state and the user system context has been saved to an HDD, the computer system is arranged to wake-up and to establish, or use, a pre-prepared distributed computing task system context.

Abstract: A boot process for a computer comprising, in a client environment, a) generating, using a non-volatile data storage medium, a boot image request, b) passing the boot image request to a boot image repository, c) receiving, from the boot image repository, the requested boot image and d) booting the computer using the received boot image, characterised in that e) the boot image request is passed using an Internet Protocol and is sent to a predetermined location.

Abstract: A docking station for a vehicle, the docking station being adapted to receive a portable computer, the docking station comprising mounting elements to mount the docking station in a vehicle, a holding element to hold a portable computer in engagement with the docking station, and a connection element to connect a portable computer in engagement with the docking station to a subsystem of the vehicle.

Abstract: A Computer based on a dual processing structure, with a main processing subsystem associated to an alternate processing subsystem. The main subsystem includes a main processor, a keyboard and a display, and the alternate processing subsystem has a quicker response time than the main processing subsystem. Additional multiplexing means are used for sharing said display and said keyboard between the two processing subsystems. The computer includes a powering control unit (40) for controlling the powering of the components of said main or said alternate processing subsystem, said powering control unit being controlled by a main power-on control and a alternate power-on control keys. The actuation on the main power-on control key causes the power-on control unit to power the two processors while actuating the alternate power-on control key causes the powering of the alternate processing subsystem only.

Abstract: A docking station for a vehicle, the docking station being adapted to receive a portable computer, the docking station comprising mounting elements to mount the docking station in a vehicle, a holding element to hold a portable computer in engagement with the docking station, and a connection element to connect a portable computer in engagement with the docking station to a subsystem of the vehicle.