Abstract: A first planar prong adjacent to and parallel with, an exterior of the side of the enclosure. A second planar prong parallel to and spaced from an interior of the side of the enclosure and compress a first compressible gasket against the side of the enclosure. Furthermore, the second planar prong forms a first compartment between a first side of the second planar prong and the interior of the side of the enclosure, parallel to and spaced from an interior of the side of the enclosure. A planar base of the first planar prong and the second planar prong, adjacent to a cover of the enclosure. A first planar member having one end coupled perpendicular to a second side of the second planar prong and support a second compressible gasket in a second compartment formed between the planar member and the cover.

Abstract: A grounded belt and drawer apparatus including a drawer, mounted on a first track, a tensioner body having a first pulley, a supporting member, and a first belt. The drawer moveable on a first line in a first direction and a second direction. The tensioner body mounted on a second track and moveable in the first direction and the second direction. The first belt having a first end and a second end, rounded over the first pulley, and a first segment and second segment extending distally from the first pulley in the first direction. The first belt conductively connected to the drawer and to a first fixed point which forms a conductive path from the drawer to the first fixed point.

Abstract: An apparatus for distributing electromagnetic waves comprising a first plurality of plates coupled to a first rod. A second plurality of plates coupled to a second rod, wherein at least one of either the first or the second plurality of plates is capable of reflecting an electromagnetic wave. A portion of the second rod is situated inside the first rod. A first motor mechanically connected to the first rod, such that the first motor is capable of rotating the first rod. A second motor mechanically connected to the second rod, such that the second motor is capable of rotating the second rod, wherein rotational direction and speed of the second rod, when rotated by the second motor is independent of rotational direction and speed of the first rod, when rotated by the first motor.

Abstract: A light pipe assembly may include a first light pipe having a light pipe column element at an end of the first light pipe. The light pipe column element may have a plurality of light pipe columns. The light pipe assembly may include a second light pipe having a plurality of light pipe column receptacles at an end of the second light pipe. Also, an electrically conductive panel having a light pipe aperture. The light pipe aperture may have a plurality of light pipe channels. The plurality of light pipe columns is adapted to pass through the plurality of light pipe channels and be received by the plurality of light pipe column receptacles.

Abstract: A first substantially annular conductive material has a first central opening, the first central opening is sufficient to substantially surround a fastener and maintain an electrical connection between the printed circuit board and the chassis. A second substantially annular conductive material is concentric with the first conductive material and the second conductive material hays a second central opening which is sufficient to substantially surround the fastener and maintain the electric connection between the printed circuit board and the chassis. A substantially annular impedance material is between and adjacent to the first conductive material and the second conductive material, the impedance material is sufficient to attenuate the electromagnetic interference from the system.

Abstract: According to embodiments of the invention, a structure for cooling electronic components may be provided. The structure may include a heat sink having a plurality of parallel heat conducting elements. The structure may also include a plurality of fans, wherein the fans are interleaved with the heat conducting elements. The structure may also include a drive shaft passing through the heat conducting elements and the fans, wherein the drive shaft rotates the fans in relation to the heat sink. According to other embodiments, the structure may include a baffle located on a side of the heat sink in an upstream location within an airflow stream.

Abstract: An electromagnetic interference (EMI) shield that increases the airflow through the EMI shield while preventing line-of-sight openings through the EMI shield. Two plates are coupled together. Each of the respective plates has a raised component with an aperture therethrough to provide a path through the plate. The raised component is preferably scoop-shaped with the aperture at one end and an opposite end tapering into the respective plate. At least a portion of one of the raised components overlaps at least a portion of the other of the raised components when the plates are coupled together to form a path through the plates, while the plates are coupled together. Line-of-sight openings through the plates, to an electronic device protected by the EMI shield, are at least partially prevented by the raised components.

Abstract: An approach for compartmentalizing heat spreaders within an integrated circuit package is provided. In one aspect, the approach comprises a shielding member that is connected to the integrated circuit package. The shielding member is further adapted to provide a shielded enclosure to the integrated circuit package, wherein the shielded enclosure contains an internal cavity filled with frequency absorber material to dissipate radio frequency energy emitted by the integrated circuit package. In another aspect, the shielding member comprises compartments including an outer vertical layer, a top layer, and an inner vertical layer that provides heat transfer from the heat spreader to the top layer of the shielding member. In addition, the heat is transferred from the top layer of the compartments of the shielding member to a heat sink of the integrated circuit package.

Abstract: A light pipe assembly may include a first light pipe having a light pipe column element at an end of the first light pipe. The light pipe column element may have a plurality of light pipe columns. The light pipe assembly may include a second light pipe having a plurality of light pipe column receptacles at an end of the second light pipe. Also, an electrically conductive panel having a light pipe aperture. The light pipe aperture may have a plurality of light pipe channels. The plurality of light pipe columns is adapted to pass through the plurality of light pipe channels and be received by the plurality of light pipe column receptacles.

Abstract: An apparatus for distributing electromagnetic waves comprising a first plurality of plates coupled to a first rod. A second plurality of plates coupled to a second rod, wherein at least one of either the first or the second plurality of plates is capable of reflecting an electromagnetic wave. A portion of the second rod is situated inside the first rod. A first motor mechanically connected to the first rod, such that the first motor is capable of rotating the first rod. A second motor mechanically connected to the second rod, such that the second motor is capable of rotating the second rod, wherein rotational direction and speed of the second rod, when rotated by the second motor is independent of rotational direction and speed of the first rod, when rotated by the first motor.

Abstract: According to embodiments of the invention, a heat sink structure may be provided. The heat sink structure may include a first surface adapted to connect to an electronic component. The heat sink structure may also include a second surface adapted to provide heat transfer. The heat sink structure may also include a coating of radio-frequency absorbing material covering at least a portion of the second surface.

Abstract: A method and structures are provided for implementing press-lock electromagnetic compatibility (EMC) gaskets. A gasket includes a plurality of fasteners received through a plurality of corresponding mounting apertures in a perforated support surface for precise placement, and retention without adhesives. The corresponding mounting apertures have a diameter smaller than 1/20th of a wavelength of the highest frequency to be suppressed to remain independent of the shielding required. The gasket defines a cavity receiving compliant foam, and includes an absorber.

Abstract: A method and structures are provided for implementing press-lock electromagnetic compatibility (EMC) gaskets. A gasket includes a plurality of fasteners received through a plurality of corresponding mounting apertures in a perforated support surface for precise placement, and retention without adhesives. The corresponding mounting apertures have a diameter smaller than 1/20th of a wavelength of the highest frequency to be suppressed to remain independent of the shielding required. The gasket defines a cavity receiving compliant foam, and includes an absorber.

Abstract: A heatsink may include an area in thermal contact with a semiconductor microchip surface and a first trench of a first depth. The first trench may be substantially continuous around the area. A first substance, such as ferrite, may be positioned in the first trench to attenuate electromagnetic interference. A second trench having a second depth may be formed around and further from the area than the first trench. A second substance may be positioned in the second trench.

Abstract: Methods and structures are provided for implementing feed-through and domain isolation using ferrite and containment barriers. A vertical isolator is provided between a first domain and a second domain on a printed circuit board with signals passing between the first domain and the second domain. The vertical isolator is placed over a domain separation gap between the first and second domains in the printed circuit board, the vertical isolator having a vertical isolation barrier between a first vertical plate coupled to the first domain and a second vertical plate coupled to the second domain. The vertical isolation barrier is formed of a unitary ferrite block or a non-conductive magnetic absorber material. A plurality of capacitance feed-through plates and a dielectric material are provided within the vertical isolator.

Abstract: A mechanism for protecting objects sensitive to electrostatic discharge (ESD) employs nested plates to direct the flow of ESD current to a targeted impedance. In one embodiment, an insulator plate is interposed between first and second electrically conductive plates. The insulator plate prevents any charge accumulating on the first plate from arcing to the second plate through the insulator plate. A target plate of electrically conductive material is interposed between the first and second plates over a hole in the insulator plate. The target plate, which is surrounded by an impedance layer of static dissipative material, includes a discharge portion that projects toward the second plate. ESD current flows in a path from the first plate, through the impedance layer, the target plate and again through the impedance layer, and to the second plate. The impedance layer provides a targeted impedance in the ESD current path.

Abstract: A method, system, and structure are provided for implementing a flex circuit cable and connector with a dual shielded air plenum. A flex circuit cable is provided with a connector. The flex circuit cable includes a stack of three spaced flex cable members with a plurality of gasket separators that are configured to form a pair of air plenums between the inner flex cable member and the respective outer flex cable members carrying cooling air coupled to the connector. The respective outer flex cable members together with the gasket separators provide a shielding function.

Abstract: A method and structure are provided for implementing surface mount components with symmetric reference balance. A first reference and an incoming signal are received in a surface mounted device (SMD) package and a second reference and the outgoing signal are output from the SMD package. A capacitor structure is defined within the SMD package between the first reference and the second reference. The capacitor structure includes a balanced impedance structure between the first reference and the second reference. A component connected between the received incoming signal and output signal is generally centrally located within the capacitor structure.

Abstract: A radial optical data interchange packaging comprises a central core; a plurality of central core photo transceivers emerging from an exterior side surface of the central core; a mother board coupled to the central core, wherein the mother board is perpendicularly oriented below and abutting the central core; a plurality of retention slots on the mother board, wherein the retention slots radially extend away from the central core; and a plurality of cards held by the retention slots, wherein each of the plurality of cards comprises a set of card photo transceivers that optically communicate with the central core photo transceivers.

Abstract: A method and structures are provided for implementing a latching gasket including an electrically conductive fabric, and a latching clip. The latching clip includes a support member carrying the electrically conductive fabric for radio frequency (RF) connection engagement with a first wall surface. The latching clip includes a first channel-defining member and a second channel-defining member extending downwardly from the support member. The first channel-defining member carries the electrically conductive fabric for radio frequency (RF) connection engagement with a second wall surface received in a channel defined by the first and second channel-defining members. The latching clip includes a latch arm extending outwardly and downwardly from an end of the support member near the second channel-defining member.