Abstract: An apparatus, system, and method for managing cooling within a printed circuit board (PCB) enclosure. The system includes a PCB having a first surface on which electronic components are mounted. Multiple contour control actuators are fixedly disposed in a substantially planar array in z-axis opposition to the first surface of the PCB. Each of the contour control actuators has an extensible end that is electromechanically extendable in parallel with the z-axis normal to the first surface of the PCB. A substantially flexible sheet member is disposed between the extensible ends of the contour control actuators and the first surface of the PCB. The extensible ends contact the flexible sheet member such that the z-axis contour of the flexible sheet member is determined by the z-axis positions of the extensible ends. A contour controller adjusts the z-axis contour of the flexible sheet member by adjusting the relative positions of the extensible ends of one or more of the contour control actuators.

Abstract: An improved electromagnetic radiation (EMR) shield that has minimal airflow resistance is presented. The EMR shield includes: a base plate; and plurality of columns that project away from the base plate, wherein each of the columns has a first end that is attached to the base plate, a second end that is distal to the base plate, and a side surface that has at least one side hole therein.

Abstract: An attenuation mechanism for an electronic device is presented. The attenuation mechanism includes an outer member that has an inner member oriented axially within the outer member. The inner member has an axial twist that causes a line of sight blockage between an exterior and an interior of a housing of an electronic device when the attenuation mechanism is mounted through the housing, such that sound and electromagnetic radiation is attenuated without obstructing cooling air that is flowing through the housing.

Abstract: A twisted pair symmetric bus bar structure for electric power distribution includes a first conductor; a second conductor; an insulator; wherein the first conductor and the second conductor form an interwoven alternating interlocking pattern; wherein the first and second conductors are formed from a series of Z-shaped sections; wherein the insulator is H-shaped and has a series of slots for receiving the first and second conductors; and wherein the insulator is sandwiched between the first and second conductor.

Abstract: A gasket for shielding a seam between two surfaces includes a resilient member, a first electrode, a second electrode and a conductive layer. The resilient member has a first side and an opposite second side. The first electrode is disposed on the first side of the resilient member. The second electrode is disposed on the second side of the resilient member. The conductive layer envelops at least a portion of the resilient member, the first electrode and the second electrode. The resilient member includes a material that is compressed when a first potential is applied between the first electrode and the second electrode and that is decompressed when a second potential, different from the first potential, is applied between the first electrode and the second electrode.

Abstract: Embodiments of the present invention provide a system for testing and mounting a PCB in a device. A PCB may be placed on one or more standoffs so that a head portion of the standoff protrudes from one or more apertures of the PCB. A push-pin type standoff cap may then be placed on the protruding heads to mechanically restrain the PCB to the standoffs. Furthermore, one or more cables may be coupled with the standoff caps to provide power or test signals to one or more connector pads on the PCB. Therefore, the standoff caps provide a system for aligning, retaining, connecting, terminating, and testing printed circuit boards.

Abstract: A heat sink including one or more vented pipes for directing air through a plurality of enclosed chambers formed by a plurality of fins in an enclosed structure having at least a first side and a second side. An air inlet in the first side of the enclosed structure allows pressurized air to enter the plurality of enclosed chambers through the one or more vented pipes. An air outlet in the first side of the enclosed structure allows pressurized air to exit the plurality of enclosed chambers through the one or more vented pipes.

Abstract: Heat sinks for dissipating a thermal load are disclosed that include: a heat sink base capable of receiving a thermal load from a thermal source; heat-dissipating fins mounted on the heat sink base, each heat-dissipating fin enclosing a hollowed cavity inside the heat-dissipating fin; and a thermal transport within the hollowed cavity of each heat-dissipating fin, the thermal transport capable of convectively transferring the thermal load along a convective heat path within each heat-dissipating fin. Heat sinks for dissipating a thermal load may also include: a pair of electrodes inside each heat-dissipating fin electrically connected to the thermal transport for generating an electric current through the thermal transport; and a magnet mounted adjacent to the heat-dissipating fins for generating a magnetic field through the thermal transport, the magnetic field passing through the electric current and oriented to induce a force on the thermal transport along the convective heat path.

Abstract: Heat sinks for dissipating a thermal load are disclosed that include: a heat sink base capable of receiving a thermal load from a thermal source; heat-dissipating fins mounted on the heat sink base, each heat-dissipating fin enclosing a hollowed cavity inside the heat-dissipating fin; and a thermal transport within the hollowed cavity of each heat-dissipating fin, the thermal transport capable of convectively transferring the thermal load along a convective heat path within each heat-dissipating fin. Heat sinks for dissipating a thermal load may also include: a pair of electrodes inside each heat-dissipating fin electrically connected to the thermal transport for generating an electric current through the thermal transport; and a magnet mounted adjacent to the heat-dissipating fins for generating a magnetic field through the thermal transport, the magnetic field passing through the electric current and oriented to induce a force on the thermal transport along the convective heat path.

Abstract: Heat sinks for dissipating a thermal load are disclosed that include: a heat sink base capable of receiving a thermal load from a thermal source; heat-dissipating fins mounted on the heat sink base, each heat-dissipating fin enclosing a hollowed cavity inside the heat-dissipating fin; and a thermal transport within the hollowed cavity of each heat-dissipating fin, the thermal transport capable of convectively transferring the thermal load along a convective heat path within each heat-dissipating fin. Heat sinks for dissipating a thermal load may also include: a pair of electrodes inside each heat-dissipating fin electrically connected to the thermal transport for generating an electric current through the thermal transport; and a magnet mounted adjacent to the heat-dissipating fins for generating a magnetic field through the thermal transport, the magnetic field passing through the electric current and oriented to induce a force on the thermal transport along the convective heat path.

Abstract: Heat sinks for dissipating a thermal load are disclosed that include: a heat sink base capable of receiving a thermal load from a thermal source; heat-dissipating fins mounted on the heat sink base, each heat-dissipating fin enclosing a hollowed cavity inside the heat-dissipating fin; and a thermal transport within the hollowed cavity of each heat-dissipating fin, the thermal transport capable of convectively transferring the thermal load along a convective heat path within each heat-dissipating fin. Heat sinks for dissipating a thermal load may also include: a pair of electrodes inside each heat-dissipating fin electrically connected to the thermal transport for generating an electric current through the thermal transport; and a magnet mounted adjacent to the heat-dissipating fins for generating a magnetic field through the thermal transport, the magnetic field passing through the electric current and oriented to induce a force on the thermal transport along the convective heat path.

Abstract: An apparatus, system, and method for managing cooling within a printed circuit board (PCB) enclosure. The system includes a PCB having a first surface on which electronic components are mounted. Multiple contour control actuators are fixedly disposed in a substantially planar array in z-axis opposition to the first surface of the PCB. Each of the contour control actuators has an extensible end that is electromechanically extendable in parallel with the z-axis normal to the first surface of the PCB. A substantially flexible sheet member is disposed between the extensible ends of the contour control actuators and the first surface of the PCB. The extensible ends contact the flexible sheet member such that the z-axis contour of the flexible sheet member is determined by the z-axis positions of the extensible ends. A contour controller adjusts the z-axis contour of the flexible sheet member by adjusting the relative positions of the extensible ends of one or more of the contour control actuators.

Abstract: Disclosed is an electrical measurement probe including two probe blocks, each probe block having a connection face and a measurement face. Each probe block also includes a plurality of spring loaded pogo pins. Each pogo pin has a first end that extends to the connection face and a second end that protrudes from the measurement face. The two probe blocks are attached to a top plate. The top plate is attached to a face of each probe block opposite to the measurement face of the probe block.

Abstract: A method and circuit for generating a spread spectrum that will allow for precise control of the upper and lower frequencies of the fundamental to control the spread at the harmonics. The spread spectrum generation circuit of this invention includes a first clock producing a first frequency, a second clock producing a second frequency, the second frequency being set to a different frequency from the first frequency the second frequency being set to a different frequency from the first frequency. The circuit includes a phase locked loop circuit and the phased lock loop circuit includes a phase detector and the second clock. Following the phase locked loop circuit is a post divider that receives its input signal from the output of phase locked loop and then sends its output signal to an amplifier. The amplifier is used to amplify the input signal to produce an output signal that is the spread spectrum clock output for the circuit.

Abstract: Disclosed is an adjustable electrical connector. The connector includes a moveable structure including a plurality of return signal conductors disposed on a moveable block, and a fixed structure including a plurality of signal conductors. Each signal return conductor corresponds to and is electrically coupled to one of the plurality of signal conductors. The connector also includes a means for adjusting the electrical coupling of each signal conductor with the corresponding return signal conductor.

Abstract: Heat sinks for dissipating a thermal load are disclosed that include: a heat sink base capable of receiving a thermal load from a thermal source; heat-dissipating fins mounted on the heat sink base, each heat-dissipating fin enclosing a hollowed cavity inside the heat-dissipating fin; and a thermal transport within the hollowed cavity of each heat-dissipating fin, the thermal transport capable of convectively transferring the thermal load along a convective heat path within each heat-dissipating fin. Heat sinks for dissipating a thermal load may also include: a pair of electrodes inside each heat-dissipating fin electrically connected to the thermal transport for generating an electric current through the thermal transport; and a magnet mounted adjacent to the heat-dissipating fins for generating a magnetic field through the thermal transport, the magnetic field passing through the electric current and oriented to induce a force on the thermal transport along the convective heat path.

Abstract: A gasket for shielding a seam between two surfaces includes a resilient member, a first electrode, a second electrode and a conductive layer. The resilient member has a first side and an opposite second side. The first electrode is disposed on the first side of the resilient member. The second electrode is disposed on the second side of the resilient member. The conductive layer envelops at least a portion of the resilient member, the first electrode and the second electrode. The resilient member includes a material that is compressed when a first potential is applied between the first electrode and the second electrode and that is decompressed when a second potential, different from the first potential, is applied between the first electrode and the second electrode.

Abstract: In a first aspect, a method is provided for terminating a shield of a cable. The method includes the steps of (1) exposing a periphery region of the shield along a first portion of the cable; (2) coupling an electrically-conductive housing including an electrically-conductive gasket around the exposed periphery region; (3) applying a force to and maintaining the force on the gasket such that the gasket is forced against and remains in contact with an interior region of the housing and the exposed periphery region of the shield; and (4) coupling an exterior region of the housing to an electrically-conductive enclosure of an electronic product to which the cable is coupled. Numerous other aspects are provided.

Abstract: A modular heat sink and semiconductor chip assembly includes a semiconductor chip, a base plate disposed in a heat conducting relationship with the semiconductor chip and containing a plurality of slots extending through the base plate, a plurality of fins individually passed through a number of the plurality of slots and containing voltage-less input/output connections to facilitate grounding with the chip, and at least one electrical component passed through one of the plurality of slots and containing a high-density input/output structure on one edge and is electrically connected to the semiconductor chip.

Abstract: Heat sinks for dissipating a thermal load are disclosed that include a heat sink base having a thermal base channel inside the heat sink base, the heat sink base capable of receiving a thermal load from a thermal source, heat-dissipating fins mounted on the heat sink base, each heat-dissipating fin having a thermal fin channel inside the heat-dissipating fin, and a thermal transport within the thermal base channel and the thermal fin channel, the thermal transport capable of transferring the thermal load from the heat sink base to the heat-dissipating fins. Methods for parallel dissipation of a thermal load are disclosed that include receiving, in a heat sink base, a thermal load from a thermal source, transferring the thermal load to heat-dissipating fins mounted on the heat sink base through a conductive heat path, and transferring the thermal load to the heat-dissipating fins through a convective heat path.