Abstract: A method for making bread with rice flour being a chief component using a bread maker is provided. The method includes the steps of: intermittently kneading the rice flour for thirty seconds to two minutes at a temperature of 32±10° C., and generally kneading the rice flour for 15 minutes to 25 minutes at a temperature of 32±10° C.; primarily fermenting the kneaded rice flour for 3 minutes to 30 minutes at a temperature of 32±10° C. to 34±10° C., and performing gas-out for one minute to 10 minutes at a temperature of 32±10° C. to 34±10° C.; and secondarily fermenting the gas-out rice flour for thirty minutes to ninety minutes at a temperature of 32±10° C. to 34±10° C., and baking the fermented rice flour for ten minutes and fifty minutes at a temperature of 134±10° C. to 140±10° C.

Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.

Abstract: A multilayer substrate, comprising a first substrate, a connector and a second substrate, is disclosed. The first substrate has a circuit pattern. The connector, coupling onto the first substrate, has a ring structure, in which a plurality of holes are separated a predetermined distance from one another. The second substrate, coupling onto the second substrate by inserting the connector, has a circuit pattern, which is electrically connected to a circuit pattern formed on the first substrate using the plurality of holes formed on the connector. A multilayer substrate and a method for producing it in accordance with the present invention can shield the EMI generated by a high-speed switching element.

Abstract: The present invention provides a multilayered chip capacitor (MLCC) comprising internal electrodes and external electrodes formed to be perpendicular to the internal electrodes, whereby parasitic capacitance is reduced, resulting in no parallel resonance frequency effects. In addition, the MLCC has a capacitor structure, which provides a first surface and a second surface formed in a stacking direction of the dielectric layers in the capacitor body as a top surface and a bottom surface. Hence, in the thin capacitors having the same size, the number of internal electrode layers is increased, thereby reducing the ESR and ESL. Further, the PCB having an embedded MLCC is easily manufactured.