Abstract: A circuit and method for generating a read complete signal for a high speed densely packaged monolithic memory is disclosed. The memory is designed to utilize an externally generated address valid signal which indicates that the address to the memory is valid. The receipt of the address valid signal sets a set/reset latch and starts the memory. The addressed memory cells are sensed. When at least one memory cell has data at its output below a threshold, the data are said to be unstable and the set/reset latch is then conditioned to be reset. When the data sensed by all the sensing circuits are stable, a signal is sent to the set/reset latch to cause it to be reset. The resetting of the set/reset latch causes an output thereof to change state. This state change comprises the read complete signal which is used to determine the read cycle time of the memory and may also be used in diagnostic tests of the memory.

Abstract: Disclosed are improved LSI semiconductor design structures termed "Master Image Chip Organization Techniques". Utilizing the technique provides increased density and optimized performance of semiconductor devices, circuits, and part number functions.In accordance with the disclosed Master Image Chip Organization Method the semiconductor chips are optimally structured to facilitate the maximum number of devices and circuits, and to facilitate fabrication of a wide variety of LSI part numbers. Essentially, none of the semiconductor surface is dedicated for signal and power wiring channels. A master image wiring structure is provided which resides over the semiconductor surface and beneath a power surface. In addition, the master image wiring structure provides a means for personalizing power and signal wiring for a multiple power surface structure.

Abstract: Disclosed is an improved masterslice design technique including structure, wiring, and method of fabricating, to provide improved Large Scale Integrated Devices.In accordance with the improved masterslice technique a plurality of semiconductor chips are provided wherein essentially the entire semiconductor surface area of each chip is utilized to provide cells selectable to be personalized (wired). None of the semiconductor surface area is dedicated for wiring channels. The individual cell area and cell configuration is optimally arrived at to facilitate wiring the maximum number, if not all of the cells contained on each chip, whereby circuit density is materially improved and a wide variety LSI device part numbers may be readily fabricated.

Abstract: A method for forming an improved integrated circuit chip structure having a surface from which regions of different conductivity type are arranged in a plurality of electrically isolated macro circuits, each macro circuit including interconnected components, a first X pattern of equally spaced parallel conductors overlying and electrically insulated from said chip structure surface, said first X pattern of conductors being selectively connected to at least certain ones of said plurality of macro circuits, a second Y pattern of equally spaced parallel conductors overlying and electrically insulated from said first pattern of parallel conductors, said second Y pattern of conductors being selectively connected to at least selected certain ones of said first pattern of electrical conductors, said spacing one from another of said first X pattern of conductors being equal to said spacing one from another of said second Y pattern of conductors, said first pattern of conductors being orthogonal of said second pattern