Patents by Inventor Donald F. Canaperi

Donald F. Canaperi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for electroplating pin grid array packaging modules
    Patent number: 5516416
    Abstract: An apparatus and a method for electroplating pin grid array (PGA) packaging modules by utilizing a compressible member and an electrically conductive foil for providing electrical connections to the pins such that all the critical areas of the pins, the wire bond pads, the seal band and the die cavity are electroplated simultaneously through the connection to the pins.
    Type: Grant
    Filed: December 14, 1994
    Date of Patent: May 14, 1996
    Assignee: International Business Machines Corporation
    Inventors: Donald F. Canaperi, Kim H. Ruffing
  • Conditioning a dielectric substrate for plating thereon
    Patent number: 4910049
    Abstract: A dielectric substrate is conditioned for plating from an electroless metal plating bath by providing the surface or surfaces of the substrate that are to be plated with semiconductor material whereby the semiconductor material, in the case of n-type material, exhibits energy band where the valence band is equal to or higher than and, in the case of p-type material, exhibits energy band where the valence band is equal to or lower than the redox potential of the metallic ions in the electroless plating bath that are to be deposited as metal on the substrate.
    Type: Grant
    Filed: December 15, 1986
    Date of Patent: March 20, 1990
    Assignee: International Business Machines Corporation
    Inventors: Perminder S. Bindra, Donald F. Canaperi, Allan P. David, David N. Light