Abstract: An optical connector latch assembly for an optoelectronic module that can releasably engage an optical fiber connector that is received in a receptacle of the optoelectronic module. In one example embodiment, an optical connector latch arm includes a base, a shaft extending from the base, and a hook extending from the shaft. In this example embodiment, the base defines a complementary structure that is configured to engage a complementary structure of an OSA connector block. Also, the hook is configured to releasably engage an optical fiber connector.

Abstract: An optical subassembly (“OSA”) connector block that can accommodate OSAs of a variety of different configurations. In one example embodiment, an OSA connector block includes a body. The body of the OSA connector block includes a first end defining a receptacle, and a second end defining a cavity. The receptacle is configured to receive at least a portion of an optical fiber connector. The cavity is configured to receive at least a portion of an OSA.

Abstract: Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a conductive lead structure that is encased in a plurality of polymer casings. The polymer casings provide electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. One or more passive components can mount to the conductors of the lead frame connector to aid with impedance matching between an optical sub-assembly, the lead frame connector, and the printed circuit board. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board.

Abstract: A receptacle that is configured to receive connectors of different types. If a connector of one type is received into the receptacle, the connector contacts engage one set of receptacle contacts. If a connector of another type is received into the receptacle, the connector contacts engage another set of receptacle contacts, and so forth for potentially other connector types and other contact sets. A communication system may also control which PHY circuitry communicates with the receptacle depending on which connector type is plugged into the receptacle.

Abstract: The case temperature measurement device for an optoelectronic transceiver includes a case with at least one thermally conductive wall, at least one optical component at least partially disposed within the case, circuitry electrically coupled to the optical component. The circuitry includes a temperature sensor coupled to the circuitry. The case temperature measurement device also includes at least one protrusion formed on the wall of the case of the optoelectronic transceiver. The protrusion is thermally coupled to temperature sensor via a thermal pad. A method for estimating case temperature of the optoelectronic transceiver based on an internal temperature measurement and knowledge of the relationship between the measured internal temperature and the actual case temperature, and compensating for the effects of variable heat sources within the transceiver upon this estimate.

Abstract: Presented is a detachable module connector comprising a main body with a first section, a second section, and a first opening extending through the first section and the second section, wherein the inner dimensions of the opening in the first section are different from the inner dimensions of the opening in the second section and the opening in the first section is sized to fit around a printed circuit board. The detachable connector is used to couple an electronic module that includes a printed circuit board to a host device. Also presented is a method of building a module using this detachable connector. The detachable connector simplifies the module manufacturing process because the module does not involve the costly hand-soldering and pcb-turning steps of the conventional methods.

Abstract: Methods of manufacturing lead frame connectors for use in connecting optical sub-assemblies to printed circuit boards in optical transceiver modules are disclosed. The lead frame connectors are formed by first stamping a selected configuration of conductors in a conductive ribbon. Each of the conductors can then be secured in a fixed position with respect to each other. A casing having a first part and a second part can then be molded about the conductors such that each of the conductors forms an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The conductors can be bent into any desired position to allow the electrical contacts to be connected to the optical sub assembly and the contact points to be connected to the printed circuit board.

Abstract: A module that includes a housing and a latch assembly at least partially positioned within the housing. The latch assembly has first and second associated states, and includes an actuation sleeve having a first position that corresponds with the first state, and a second position that corresponds with the second state. The latch assembly further includes first and second latch arms operably disposed with respect to the actuation sleeve so that respective first and second cam arrangements are defined where the latch arms are responsive to motion of the actuation sleeve. The latch arms partially extend from the housing when the actuation sleeve is in the first position, and the latch arms are substantially retracted within the housing when the actuation sleeve is in the second position.

Abstract: A module housing for minimizing electromagnetic radiation leakage and a transceiver module built with this housing are presented. The housing includes a cover and a base disengagably coupled to each other, and a first and second layer of sidewalls located between the cover and the base. The two layers of sidewalls have different dimensions from each other so that a printed circuit board is enclosed in a space formed by the base, the cover, and either only the second layer of sidewall or both the first and second layer of sidewalls, depending on the thickness of the board. Another aspect of the invention is a pcb coupled to a connector and a housing for the pcb that includes an electromagnetic radiation shield between electronic components on the pcb and the connector. The shield reduces the amount of radiation reaching the connector. Also disclosed is a method of building this module.

Abstract: Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include one or more stamped and bent conductors that are encased in a plurality of casings. The casings provide electrical insulation for the conductors in the lead frame connector as well as mechanical support for the finished component. The casing is also configured to extend between a top portion and a base portion of the transceiver module to direct forces applied to the transceiver module away from the optical sub-assembly and the printed circuit board.

Abstract: An electrical connector receptacle that includes receptacle-side electrical contacts, a socket, and a receptacle shield. The socket is configured such that a connector may be inserted therein allowing the electrical contacts of the connector to interface with the receptacle-side electrical contacts. The receptacle shield is placed in the back of the receptacle, and is composed of an Electro-Magnetic Interference barrier material. In one embodiment, the receptacle shield is configured to interface with an EMI barrier of the connector, and includes separate slots through which electrical connections may pass.

Abstract: An electrical connector having an electrical interface assembly electrical processing circuitry, and an EMI barrier. The electrical interface assembly has a plurality of electrical contacts for interfacing with a receptacle when the electrical connector is connected to a corresponding receptacle. The electrical processing circuitry is for processing electrical signals received from at least some of the plurality of electrical contacts and/or to be sent to the plurality of electrical contacts. The EMI barrier substantially contains the electrical processing circuitry except at a number of EMI barrier openings. The largest of these EMI barrier openings is where the electrical contacts pass through the connector.

Abstract: An edge connector suitable for attachment with a printed circuit board. The edge connector comprises a body composed of a plastic resin, the body defining a first end that is configured to operably attach to a portion of a printed circuit board and a second end configured to operably connect to a slot in a host device and a plurality of conductive traces and contact pads defined on a portion of a surface of the body, the traces being configured to electrically connect with corresponding traces defined on the printed circuit board.

Abstract: An electromagnetic radiation containment system is provided for use in connection with functional modules and an associated card cage disposed in the chassis of an electronic equipment enclosure. The electromagnetic radiation containment system includes conductive elements uniformly distributed about the perimeter of a functional module configured to be received within the card cage, and further includes grounding elements in electrical communication with the chassis so that when the functional module is positioned within a slot of the card cage, at least some of the conductive elements are in electrical communication with the grounding elements. The uniform distribution of the conductive elements on the functional module(s) enables the functional modules to be arranged above and below each other, as well as side by side, without compromising the electromagnetic radiation containment functionality that is afforded when each of the slots of the card cage is occupied.

Abstract: A flexible circuit comprises a flexible substrate having first and second opposing surfaces. The flexible substrate can include multiple layers. A plurality of electrical traces can be mounted on either or both surfaces of the flexible substrate. A plurality of electrical components can also be mounted on either or both surfaces of the flexible substrate. A plurality of tooling cutouts is recessed in the sides of the flexible circuit. The tooling cutouts can have various shapes, such as, but not limited to, semi-circular, multiple straight edges, a single or multiple curved edges, etc. The cutouts are used to position and hold the flexible circuit in at least one other device.

Abstract: Flexible printed circuit boards interconnect to adjacent electronic devices through one or more of high speed data, low speed data, high current, and ground lines and pads. The design of the high speed data pads and traces and adjacent ground pads and traces maintains a desired impedance in the flexible circuit and at the transition from the flexible circuit to a printed circuit board, a ceramic header, or other device to ensure high speed operation. The pads are preferably arranged in a two dimensional geometry such that a connecting area of the flexible circuit is narrower than it would preferably be if the pads were arranged linearly. The two dimensional array also allows the use of the high current thermoelectric cooler pads, which require large surface areas that may otherwise not fit in a conventional linear array.

Abstract: Methods for assembly of optical transceivers. In one example, the method is performed in connection with an optical transceiver that includes a transmitter optical subassembly and a receiver optical subassembly, as well as structure that defines a pair of ports with which the transmitter optical subassembly and receiver optical subassembly, respectively, are to be aligned. This example of the method involves positioning the transmitter optical subassembly and the receiver optical subassembly in a desired position relative to each other. The transmitter optical subassembly and the receiver optical subassembly are then fixed in the desired position. Next, the transmitter optical subassembly is aligned with one of the ports, and the receiver optical subassembly is aligned with the other port. The alignment of both the transmitter optical subassembly and the receiver optical subassembly with their respective ports is performed in a single operation.

Abstract: An embodiment disclosed herein relates to a communications module. The communications module includes a body composed of a plastic resin and a plurality of conductive traces and contact pads defined on a portion of a surface of the body. The module also includes at least one substantially vertical ridge defined on the body surface, and at least one pocket defined on the body suitable for receiving an electronic component. The communications module may also include a body composed of a plastic resin and conductive features defined on a surface of the body configured to render the communications module operable without implementing a printed circuit board as part of the body. Additional embodiments relate to systems and methods for attaching one or more optical transmit assemblies to the communications module and for electrically connecting conductive traces in a temporary fashion on the surface of the body of the communications module.

Abstract: In one example, an optical subassembly positioning plate is provided that includes a substantially flat body that defines at least one edge. A port is defined in the body. The port is configured to receive and secure an optical subassembly in an x-direction and a y-direction when said optical subassembly positioning plate is positioned within an optoelectronic transceiver module. A plurality of fingers is defined along at least one edge of the body. Each of the plurality of fingers is configured to contact a shell of the optoelectronic transceiver module so as to bias a flange of the optical subassembly against a portion of the shell of the optoelectronic transceiver module such that the optical subassembly is substantially retained in a z-direction when the optical subassembly positioning plate is positioned within the optoelectronic transceiver module.

Abstract: In one example embodiment, a collar clip includes a body that is sized and configured to partially encircle a shell of an optoelectronic transceiver module. Each extended element in a pair of the extended elements is separated from the other extended element in the pair by a cavity. Each cavity is configured to receive a portion of a corresponding structure of the shell.