Abstract: A module that includes a housing and a latch assembly at least partially positioned within the housing. The latch assembly has first and second associated states, and includes an actuation sleeve having a first position that corresponds with the first state, and a second position that corresponds with the second state. The latch assembly further includes first and second latch arms operably disposed with respect to the actuation sleeve so that respective first and second cam arrangements are defined where the latch arms are responsive to motion of the actuation sleeve. The latch arms partially extend from the housing when the actuation sleeve is in the first position, and the latch arms are substantially retracted within the housing when the actuation sleeve is in the second position.

Abstract: Integrated optical subassemblies (OSA) such as integrated transmit and receive optical subassemblies that may be implemented with an optical transceiver module that includes a molded body. The integrated OSA includes a mounting surface defined on a vertical portion of the molded body, a wall extending about the mounting surface, at least one optoelectronic device, such as a laser diode or a photodiode mounted on a transimpendence amplifier, positioned on the mounting surface, a plurality of bond pads included on the mounting surface in electrical connection with the at least one optoelectronic device, a plurality of conductive feedthroughs defined through the mounting surface, each feedthrough being in electrical communication with a corresponding one of the bond pads; and an optical fiber port that engages the wall extending about the mounting surface, wherein the optical fiber port is configured for receiving an optical fiber cable.

Abstract: An electromagnetic interference (“EMI”) shield that can help control the emission of electromagnetic radiation from an optoelectronic module in which the EMI shield is positioned. In one example embodiment, an EMI shield includes a base and plurality of flanges extending from a perimeter of the base. The base defines an optical subassembly (“OSA”) opening and a plurality of complementary structures. The OSA opening is configured to receive an OSA. Each complementary structure is configured to engage a complementary structure of an OSA connector block.

Abstract: A communications device may include a connector block. The connector block may include a port. The port may be sized and configured to couple an optical fiber plug. The communications device may include an optical subassembly that may be connected to the connector block. The connector block may include a mount. The mount may be sized and configured to align the connector block and the optical subassembly. The mount may be configured as an EMI shield.

Abstract: A communications device may include a connector block. The connector block may include a port. The port may be sized and configured to couple an optical fiber plug. The communications device may include an optical subassembly that may be connected to the connector block. The connector block may include a mount. The mount may be sized and configured to align the connector block and the optical subassembly. The mount may be configured as an EMI shield.

Abstract: An optical connector latch assembly for an optoelectronic module that can releasably engage an optical fiber connector that is received in a receptacle of the optoelectronic module. In one example embodiment, an optical connector latch arm includes a base, a shaft extending from the base, and a hook extending from the shaft. In this example embodiment, the base defines a complementary structure that is configured to engage a complementary structure of an OSA connector block. Also, the hook is configured to releasably engage an optical fiber connector.

Abstract: An optical subassembly (“OSA”) connector block that can accommodate OSAs of a variety of different configurations. In one example embodiment, an OSA connector block includes a body. The body of the OSA connector block includes a first end defining a receptacle, and a second end defining a cavity. The receptacle is configured to receive at least a portion of an optical fiber connector. The cavity is configured to receive at least a portion of an OSA.

Abstract: A heat sink and module cage assembly for receiving a pluggable electronics component, such as an opto-electronic transceiver module. The heat sink is attached to the module cage and includes a bottom surface forming one of four sidewalls of a chamber that receives the electronics component. The attachment of the heat sink in this manner enables the heat sink and module cage to be assembled during fabrication and prior to the assembly being shipped to a third party who may use the assembly on a printed circuit board. The top surface of the heat sink defines a plane that enables the assembly to be press fitted onto the printed circuit board using a flat rock tool. The sidewall of the cage assembly opposite the bottom surface of the heat sink includes leaf springs that bias the electronics module against the heat sink, thereby facilitating heat transfer to the heat sink.

Abstract: Methods of manufacturing lead frame connectors for use in connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors are formed by first stamping a selected configuration of conductors in a conductive ribbon. The conductors are bent as necessary and passed in a reel-to-reel manner through an insert injection molding process to form an electrically insulating casing about the conductors. After the molding process, the ribbon is singulated to obtain individual lead frame connectors. The individual conductors encased in the casing can be electrically separated by punching out a connecting conductive structure through a hole formed in the casing. The connecting conductive structure mechanically secures the conductors to each other during the molding process and, when punched out, substantially eliminate stubs that could otherwise degrade the RF performance of the lead frame connectors.

Abstract: A functional module is provided for use in conjunction with an electronic equipment enclosure that includes a card cage having two end card guides and one or more middle card guides interposed between the end card guides. The functional module includes a double-wide card that is configured to be removably received in the card cage. The double-wide card includes electronic circuitry and defines a cutout configured to engage a middle card guide. When the functional module is operably positioned in the electronic equipment enclosure, the edges of the double wide card are supported by the end card guide and the cutout engages the middle card guide so that the double-wide card straddles the middle card guide and is supported thereby.

Abstract: An optoelectronic package is attached to a printed circuit board, in which optoelectronic package has a shaped lead configuration. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In one embodiment, an optical subassembly is disclosed, comprising a header containing optoelectronic components, and a plurality of conductive leads that are in operable communication with the optoelectronic components. Each lead includes a straight portion extending from a surface of the header, an end portion oriented so as to be received by a through-hole via defined in a printed circuit board, and a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane. The optical subassembly further includes a clip assembly having a plurality of cavities that each receive a corresponding one of the leads.

Abstract: An optical subassembly is used in connection with an optoelectronic package with a shaped lead configuration. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In one embodiment, an optical subassembly is disclosed, comprising a header containing optoelectronic components, and a plurality of conductive leads that are in operable communication with the optoelectronic components. Each lead includes a straight portion extending from a surface of the header, an end portion oriented so as to be received by a through-hole via defined in a printed circuit board, and a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane. The optical subassembly further includes a clip assembly having a plurality of cavities that each receive a corresponding one of the leads.

Abstract: This disclosure concerns EMI control in electronics systems. In one example, an electromagnetic radiation containment system is provided for use in connection with functional modules and an associated card cage disposed in the chassis of an electronic equipment enclosure. The electromagnetic radiation containment system includes conductive elements uniformly distributed about the perimeter of a functional module configured to be received within the card cage, and further includes grounding elements in electrical communication with the chassis so that when the functional module is positioned within a slot of the card cage, at least some of the conductive elements are in electrical communication with the grounding elements. Electrical communication between the conductive elements and circuitry of the functional module facilitates EMI control in the electronic equipment enclosure.

Abstract: Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a stamped and bent conductive lead structure that is encased in a plurality of insert injection molded plastic casings. The plastic casings provide electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board.

Abstract: In one example, an optical transceiver is provided that includes a ROSA and a TOSA received within a block portion of an OSA block. The OSA block also includes two groups of adjustable elements, one group for each of the ROSA and the TOSA. The adjustable elements of the first group engage the block portion so as to contact the ROSA, and the adjustable elements of the second group engage the block portion so as to contact the TOSA. The position of the adjustable elements in each respective group can then be varied as necessary to locate and/or maintain the ROSA and TOSA in desired positions and orientations relative to, for example, respective optical connector ports of the optical transceiver.

Abstract: An optoelectronic package is attached to a printed circuit board, in which optoelectronic package has a shaped lead configuration. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In one embodiment, an optical subassembly is disclosed, comprising a header containing optoelectronic components, and a plurality of conductive leads that are in operable communication with the optoelectronic components. Each lead includes a straight portion extending from a surface of the header, an end portion oriented so as to be received by a through-hole via defined in a printed circuit board, and a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane. The optical subassembly further includes a clip assembly having a plurality of cavities that each receive a corresponding one of the leads.

Abstract: A PCB is provided that is suitable for use in applications where EMI control is of interest. The PCB includes circuitry that communicates with an edge connector having edge traces located on its surface. Additionally, embedded traces are disposed within the dielectric material of the PCB, and each embedded trace electrically connects an edge trace with a corresponding median trace located on a surface of the PCB. An embedded ground layer substantially disposed within the dielectric material defines an area within the dielectric material through which the embedded traces pass. Finally, one or more vias are provided that extend through the dielectric material of the PCB and are filled with a conductive material. The vias are electrically connected to the embedded ground layer and configured to electrically communicate with an associated module. In this way, a structure is implemented that facilitates control of electromagnetic radiation emitted by the PCB circuitry.

Abstract: A card cage system is provided that includes a middle card guide interposed between two end card guides in an electronic equipment enclosure. Each of the card guides includes one or more channels adapted to receive a card edge. The middle card guide includes a removable adapter element that can permit insertion of two single wide cards in a side-by-side arrangement. When the adapter element is removed, a double-wide card can be received in the middle card guide such that it straddles the middle card guide. One or more elongate members can also be inserted in any of the card guides to add vertical or lateral stability. Thus, the card guide can be readily customized to accommodate a variety of card types and sizes, in various arrangements.

Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The electrical contact is aligned with and soldered to the leads that protrude from the back end of an optical sub-assembly. The contact points can then be connected to electrical pads on a PCB.

Abstract: An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical subassemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical subassemblies and transceiver printed circuit boards.