Patents by Inventor Donald William KIDWELL, JR.
Donald William KIDWELL, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11785399Abstract: A device comprising a first printed circuit board (PCB); a second printed circuit board (PCB); a first flex board coupled to the first PCB and the second PCB; a first integrated device coupled to the first PCB; a speaker configured to be coupled to the first integrated device; a microphone configured to be coupled to the first integrated device; a second integrated device coupled to the second PCB, wherein the second integrated device is configured to be coupled to the first integrated device through the second PCB, the first flex board and the first PCB; and a power source configured to provide power to the first integrated device and the second integrated device. The first PCB is located between the power source and the first integrated device. The second PCB is located between the power source and the second integrated device.Type: GrantFiled: November 2, 2021Date of Patent: October 10, 2023Assignee: QUALCOMM INCORPORATEDInventors: Ravindra Shenoy, Rohit Sauhta, Elbert McLaren, Sidney Sitachitt, Donald William Kidwell, Jr.
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Patent number: 11620806Abstract: Various aspects of the present disclosure generally relate to optical character detection. In some aspects, a user device may receive, from a vision sensor, a first image that is associated with a first optical character image. The user device may determine, using an image processing model, that the first image depicts the first optical character image. The user device may cause, based at least in part on determining that the first image depicts the first optical character image, a camera to capture a second image that is associated with a second optical character image. The user device may perform an action associated with the second image. Numerous other aspects are provided.Type: GrantFiled: June 4, 2020Date of Patent: April 4, 2023Assignee: QUALCOMM IncorporatedInventors: Ravishankar Sivalingam, Russell Gruhlke, Ravindra Vaman Shenoy, Donald William Kidwell, Jr., Evgeni Gousev, Kebin Li, Khurshid Syed Alam, Edwin Chongwoo Park, Arnold Jason Gum
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Publication number: 20220383018Abstract: In some aspects, a device may detect that an object is contacting a display of the device. The device may illuminate, based at least in part on detecting that the object is contacting the display, a plurality of pixel regions of the display. The plurality of pixel regions may be illuminated sequentially. The device may obtain, using one or more photosensors, a set of data relating to light that is reflected from at least a portion of the object based at least in part on illuminating the plurality of pixel regions. The set of data may include respective data for each sequential illumination of the plurality of pixel regions. The device may generate an image of at least the portion of the object based at least in part on the set of data. Numerous other aspects are described.Type: ApplicationFiled: May 25, 2021Publication date: December 1, 2022Inventors: Russell GRUHLKE, Ravishankar SIVALINGAM, Donald William KIDWELL, JR., Edwin Chongwoo PARK
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Patent number: 11411321Abstract: An antenna system includes: a ground conductor; a substrate; a pair of planar dipole conductors disposed such that at least a portion of the substrate is disposed between the ground conductor and the pair of dipole conductors; a pair of energy couplers each electrically connected to a respective one of the pair of dipole conductors; and a pair of isolated lobes including electrically-conductive material. The pair of isolated lobes are electrically separate from the pair of dipole conductors and the pair of energy couplers, and disposed between the pair of dipole conductors and the ground conductor.Type: GrantFiled: December 5, 2019Date of Patent: August 9, 2022Assignee: QUALCOMM IncorporatedInventors: Jon Lasiter, Donald William Kidwell, Jr., Ravindra Vaman Shenoy, Mohammad Ali Tassoudji, Jeremy Darren Dunworth, Vladimir Aparin, Yu-Chin Ou, Seong Heon Jeong
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Publication number: 20220116717Abstract: A device comprising a first printed circuit board (PCB); a second printed circuit board (PCB); a first flex board coupled to the first PCB and the second PCB; a first integrated device coupled to the first PCB; a speaker configured to be coupled to the first integrated device; a microphone configured to be coupled to the first integrated device; a second integrated device coupled to the second PCB, wherein the second integrated device is configured to be coupled to the first integrated device through the second PCB, the first flex board and the first PCB; and a power source configured to provide power to the first integrated device and the second integrated device. The first PCB is located between the power source and the first integrated device. The second PCB is located between the power source and the second integrated device.Type: ApplicationFiled: November 2, 2021Publication date: April 14, 2022Inventors: Ravindra SHENOY, Rohit SAUHTA, Elbert MCLAREN, Sidney SITACHITT, Donald William KIDWELL, JR.
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Publication number: 20210398314Abstract: Systems, methods, and non-transitory media are provided for low-power visual tracking systems. An example method can include receiving one or more images captured by each image sensor system from a set of image sensor systems on a first device, the one or more images capturing a set of patterns on a second device, wherein the first device has lower power requirements than the second device, the set of patterns having a predetermined configuration on the second device; determining, from the one or more images captured by each image sensor system, a set of pixels corresponding to the set of patterns on the second device; determining, based on the set of pixels corresponding to the set of patterns, a location and relative pose in space of each pattern; and determining, based on the location and relative pose of each pattern, a pose of the first device relative to the second device.Type: ApplicationFiled: June 17, 2020Publication date: December 23, 2021Inventors: Ravishankar SIVALINGAM, Donald William KIDWELL, JR., Russell GRUHLKE, Edwin Chongwoo PARK, Khurshid Syed ALAM
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Patent number: 11206499Abstract: A device that includes a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device and a power source configured to provide power to the first integrated device, the speaker and the microphone. The device has a length of about 2.4 centimeter (cm) or less, and a diameter of about 1.2 centimeter (cm) or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit to enable wireless charging of the power source.Type: GrantFiled: August 15, 2017Date of Patent: December 21, 2021Assignee: QUALCOMM IncorporatedInventors: Ravindra Shenoy, Rohit Sauhta, Elbert McLaren, Sidney Sitachitt, Donald William Kidwell, Jr.
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Publication number: 20210175636Abstract: An antenna system includes: a ground conductor; a substrate; a pair of planar dipole conductors disposed such that at least a portion of the substrate is disposed between the ground conductor and the pair of dipole conductors; a pair of energy couplers each electrically connected to a respective one of the pair of dipole conductors; and a pair of isolated lobes including electrically-conductive material. The pair of isolated lobes are electrically separate from the pair of dipole conductors and the pair of energy couplers, and disposed between the pair of dipole conductors and the ground conductor.Type: ApplicationFiled: December 5, 2019Publication date: June 10, 2021Inventors: Jon LASITER, Donald William KIDWELL, JR., Ravindra Vaman SHENOY, Mohammad Ali TASSOUDJI, Jeremy Darren DUNWORTH, Vladimir Aparin, Yu-Chin OU, Seong Heon JEONG
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Patent number: 10867740Abstract: Some aspects pertain to an inductor apparatus that includes a first metal layer including a plurality of first interconnects, a second metal including a plurality of second interconnects, a first dielectric layer between the first metal layer and the second metal layer, and an inductor. The inductor includes a plurality of vias, where the plurality of vias are configured to couple the plurality of first interconnects to the plurality of second interconnects. The inductor includes a plurality of inductor loops formed by the plurality of vias, the plurality of first interconnects and the plurality of second interconnects. The inductor further includes a first magnetic layer and a second magnetic layer, located between the first interconnects and the second interconnects; and a third magnetic layer and an optional fourth magnetic layer outside of the plurality of inductor loops.Type: GrantFiled: November 30, 2017Date of Patent: December 15, 2020Assignee: QUALCOMM IncorporatedInventors: Donald William Kidwell, Jr., Ravindra Vaman Shenoy, Alan Lewis, Christopher Feuling Ferguson
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Publication number: 20200387734Abstract: Various aspects of the present disclosure generally relate to optical character detection. In some aspects, a user device may receive, from a vision sensor, a first image that is associated with a first optical character image. The user device may determine, using an image processing model, that the first image depicts the first optical character image. The user device may cause, based at least in part on determining that the first image depicts the first optical character image, a camera to capture a second image that is associated with a second optical character image. The user device may perform an action associated with the second image. Numerous other aspects are provided.Type: ApplicationFiled: June 4, 2020Publication date: December 10, 2020Inventors: Ravishankar SIVALINGAM, Russell GRUHLKE, Ravindra Vaman SHENOY, Donald William KIDWELL, JR., Evgeni GOUSEV, Kebin LI, Khurshid Syed ALAM, Edwin Chongwoo PARK, Arnold Jason Gum
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Patent number: 10770646Abstract: Techniques and structures are provided for manufacturing a flexible PMUT array. In one embodiment, a piezoelectric micromechanical ultrasonic transducer (PMUTs) array comprises a plurality of PMUTs, where each PMUT in the flexible array of PMUTs includes: a first polymer layer configured to support the PMUT, a mechanical layer configured to provide planarization to the PMUT, a first electrode, a second electrode, a piezoelectric layer configured to separate the first electrode and the second electrode, patterns on the first electrode, the piezoelectric material, and the second electrode configured to route electrical signals, and a cavity configured to adjust a frequency response of the PMUT.Type: GrantFiled: February 27, 2017Date of Patent: September 8, 2020Assignee: QUALCOMM IncorporatedInventors: Donald William Kidwell, Jr., Ravindra Shenoy, Jon Lasiter
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Patent number: 10734332Abstract: In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.Type: GrantFiled: December 12, 2017Date of Patent: August 4, 2020Assignee: QUALCOMM IncorporatedInventors: Jon Bradley Lasiter, Ravindra Vaman Shenoy, Donald William Kidwell, Jr., Mohammad Ali Tassoudji, Vladimir Aparin, Seong Heon Jeong, Jeremy Dunworth, Alireza Mohammadian, Mario Francisco Velez, Chin-Kwan Kim
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Patent number: 10722918Abstract: Methods, systems, computer-readable media, and apparatuses for high density Micro-Electro-Mechanical Systems (MEMS) are presented. In some embodiments, a method for manufacturing a micro-electro-mechanical device on a substrate can comprise etching a release via through a layer of the device. The method can further comprise creating a cavity in the layer of the device using the release via as a conduit to access the desired location of the cavity, the cavity enabling movement of a transducer of the device. The method can then comprise depositing low impedance, electrically conductive material into the release via to form an electrically conductive path through the layer. Finally, the method can comprise electrically coupling the electrically conductive material to an electrode of the transducer.Type: GrantFiled: September 1, 2016Date of Patent: July 28, 2020Assignee: QUALCOMM IncorporatedInventors: Donald William Kidwell, Jr., Ravindra Shenoy, Jon Lasiter
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Patent number: 10685924Abstract: An package and related methods are disclosed. The package may include an antenna, an insert made of low-loss material, and a mold, wherein the mold directly contacts and surrounds at least a portion of the insert, wherein the antenna is formed of conductive material disposed at least in part on a surface of the insert.Type: GrantFiled: August 24, 2017Date of Patent: June 16, 2020Assignee: QUALCOMM IncorporatedInventors: Jon Bradley Lasiter, Ravindra Vaman Shenoy, Donald William Kidwell, Jr., Mohammad Ali Tassoudji, Mario Francisco Velez
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Patent number: 10618079Abstract: An apparatus may include one or more segmented piezoelectric micromechanical ultrasonic transducer (PMUT) elements. Each segmented PMUT element may include a substrate, an anchor structure disposed on the substrate and a membrane disposed proximate the anchor structure. The membrane may include a piezoelectric layer stack and a mechanical layer. The anchor structure may include boundary portions that divide the segmented PMUT element into segments. Each segment may have a corresponding segment cavity. The boundary portions may correspond to nodal lines of the entire membrane. The membrane may include a membrane segment disposed proximate each segment cavity. The membrane may be configured to undergo one or both of flexural motion and vibration when the segmented PMUT element receives or transmits signals.Type: GrantFiled: February 23, 2017Date of Patent: April 14, 2020Assignee: QUALCOMM IncorporatedInventors: Donald William Kidwell, Jr., Ravindra Vaman Shenoy, Jon Bradley Lasiter
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Patent number: 10497748Abstract: An ultrasonic sensor pixel includes a substrate, a piezoelectric micromechanical ultrasonic transducer (PMUT) and a sensor pixel circuit. The PMUT includes a piezoelectric layer stack including a piezoelectric layer disposed over a cavity, the cavity being disposed between the piezoelectric layer stack and the substrate, a reference electrode disposed between the piezoelectric layer and the cavity, and one or both of a receive electrode and a transmit electrode disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The sensor pixel circuit is electrically coupled with one or more of the reference electrode, the receive electrode and the transmit electrode and the PMUT and the sensor pixel circuit are integrated with the sensor pixel circuit on the substrate.Type: GrantFiled: October 12, 2016Date of Patent: December 3, 2019Assignee: QUALCOMM IncorporatedInventors: Hrishikesh Vijaykumar Panchawagh, Suryaprakash Ganti, Kostadin Dimitrov Djordjev, David William Burns, Timothy Alan Dickinson, Donald William Kidwell, Jr., Ravindra Vaman Shenoy, Jon Bradley Lasiter, Hao-Yen Tang, Yipeng Lu
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Patent number: 10490880Abstract: The disclosure relates to a glass-based antenna array package. In an aspect, such a glass-based antenna array package includes a single glass substrate layer, one or more antennas attached to a first side of the glass substrate layer, at least one semiconductor device attached to a second side of the glass substrate layer, and a first photoimageable dielectric layer adhered to the second side of the glass substrate layer and encapsulating the at least one semiconductor device. A method of manufacturing the same is also disclosed.Type: GrantFiled: September 18, 2017Date of Patent: November 26, 2019Assignee: QUALCOMM IncorporationInventors: Jon Bradley Lasiter, Ravindra Vaman Shenoy, Donald William Kidwell, Jr., Mohammad Ali Tassoudji, Mario Francisco Velez
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Publication number: 20190164681Abstract: Some aspects pertain to an inductor apparatus that includes a first metal layer including a plurality of first interconnects, a second metal including a plurality of second interconnects, a first dielectric layer between the first metal layer and the second metal layer, and an inductor. The inductor includes a plurality of vias, where the plurality of vias are configured to couple the plurality of first interconnects to the plurality of second interconnects. The inductor includes a plurality of inductor loops formed by the plurality of vias, the plurality of first interconnects and the plurality of second interconnects. The inductor further includes a first magnetic layer and a second magnetic layer, located between the first interconnects and the second interconnects; and a third magnetic layer and an optional fourth magnetic layer outside of the plurality of inductor loops.Type: ApplicationFiled: November 30, 2017Publication date: May 30, 2019Inventors: Donald William KIDWELL, JR., Ravindra Vaman SHENOY, Alan LEWIS, Christopher Feuling FERGUSON
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Publication number: 20190067221Abstract: In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.Type: ApplicationFiled: December 12, 2017Publication date: February 28, 2019Inventors: Jon Bradley LASITER, Ravindra Vaman SHENOY, Donald William KIDWELL, JR., Mohammad Ali TASSOUDJI, Vladimir APARIN, Seong Heon JEONG, Jeremy DUNWORTH, Alireza MOHAMMADIAN, Mario Francisco VELEZ, Chin-Kwan KIM
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Publication number: 20190067219Abstract: An package and related methods are disclosed. The package may include an antenna, an insert made of low-loss material, and a mold, wherein the mold directly contacts and surrounds at least a portion of the insert, wherein the antenna is formed of conductive material disposed at least in part on a surface of the insert.Type: ApplicationFiled: August 24, 2017Publication date: February 28, 2019Inventors: Jon Bradley LASITER, Ravindra Vaman SHENOY, Donald William KIDWELL, JR., Mohammad TASSOUDJI, Mario Francisco VELEZ