Patents by Inventor Donald William KIDWELL, JR.
Donald William KIDWELL, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10199152Abstract: An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the second substrate, or both. The conductor can have an input and an output. The conductor can be configured to surround the first substrate without being in contact with the first substrate and without being in contact with the magnetic piece.Type: GrantFiled: June 18, 2015Date of Patent: February 5, 2019Assignee: QUALCOMM IncorporatedInventors: Mete Erturk, Ravindra Vaman Shenoy, Kwan-yu Lai, Jitae Kim, Donald William Kidwell, Jr., Jon Bradley Lasiter, James Thomas Doyle, Omar James Bchir
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Publication number: 20180342788Abstract: The disclosure relates to a glass-based antenna array package. In an aspect, such a glass-based antenna array package includes a single glass substrate layer, one or more antennas attached to a first side of the glass substrate layer, at least one semiconductor device attached to a second side of the glass substrate layer, and a first photoimageable dielectric layer adhered to the second side of the glass substrate layer and encapsulating the at least one semiconductor device. A method of manufacturing the same is also disclosed.Type: ApplicationFiled: September 18, 2017Publication date: November 29, 2018Inventors: Jon Bradley LASITER, Ravindra Vaman SHENOY, Donald William KIDWELL, JR., Mohammad Ali TASSOUDJI, Mario Francisco VELEZ
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Patent number: 10109784Abstract: Embodiments of a sensor device and methods for manufacturing the same are disclosed. In one embodiment, a sensor device comprises a piezoelectric micromechanical ultrasonic transducer (PMUT) array configured to transmit and receive ultrasonic signals, where the PMUT array comprises a plurality of PMUTs and the PMUT array is flexible, one or more integrated circuits configured to process the ultrasonic signals, a battery configured to provide power to the PMUT array and the one or more integrated circuits, a coupling material configured to hold the PMUT array, the one or more integrated circuits, and the battery, and a capsule configured to seal the PMUT array, the one or more integrated circuits, the battery and the coupling material within the capsule.Type: GrantFiled: September 12, 2016Date of Patent: October 23, 2018Assignee: QUALCOMM IncorporatedInventors: Donald William Kidwell, Jr., Ravindra Shenoy, Jon Lasiter
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Publication number: 20180054682Abstract: A device that includes a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device and a power source configured to provide power to the first integrated device, the speaker and the microphone. The device has a length of about 2.4 centimeter (cm) or less, and a diameter of about 1.2 centimeter (cm) or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit to enable wireless charging of the power source.Type: ApplicationFiled: August 15, 2017Publication date: February 22, 2018Inventors: Ravindra SHENOY, Rohit SAUHTA, Elbert MCLAREN, Sidney SITACHITT, Donald William KIDWELL, JR.
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Publication number: 20170343346Abstract: A device may include a surface at least partially defining an enclosed region, a plurality of fluids within the enclosed region, the plurality of fluids comprising at least a first fluid having a first acoustic impedance and a second fluid having a second acoustic impedance different from the first acoustic impedance, a first piezoelectric transducer disposed on the surface, the first piezoelectric transducer being configured to generate a first wave reception signal based, at least in part, on an ultrasonic return wave received through at least one of the plurality of fluids, and a processor coupled to the first piezoelectric transducer and configured to determine a measurement of a tilt of the device based, at least in part, on the first wave reception signal.Type: ApplicationFiled: May 31, 2016Publication date: November 30, 2017Inventors: Firas SAMMOURA, Stephanie FUNG, Donald William KIDWELL, JR., Ravindra Vaman SHENOY, David William BURNS
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Patent number: 9773862Abstract: Provided are space-efficient capacitors that have a higher quality factor than conventional designs and improve coupling of electrical energy from a through-glass via (TGV) to a dielectric. For example, provided is a TGV having a non-rectangular cross-section, where one end of the TGV is coupled to a first metal plate. A dielectric material is formed on the first metal plate. A second metal plate is formed on the dielectric material in a manner that overlaps at least a portion of the first metal plate to form at least one overlapped region of the dielectric material. At least a part of the perimeter of the overlapped region is non-planar. The overlapped region can be formed in a shape of a closed ring, in a plurality of portions of a ring shape, in substantially a quarter of a ring shape, and/or in substantially a half of a ring shape.Type: GrantFiled: December 11, 2016Date of Patent: September 26, 2017Assignee: QUALCOMM IncorporatedInventors: Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Donald William Kidwell, Jr., Jon Bradley Lasiter, Kwan-Yu Lai, Jitae Kim, Ravindra Vaman Shenoy
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Publication number: 20170256699Abstract: Embodiments of a sensor device and methods for manufacturing the same are disclosed. In one embodiment, a sensor device comprises a piezoelectric micromechanical ultrasonic transducer (PMUT) array configured to transmit and receive ultrasonic signals, where the PMUT array comprises a plurality of PMUTs and the PMUT array is flexible, one or more integrated circuits configured to process the ultrasonic signals, a battery configured to provide power to the PMUT array and the one or more integrated circuits, a coupling material configured to hold the PMUT array, the one or more integrated circuits, and the battery, and a capsule configured to seal the PMUT array, the one or more integrated circuits, the battery and the coupling material within the capsule.Type: ApplicationFiled: September 12, 2016Publication date: September 7, 2017Inventors: Donald William Kidwell, JR., Ravindra Shenoy, Jon Lasiter
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Publication number: 20170252777Abstract: Embodiments of a flexible PMUT array and methods for manufacturing the same are disclosed. In one embodiment, a piezoelectric micromechanical ultrasonic transducer (PMUTs) array comprises a plurality of PMUTs, where each PMUT in the flexible array of PMUTs includes: a first polymer layer configured to support the PMUT, a mechanical layer configured to provide planarization to the PMUT, a first electrode, a second electrode, a piezoelectric layer configured to separate the first electrode and the second electrode, patterns on the first electrode, the piezoelectric material, and the second electrode configured to route electrical signals, and a cavity configured to adjust a frequency response of the PMUT.Type: ApplicationFiled: February 27, 2017Publication date: September 7, 2017Inventors: Donald William Kidwell, JR., Ravindra Shenoy, Jon Lasiter
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Publication number: 20170246662Abstract: An apparatus may include one or more segmented piezoelectric micromechanical ultrasonic transducer (PMUT) elements. Each segmented PMUT element may include a substrate, an anchor structure disposed on the substrate and a membrane disposed proximate the anchor structure. The membrane may include a piezoelectric layer stack and a mechanical layer. The anchor structure may include boundary portions that divide the segmented PMUT element into segments. Each segment may have a corresponding segment cavity. The boundary portions may correspond to nodal lines of the entire membrane. The membrane may include a membrane segment disposed proximate each segment cavity. The membrane may be configured to undergo one or both of flexural motion and vibration when the segmented PMUT element receives or transmits signals.Type: ApplicationFiled: February 23, 2017Publication date: August 31, 2017Inventors: Donald William Kidwell, JR., Ravindra Vaman Shenoy, Jon Bradley Lasiter
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Publication number: 20170125512Abstract: Provided are space-efficient capacitors that have a higher quality factor than conventional designs and improve coupling of electrical energy from a through-glass via (TGV) to a dielectric. For example, provided is a TGV having a non-rectangular cross-section, where one end of the TGV is coupled to a first metal plate. A dielectric material is formed on the first metal plate. A second metal plate is formed on the dielectric material in a manner that overlaps at least a portion of the first metal plate to form at least one overlapped region of the dielectric material. At least a part of the perimeter of the overlapped region is non-planar. The overlapped region can be formed in a shape of a closed ring, in a plurality of portions of a ring shape, in substantially a quarter of a ring shape, and/or in substantially a half of a ring shape.Type: ApplicationFiled: December 11, 2016Publication date: May 4, 2017Inventors: Changhan Hobie YUN, Daeik Daniel KIM, Chengjie ZUO, Jonghae KIM, Mario Francisco VELEZ, Donald William KIDWELL JR, Jon Bradley LASITER, Kwan-Yu LAI, Jitae KIM, Ravindra Vaman SHENOY
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Publication number: 20170110504Abstract: An ultrasonic sensor pixel includes a substrate, a piezoelectric micromechanical ultrasonic transducer (PMUT) and a sensor pixel circuit. The PMUT includes a piezoelectric layer stack including a piezoelectric layer disposed over a cavity, the cavity being disposed between the piezoelectric layer stack and the substrate, a reference electrode disposed between the piezoelectric layer and the cavity, and one or both of a receive electrode and a transmit electrode disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The sensor pixel circuit is electrically coupled with one or more of the reference electrode, the receive electrode and the transmit electrode and the PMUT and the sensor pixel circuit are integrated with the sensor pixel circuit on the substrate.Type: ApplicationFiled: October 12, 2016Publication date: April 20, 2017Inventors: Hrishikesh Vijaykumar Panchawagh, Suryaprakash Ganti, Kostadin Dimitrov Djordjev, David William Burns, Timothy Alan Dickinson, Donald William Kidwell, JR., Ravindra Vaman Shenoy, Jon Bradley Lasiter, Hao-Yen Tang, Yipeng Lu
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Publication number: 20170066014Abstract: Methods, systems, computer-readable media, and apparatuses for high density Micro-Electro-Mechanical Systems (MEMS) are presented. In some embodiments, a method for manufacturing a micro-electro-mechanical device on a substrate can comprise etching a release via through a layer of the device. The method can further comprise creating a cavity in the layer of the device using the release via as a conduit to access the desired location of the cavity, the cavity enabling movement of a transducer of the device. The method can then comprise depositing low impedance, electrically conductive material into the release via to form an electrically conductive path through the layer. Finally, the method can comprise electrically coupling the electrically conductive material to an electrode of the transducer.Type: ApplicationFiled: September 1, 2016Publication date: March 9, 2017Inventors: Donald William Kidwell, JR., Ravindra Shenoy, Jon Lasiter
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Patent number: 9548350Abstract: Provided are space-efficient capacitors that have a higher quality factor than conventional designs and improve coupling of electrical energy from a through-glass via (TGV) to a dielectric. For example, provided is a TGV having a non-rectangular cross-section, where one end of the TGV is coupled to a first metal plate. A dielectric material is formed on the first metal plate. A second metal plate is formed on the dielectric material in a manner that overlaps at least a portion of the first metal plate to form at least one overlapped region of the dielectric material. At least a part of the perimeter of the overlapped region is non-planar. The overlapped region can be formed in a shape of a closed ring, in a plurality of portions of a ring shape, in substantially a quarter of a ring shape, and/or in substantially a half of a ring shape.Type: GrantFiled: February 10, 2014Date of Patent: January 17, 2017Assignee: QUALCOMM IncorporatedInventors: Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Donald William Kidwell, Jr., Jon Bradley Lasiter, Kwan-Yu Lai, Jitae Kim, Ravindra Vaman Shenoy
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Patent number: 9496213Abstract: An integrated device package includes a die and a package substrate. The package substrate includes at least one dielectric layer (e.g., core layer, prepeg layer), a magnetic core in the dielectric layer, a first plurality of interconnects configured to operate as a first protective ring, and a second plurality of interconnects configured to operate as a first inductor. The second plurality of interconnects is positioned in the package substrate to at least partially surround the magnetic core. At least one interconnect from the second plurality of interconnects is also part of the first plurality of interconnects. In some implementations, the first protective ring is a non-contiguous protective ring. In some implementations, the first inductor is a solenoid inductor. In some implementations, the magnetic core includes a carrier, a first magnetic layer, and a second magnetic layer.Type: GrantFiled: August 26, 2015Date of Patent: November 15, 2016Assignee: QUALCOMM IncorporatedInventors: Donald William Kidwell, Jr., Ravindra Shenoy, Mete Erturk, Layal Rouhana
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Publication number: 20160233153Abstract: An integrated device package includes a die and a package substrate. The package substrate includes at least one dielectric layer (e.g., core layer, prepeg layer), a magnetic core in the dielectric layer, a first plurality of interconnects configured to operate as a first protective ring, and a second plurality of interconnects configured to operate as a first inductor. The second plurality of interconnects is positioned in the package substrate to at least partially surround the magnetic core. At least one interconnect from the second plurality of interconnects is also part of the first plurality of interconnects. In some implementations, the first protective ring is a non-contiguous protective ring. In some implementations, the first inductor is a solenoid inductor. In some implementations, the magnetic core includes a carrier, a first magnetic layer, and a second magnetic layer.Type: ApplicationFiled: August 26, 2015Publication date: August 11, 2016Inventors: Donald William Kidwell, JR., Ravindra Shenoy, Mete Erturk, Layal Rouhana
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Publication number: 20160163443Abstract: An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the second substrate, or both. The conductor can have an input and an output. The conductor can be configured to surround the first substrate without being in contact with the first substrate and without being in contact with the magnetic piece.Type: ApplicationFiled: June 18, 2015Publication date: June 9, 2016Inventors: Mete ERTURK, Ravindra Vaman SHENOY, Kwan-yu LAI, Jitae KIM, Donald William KIDWELL JR., Jon Bradley LASITER, James Thomas DOYLE, Omar James BCHIR
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Patent number: 9325420Abstract: An apparatus includes a substrate and a waveguide coupled to a surface of the substrate. The surface forms a cladding layer of the waveguide. The apparatus includes a photodetector optically coupled to an end of the waveguide. The photodetector is configured to output an electrical signal responsive to receiving a light signal from a core of the waveguide. The apparatus also includes an amplifier device coupled to the substrate. The amplifier device is electrically coupled to the photodetector to amplify the electrical signal to produce an amplified electrical signal.Type: GrantFiled: May 16, 2014Date of Patent: April 26, 2016Assignee: QUALCOMM IncorporatedInventors: Kwan-yu Lai, Ravindra Vaman Shenoy, Jitae Kim, Jon Bradley Lasiter, Donald William Kidwell, Jr., Evgeni Petrovich Gousev
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Patent number: 9263370Abstract: A semiconductor device comprising a second surface of a logic die and a second surface of a via bar coupled to a first surface of a substrate, a second surface of a memory die coupled to a first surface of the via bar, a portion of the second surface of the memory die extending over the first surface of the logic die, such that the logic die and the memory die are vertically staggered, and the memory die electrically coupled to the logic die through the via bar. The via bar can be formed from glass, and include through-glass vias (TGVs) and embedded passives such as resistors, capacitors, and inductors. The semiconductor device can be formed as a single package or a package-on-package structure with the via bar and the memory die encapsulated in a package and the substrate and logic die in another package.Type: GrantFiled: September 27, 2013Date of Patent: February 16, 2016Assignee: QUALCOMM MEMS Technologies, Inc.Inventors: Ravindra Vaman Shenoy, Kwan-yu Lai, Jon Bradley Lasiter, Philip Jason Stephanou, Donald William Kidwell, Jr., Evgeni Gousev
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Publication number: 20150333831Abstract: An apparatus includes a substrate and a waveguide coupled to a surface of the substrate. The surface forms a cladding layer of the waveguide. The apparatus includes a photodetector optically coupled to an end of the waveguide. The photodetector is configured to output an electrical signal responsive to receiving a light signal from a core of the waveguide. The apparatus also includes an amplifier device coupled to the substrate. The amplifier device is electrically coupled to the photodetector to amplify the electrical signal to produce an amplified electrical signal.Type: ApplicationFiled: May 16, 2014Publication date: November 19, 2015Applicant: QUALCOMM IncorporatedInventors: Kwan-yu Lai, Ravindra Vaman Shenoy, Jitae Kim, Jon Bradley Lasiter, Donald William Kidwell, JR., Evgeni Petrovich Gousev
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Publication number: 20150311271Abstract: One or more high-inductance, high-quality factor (Q) three-dimensional inductors, for example, solenoid or toroid inductors with small form factors, are provided in an integrated circuit package, such as an integrated fanout package.Type: ApplicationFiled: August 5, 2014Publication date: October 29, 2015Inventors: Mete ERTURK, Ravindra Vaman SHENOY, Kwan-yu LAI, Donald William KIDWELL, JR., Jitae KIM, Jon Bradley LASITER