Patents by Inventor Dong Han Kang

Dong Han Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120342
    Abstract: A transistor array substrate includes a substrate, an active layer disposed on the substrate and including a channel region, a source region and a drain region, a gate insulating layer disposed on a part of the active layer, a gate electrode overlapping the channel region of the active layer and included in an electrode conductive layer which is disposed on the gate insulating layer, a source electrode included in the electrode conductive layer and in contact with a part of the source region of the active layer, and a drain electrode included in the electrode conductive layer and in contact with a part of the drain region of the active layer. The active layer includes an oxide semiconductor including crystals and is disposed as an island shape excluding a hole in a plan view.
    Type: Application
    Filed: June 10, 2023
    Publication date: April 11, 2024
    Inventors: Sung Gwon MOON, Dong Han KANG, Jee Hoon KIM, Seung Sok SON, Shin Hyuk YANG, Woo Geun LEE
  • Publication number: 20240122006
    Abstract: A display device includes a data conductive layer including a first power line, a passivation layer with a first opening exposing the first power line, a via layer with a second opening partially overlapping the first opening, a pixel electrode on the via layer, a connection electrode in the first and second openings, a pixel-defining film with an opening overlapping the second opening, a light-emitting layer on the pixel-defining film, the pixel electrode and the connection electrode, and a common electrode connected to the first power line. The data conductive layer includes a data base layer, a data main metal layer, and a data capping layer, the first power line includes a wire connection structure, in which the data main metal layer is recessed from sides of the data capping layer, and the common electrode is connected to the data main metal layer in the wire connection structure.
    Type: Application
    Filed: August 28, 2023
    Publication date: April 11, 2024
    Inventors: Shin Hyuk YANG, Dong Han KANG, Jee Hoon KIM, Sung Gwon MOON, Seung Sok SON, Woo Geun LEE
  • Publication number: 20240099085
    Abstract: A display device includes a pixel. The pixel is electrically connected to a first power line, a second power line, and a data line. The pixel includes a first transistor, and a capacitor electrically connected between a gate electrode of the first transistor and an electrode of the first transistor. In a plan view, the data line extends in a second direction. The first power line extends in a first direction intersecting the second direction and overlaps the data line and the gate electrode of the first transistor. The second power line extends in the second direction, overlaps the data line, and overlaps the gate electrode of the first transistor.
    Type: Application
    Filed: August 8, 2023
    Publication date: March 21, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Sung Chan HWANG, Dong Hyun KIM, Chul Kyu KANG, Hey Jin SHIN, Seo Won CHOE, Chae Han HYUN
  • Publication number: 20230354664
    Abstract: A display device includes a substrate, an emission layer disposed on the substrate, and a plurality of signal lines disposed on the substrate, electrically connected to the emission layer, and including a first signal line. The first signal line includes a first layer including a refractory metal, a second layer disposed on the first layer and including a low-resistance metal, a third layer disposed on the second layer and including a first metal oxide, and a fourth layer disposed on the third layer and including a second metal oxide, and the first metal oxide of the third layer includes the low-resistance metal of the second layer.
    Type: Application
    Filed: March 7, 2023
    Publication date: November 2, 2023
    Applicant: Samsung Display Co., LTD.
    Inventors: Shin Hyuk YANG, Jee Hoon KIM, Dong Han KANG
  • Publication number: 20210134923
    Abstract: A display device includes a substrate which includes a display area and a non-display area, a transistor disposed in the display area, a pad disposed in the non-display area, and an insulating layer which is disposed on the transistor and defines an opening which overlaps the pad in a plan view. The pad includes a main layer, a first auxiliary layer on the main layer, and a second auxiliary layer on the first auxiliary layer, and the second auxiliary layer defines the opening.
    Type: Application
    Filed: June 29, 2020
    Publication date: May 6, 2021
    Inventors: Jee Hoon KIM, Shin Hyuk YANG, Jong Moo HUH, Dong Han KANG, Min Chul SHIN, Jun Ki LEE, Jae Seol CHO
  • Publication number: 20150144952
    Abstract: A display substrate, method of manufacturing the same, and a display device including the same are disclosed. In one aspect, a display substrate includes a first gate electrode formed on a base substrate, a scan line electrically connected to the first gate electrode, a gate insulation layer, an etch stop layer and a passivation layer formed on the base substrate to at least partially overlap the first gate electrode and the scan line, and a data line formed on the passivation layer to at least partially overlap the scan line.
    Type: Application
    Filed: October 22, 2014
    Publication date: May 28, 2015
    Inventors: Sun-Kwang Kim, Chaun-Gi Choi, Dong-Han Kang, Jae-Sik Kim, Hyeon-Sik Kim, Woong-Hee Jeong
  • Publication number: 20140327001
    Abstract: The present invention relates to a method for manufacturing an oxide semiconductor thin film transistor and to an actively operating display device and actively operating sensor display device using the same. A method for manufacturing an oxide semiconductor thin film transistor includes: forming a gate electrode by depositing and patterning a gate layer over a substrate; sequentially depositing a gate insulation film, an oxide semiconductor, and an etch stopper over the gate electrode and patterning the etch stopper; patterning the oxide semiconductor; forming a source electrode and a drain electrode over the patterned oxide semiconductor; and depositing a protective layer over the source electrode and the drain electrode and forming a contact hole in the protective layer, where the oxide semiconductor is formed to a thickness that is smaller than or equal to 4 nm.
    Type: Application
    Filed: July 21, 2014
    Publication date: November 6, 2014
    Inventors: Jin Jang, Mallory Mativenga, Dong Han Kang
  • Publication number: 20140123810
    Abstract: The present invention is related to a manufacturing method of high purity and refined Ru (Ruthenium) powder produced by using a waste Ru target. Yield of the target and physical properties of a thin film are improved by producing tremendously refined in which oxygen content of the target is decreased, and a crystal particle size is reduced. In order to obtain these merits, powder having a hollow inside is produced by applying plasma to a waste Ru target. Carbon impurities are selectively removed through a atmospheric heat process and Ru powder is oxidized. Thereby, Ru oxide (RuOx) powder is produced. High purity and refined Ru powder is acquired through a hydrogen atmospheric heat process after pulverizing the produced Ru oxide (RuOx) powder into refined shape.
    Type: Application
    Filed: January 31, 2012
    Publication date: May 8, 2014
    Applicant: Hee Sung Metal Ltd.
    Inventors: Won Kyu Yoon, Seung Ho Yang, Gil Su Hong, Hong Sik Kim, Dong Han Kang
  • Patent number: 8691142
    Abstract: Zr—Ti—Ni(Cu)-based filler alloy composition having low melting point for brazing titanium and titanium alloys is expressed as: ZraTibNic (Formula 1) where a, b and c denote atomic % of Zr, Ti and Ni, respectively; 47?a?52; 24?b?30; 22?c?26; and 0.3<c/(a+c)<0.35, or ZraTibNicCud (Formula 2) where a, b, c and d denote atomic % of Zr, Ti, Ni and Cu respectively; 48?a?60; 20?b?28; 19?c+d?30; 3?d?12; and 0.12<d/(c+d)?0.5. Including Zr(Ti) solid solution phase as major constituent phase, the alloy compositions have lower liquidus temperature than those of conventional alloys and they include a little amount of Cu or does not include it at all. When the alloy is used as filler alloy for brazing titanium and titanium alloys, brazing can be performed at remarkably low temperature. This can inhibit the microstructure of titanium base metal from changing and being damaged, keeping the titanium base metal preserving inherent properties after brazing.
    Type: Grant
    Filed: July 3, 2012
    Date of Patent: April 8, 2014
    Assignee: Korea Institute of Industrial Technology
    Inventors: Seung-Yong Shin, Dong-Myoung Lee, Ju-Hyun Sun, Yong-Hwan Kim, Dong-Han Kang
  • Patent number: 8486330
    Abstract: Disclosed is Zr—Ti—Ni(Cu)-based filler alloy composition having low melting point for brazing titanium and titanium alloys. The Zr—Ti—Ni(Cu)-based alloy composition is expressed as: ZraTibNic (Formula 1) where a, b and c denote atomic % of Zr, Ti and Ni, respectively; 47?a?52; 24?b?30; 22?c?26; and 0.3<c/(a+c)<0.35, or ZraTibNicCud (Formula 2) where a, b, c and d denote atomic % of Zr, Ti, Ni and Cu respectively; 48?a?60; 20?b?28; 19?c+d?30; 3?d?12; and 0.12<d/(c+d)?0.5. Including Zr(Ti) solid solution phase as its major constituent phase, the alloy compositions of this invention have lower liquidus temperature than those of conventional alloys and they include a little amount of Cu or does not include it at all. When alloy of the present invention is used as filler alloy for brazing titanium and titanium alloys, brazing can be performed at remarkably low temperature.
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: July 16, 2013
    Assignees: Korea Institute of Industrial Technology, Yosan Eng. Ltd.
    Inventors: Seung-Yong Shin, Dong-Myoung Lee, Ju-Hyun Sun, Yong-Hwan Kim, Dong-Han Kang
  • Publication number: 20120275947
    Abstract: Zr—Ti—Ni(Cu)-based filler alloy composition having low melting point for brazing titanium and titanium alloys is expressed as: ZraTibNic (Formula 1) where a,b and c denote atomic % of Zr, Ti and Ni, respectively; 47?a?52; 24?b?30; 22?c?26; and 0.3<c/(a+c)<0.35, or ZraTibNicCud (Formula 2) where a,b,c and d denote atomic % of Zr, Ti, Ni and Cu respectively; 48?a?60; 20?b?28; 19?c+d?30; 3?d?12; and 0.12<d/(c+d)?0.5. Including Zr(Ti) solid solution phase as major constituent phase, the alloy compositions have lower liquidus temperature than those of conventional alloys and they include a little amount of Cu or does not include it at all. When the alloy is used as filler alloy for brazing titanium and titanium alloys, brazing can be performed at remarkably low temperature. This can inhibit the microstructure of titanium base metal from changing and being damaged, keeping the titanium base metal preserving inherent properties after brazing.
    Type: Application
    Filed: July 3, 2012
    Publication date: November 1, 2012
    Applicants: YOSAN ENG. LTD., KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: SEUNG-YONG SHIN, DONG-MYOUNG LEE, JU-HYUN SUN, YONG-HWAN KIM, DONG-HAN KANG
  • Publication number: 20120167176
    Abstract: A method and apparatus for pairing between Bluetooth devices, If a pairing between Bluetooth devices is requested, a six-digit passkey is generated in an authentication process based on secure simple pairing (SSP). If a Bluetooth device (BD) address of a correspondent device is pre-registered and there are characters designated to the BD address, the designated characters instead of the passkey are outputted.
    Type: Application
    Filed: December 23, 2011
    Publication date: June 28, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Daniel Hwang, Dong-Han Kang, Sang-Cheong Kim
  • Patent number: 8145188
    Abstract: A mobile terminal and method for transferring call charges between mobile terminals are disclosed. To transfer call-related charges between mobile terminals, the mobile terminal and call charge transfer method place a call by a calling mobile terminal to a called mobile terminal to establish a call connection for conversation, transmit a call transfer request by the calling mobile terminal to impose call-related charges on the called mobile terminal, and perform, if the called mobile terminal accepts the call transfer request, a call transfer operation to impose the call-related charges on the called mobile terminal, and maintain, if the called mobile terminal rejects the call transfer request, the call to impose the call-related charges on the calling mobile terminal. As a result, during a call between mobile terminals, the called user can accept a call transfer request of the calling user to transfer call-related charges to the called party, thereby enabling flexible and efficient billing.
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: March 27, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: So Jeong Park, Bo Keun Kim, Dong Han Kang, Jae Gwan Shin, Chang Min Oh
  • Publication number: 20120044149
    Abstract: A misinput avoidance method of a mobile terminal may be implemented to prevent a misinput caused by contacting unintended keys around the target key. A misinput avoidance method of a mobile terminal according to the present invention includes detecting inputs of a plurality of keys and discriminating a target key from other keys. The method also includes extracting keys around the target key and registering the keys around the target keys as neighbor keys. The method further includes processing the input of the target key while blocking the inputs of the neighbor keys. The method further includes releasing, when the target key is released, the blocking of the inputs of the neighbor keys.
    Type: Application
    Filed: August 19, 2011
    Publication date: February 23, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Kyun Son, Dong Han Kang, Woo Chan Park, Jong Soo Woo, Sang Hoon Kang
  • Publication number: 20110223748
    Abstract: Disclosed herein is a method of crystallizing an amorphous material for use in fabrication of thin film transistors. The method includes forming an amorphous silicon layer on a substrate, depositing a Ni metal layer on part of the amorphous silicon layer, and heat-treating the amorphous silicon layer to cause phase transition of the amorphous silicon, wherein the Ni metal layer is deposited to an average thickness of 0.79 ? or less. The method can crystallize an amorphous material for use in thin film transistors using the metal induced lateral crystallization while restricting thickness and density of Ni, thereby minimizing current leakage in the thin film transistor.
    Type: Application
    Filed: May 19, 2009
    Publication date: September 15, 2011
    Applicant: KYUNGHEE UNIVERSITY INDUSTRIAL & ACADEMIC COLLABOR
    Inventors: Jin Jang, Jae-Hwan Oh, Dong-Han Kang, Jun-Hyuk Cheon
  • Publication number: 20110219323
    Abstract: A mobile device allows a letter input based on a cut or copy and paste technique. In a method for inputting a letter, the mobile device displays letters inputted by a user in a letter input window. The mobile device receives the selection of at least one of the displayed letters and the selection of a position in the letter input window. Then the mobile device moves and displays the selected at least one letter to the selected position. This letter input method is available for any types of the mobile devices regardless of being based on a touch screen or not.
    Type: Application
    Filed: March 3, 2011
    Publication date: September 8, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyun Chul Woo, Dong Han Kang
  • Publication number: 20110211987
    Abstract: Disclosed is Zr—Ti—Ni (Cu)-based filler alloy composition having low melting point for brazing titanium and titanium alloys. The Zr—Ti—Ni (Cu)-based alloy composition is expressed as: ZraTibNic (Formula 1) where a,b and c denote atomic % of Zr, Ti and Ni, respectively; 47<a<52; 24?b?30; 22<c<26; and 0.3<c/(a+c)<0.35, or ZraTibNicCud (Formula 2) where a,b,c and d denote atomic % of Zr, Ti, Ni and Cu respectively; 48?a?60; 20<b<28; 19<c+d<30; 3<d<12; and 0.12<d/(c+d)?0.5. Including Zr(Ti) solid solution phase as its major constituent phase, the alloy compositions of this invention have lower liquidus temperature than those of conventional alloys and they include a little amount of Cu or does not include it at all. When alloy of the present invention is used as filler alloy for brazing titanium and titanium alloys, brazing can be performed at remarkably low temperature.
    Type: Application
    Filed: August 7, 2008
    Publication date: September 1, 2011
    Applicants: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY, YOSAN ENG. LTD.
    Inventors: Seung-Yong Shin, Dong-Myoung Lee, Ju-Hyun Sun, Yong-Hwan Kim, Dong-Han Kang
  • Patent number: 7953398
    Abstract: The present invention provides a method for receiving an incoming call at a first mobile communication terminal including registering an identity of at least one second mobile communication terminal capable of performing local wireless communication with a first mobile communication terminal; checking, after receiving the incoming call at the first mobile communication terminal, whether a user's input is received by the first mobile communication terminal to accept the incoming call during a first time duration; and transmitting, if the user input is not received by the first mobile communication terminal, absence information to the second mobile communication terminal notifying the second mobile communication terminal of reception of the incoming call at the first mobile communication terminal using local wireless communication.
    Type: Grant
    Filed: July 5, 2007
    Date of Patent: May 31, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gyu Seok Shim, Dong Han Kang, Jae Gwan Shin, Chang Min Oh
  • Publication number: 20110099473
    Abstract: A method of processing an input signal of a portable device is provided, including collecting an input signal generated from at least one of an input unit and a touch screen; generating a preset repetitive input signal when the collected input signal corresponds to a preset condition input signal; and using an application that is currently activated based on the repetitive input signal.
    Type: Application
    Filed: October 19, 2010
    Publication date: April 28, 2011
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dong Kyun Son, Dong Han Kang, Woo Chan Park, Sang Hoon Kang
  • Patent number: 7739710
    Abstract: A method is provided for registering and displaying digital multimedia broadcasting (DMB) channels in a mobile terminal capable of receiving DMB. A selection of DMB mode is detected and electronic program guide (EPG) information is received. The received EPG information is analyzed and the analyzed received EPG information is divided into fixed program channel information and dynamic program channel information. The fixed program channel information is matched with a genre in which a fixed program channel has been registered, and a result of the matching is displayed. The dynamic program channel information is matched with a genre in which a dynamic program channel has been registered and a genre of a program currently being broadcast on the dynamic program channel, and a result of the matching is displayed.
    Type: Grant
    Filed: October 11, 2005
    Date of Patent: June 15, 2010
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Seong-Geun Kwon, Dong-Han Kang