Abstract: A semiconductor package including a premold which is used to define support structure for a semiconductor die which is mounted to the premold by a layer of suitable adhesive. Embedded within the premold are lands which each include oppose upper and lower surfaces exposed in respective ones of upper and lower surfaces define by the premold. The semiconductor die, which is attached to the upper surface of the premold by the adhesive layer, is electrically connected to the exposed upper surfaces of the lands through the use of conductive wires. The semiconductor die, conductive wires, and the upper surface of the premold are covered or encapsulated by a package body. The package body does not cover any portion of the lower surface of the premold, thus allowing the exposed lower surfaces of the lands to be placed into electrical connection or communication with an underlying substrate such as a PCB or motherboard.

Abstract: Sample loading device and electrostatic levitation apparatus. The electrostatic levitation apparatus includes a sample storage part including a rod-shaped sample standby part having an external diameter of a first diameter and a rod-shaped sample loading part having an external diameter of a second diameter and a sample cover part covering the sample standby part. The sample storage part has a loading bar inserting hole formed in its center. The loading bar inserting hole is formed through the sample standby part and is formed successively through a portion of the sample loading part. The sample standby part has sample storage vertical through-holes. The sample loading part has a single sample transfer vertical through-hole. The sample transfer vertical through-hole is formed on a surface where the sample storage vertical through-hole is viewed, penetrates the sample loading part, and is connected to the loading bar inserting hole.

Abstract: A levitation apparatus and a levitation method are provided. The levitation apparatus includes a top electrode and a bottom electrode disposed to be spaced apart from each other, a main power source adapted to apply a voltage to the top electrode or the bottom electrode such that a charged object levitates against gravity by using an electrostatic force generated by the voltage, a laser to heat the charged object, and spherical mirrors to re-reflect reflected light reflected from the charged object to the charged object. The reflected light may be generated when output light of the laser passing through a through-hole formed in a surface central region of each of the spherical mirrors is reflected by the charged object.

Abstract: Apparatuses and methods of transmitting a signal with reduced interference in a femto base station including a plurality of antennas having different radiation patterns are provided. A method includes transmitting common information through the plurality of antennas having the different radiation patterns; receiving feedback information corresponding to the common information; analyzing the feedback information; temporarily selecting one of the plurality of antennas as a transmission antenna, based on a result of the analyzing; and transmitting user information through the transmission antenna.

Abstract: A substrate for a semiconductor device and a manufacturing thereof, and a semiconductor device using the same and a manufacturing method thereof are disclosed. For example, in the substrate according to the present invention, a core is eliminated, so that the substrate has a very thin thickness, as well, the length of electrically conductive patterns becomes shorter, whereby the electrical efficiency thereof is improved. Moreover, since a carrier having a stiffness of a predetermined strength is bonded on the substrate, it can prevent a warpage phenomenon during the manufacturing process of the semiconductor device. Furthermore, the carrier is removed from the substrate, whereby a solder ball fusing process or an electrical connecting process of the semiconductor die can be easily performed.

Abstract: Apparatuses and methods of transmitting a signal with reduced interference in a femto base station including a plurality of antennas having different radiation patterns are provided. A method includes transmitting common information through the plurality of antennas having the different radiation patterns; receiving feedback information corresponding to the common information; analyzing the feedback information; temporarily selecting one of the plurality of antennas as a transmission antenna, based on a result of the analyzing; and transmitting user information through the transmission antenna.

Abstract: Beamforming in a Multiple Input Multiple Output (MIMO) wireless communication system is provided. An apparatus includes an estimator for estimating a channel matrix of at least one terminal compliant with a Time Division Duplex (TDD) scheme; a processor for confirming information indicative of a channel matrix fed back from at least one terminal compliant with a Frequency Division Duplex (FDD) scheme; and a controller for determining precoding vectors or terminals to be connected in a spatial multiple access manner, using the channel matrix of the at least one terminal compliant with the TDD scheme and a principal vector of the at least one terminal compliant with the FDD scheme.

Abstract: An OVSF (Orthogonal Variable Spreading Factor) code generating apparatus and method in a CDMA (Code Division Multiple Access) communication system. A shuffler shuffles an N-bit stream. Here, N is determined by the SF (Spreading code) of an OVSF code and N=log2SF. A counter outputs an N-bit count value, a first operation device AND-operates the shuffled bits with the N-bit count value bit by bit, and a second operation device XOR-operates the AND-operated bits and outputting the XOR-operated bits as an OVSF code.

Abstract: A predictor for differential pulse code modulation that designates a subset averaged median (SAM) predictor, which removes transmission errors and/or minimizes error propagation. The SAM predictor in a preferred embodiment operates according to SAM ⁢   ⁢ ( X ) = ∑ i = 1 P ⁢   ⁢ a i ⁢ F i ⁢ ( X ) where X is an input vector within a predictor window, P is the number of median subfilters, ai is an optionally selected coefficient and Fi( ) is a feature equation of an ith median subfilter.