Abstract: Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.

Abstract: An apparatus and system, as well as fabrication methods therefor, may include a plurality of vertically-oriented plates separated by dielectric layers, wherein the vertically-oriented plates include a plurality of terminals coupled to a bottom side of the plates.

Abstract: Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.

Abstract: Transmission line impedance matching for matching an impedance discontinuity on a transmission signal trace with one or more non-transmission traces disposed near the transmission signal trace at a region corresponding to the impedance discontinuity.

Abstract: A method including modifying a characteristic impedance along a length of a plating bar of a substrate package. An apparatus including a package substrate including a plurality of transmission lines therethrough, a portion of the plurality of transmission lines each including a plating bar coupled thereto, wherein the plating bar comprises portions having different characteristic impedance along its length. A system including a computing device including a microprocessor, the microprocessor coupled to a printed circuit board through a substrate, the substrate including a plurality of transmission lines therethrough, a portion of the plurality of transmission lines each including a plating bar coupled thereto, wherein the plating bar comprises portions having different characteristic impedance along its length.

Abstract: Transmission line impedance matching for matching an impedance discontinuity on a transmission signal trace with one or more non-transmission traces disposed near the transmission signal trace at a region corresponding to the impedance discontinuity.

Abstract: Transmission line impedance matching is described for matching an impedance discontinuity on a transmission signal trace. The apparatus includes a transmission signal trace and a non-transmission trace. The transmission signal trace has an impedance discontinuity, a first length, and a predetermined first width. The non-transmission trace is disposed near the transmission signal trace at a region corresponding to the impedance discontinuity. The non-transmission trace has a second length that is substantially less than the first length of the transmission signal trace. Additionally, the non-transmission trace is configured to be electromagnetically coupled to the transmission signal trace in the presence of a current on the transmission signal trace to provide a matched impedance on the transmission signal trace.

Abstract: An apparatus adapted to control transmission power in a mobile station comprises a power amplifier adapted to amplify a radio signal with a gain characteristic corresponding to a computed transmission level, and an automatic gain control unit adapted to generate an automatic gain control signal to control a gain of the power amplifier. The apparatus also comprises a temperature compensating unit adapted to compute a maximum output deviation of the mobile station according to a temperature variation of the power amplifier, the temperature compensating unit compensating the automatic gain control signal using a per temperature compensating value according to the computed deviations. The apparatus also comprises a control unit adapted to control the automatic gain control unit and the temperature compensating unit by sensing the temperature variation of the power amplifier and by detecting an output characteristic of the power amplifier according to the temperature variation.

Abstract: An apparatus comprises a signal layer including a first and second signal trace. The apparatus also comprises a first reference plane including a first slot substantially parallel to the first and second signal traces. Further, the apparatus includes a dielectric layer having at least a portion disposed between the signal layer and the first reference plane.

Abstract: Transmission line impedance matching for matching an impedance discontinuity on a transmission signal trace with one or more non-transmission traces disposed near the transmission signal trace at a region corresponding to the impedance discontinuity.

Abstract: Transmission line impedance matching is described for matching an impedance discontinuity on a transmission signal trace. The apparatus includes a transmission signal trace and a non-transmission trace. The transmission signal trace has an impedance discontinuity, a first length, and a predetermined first width. The non-transmission trace is disposed near the transmission signal trace at a region corresponding to the impedance discontinuity. The non-transmission trace has a second length that is substantially less than the first length of the transmission signal trace. Additionally, the non-transmission trace is configured to be electromagnetically coupled to the transmission signal trace in the presence of a current on the transmission signal trace to provide a matched impedance on the transmission signal trace.

Abstract: An apparatus comprises a signal layer including a first and second signal trace. The apparatus also comprises a first reference plane including a first slot substantially parallel to the first and second signal traces. Further, the apparatus includes a dielectric layer having at least a portion disposed between the signal layer and the first reference plane.

Abstract: Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.

Abstract: An apparatus and system, as well as fabrication methods therefor, may include a plurality of vertically-oriented plates separated by dielectric layers, wherein the vertically-oriented plates include a plurality of terminals coupled to a bottom side of the plates.

Abstract: In some embodiments, an apparatus includes a substrate and a pair of signal traces formed on the substrate. The signal traces may be spaced apart from each other. The apparatus may also include a filler material on the substrate and between the signal traces. The filler material may have a dielectric constant that is higher than a dielectric constant of a material of which the substrate is formed.

Abstract: An apparatus and system, as well as fabrication methods therefor, may include a plurality of vertically-oriented plates separated by dielectric layers, wherein the vertically-oriented plates include a plurality of terminals coupled to a bottom side of the plates.

Abstract: A socket electrically connects an integrated circuit package and a circuit board. The socket includes a frames having a plurality of electrical connectors mounted to the frame. The plurality of electrical connectors includes at least one pair of power and ground connectors, with power connector including a first broadside portion and the ground connector including a second broadside portion. The first and second broadside portion are disposed in an adjacent, spaced-apart, and substantially parallel relationship.

Abstract: An apparatus and system, as well as fabrication methods therefor, may include a plurality of vertically-oriented plates separated by dielectric layers, wherein the vertically-oriented plates include a plurality of terminals coupled to a bottom side of the plates.