Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a lower structure including a semiconductor chip having a chip terminal; an external connection terminal connecting the semiconductor chip to an external device; and an intermediate connection structure including an upper surface and a lower surface opposite to the upper surface, and positioned between the lower structure and the external connection terminal.

Abstract: A semiconductor package comprising a fan-out structure and a manufacturing method therefor are disclosed. A semiconductor package according to an embodiment of the present invention comprises: a wiring unit comprising an insulation layer and a wiring layer; a semiconductor chip mounted on the wiring unit and coupled to the wiring layer by flip-chip bonding; a filling member for filling a gap between the semiconductor chip and the wiring unit; and a film member for performing coating so as to cover one surface of each of the semiconductor chip, the filling member, and the wiring unit.

Abstract: An embodiment of the present invention provides a rubber composition for tires and a method for producing same, wherein the rubber composition for tires includes: carbon nanotubes including structural defects on at least a portion of the surface and having a thermal decomposition temperature equal to or less than 600° C.; and a rubber matrix.

Abstract: A technical idea of the present disclosure provides a semiconductor package, as a semiconductor package mounted on a circuit board, including: a body portion including a semiconductor chip, and a first surface and a second surface opposite to each other; and a structure including n insulating layers stacked on at least one of the first surface and the second surface of the body portion, wherein the semiconductor package has a predetermined target coefficient of thermal expansion (CTE), and the n insulating layers and the body portion have a thickness and a CTE satisfying a condition that an effective CTE of the semiconductor package becomes equal to the predetermined target CTE.

Abstract: A semiconductor package having improved impact resistance and excellent heat dissipation and electromagnetic wave shielding property, and a manufacturing method thereof are provided. There is provided a semiconductor package including: a chip having a contact pad provided on one surface thereof; a buffer layer formed on one surface of the chip; one or more wiring patterns disposed on the buffer layer, electrically connected to the contact pad of the chip, and extended to an outside of the chip; an external pad provided on the wiring pattern and electrically connected to the wiring pattern; an external connection terminal electrically connected to the external pad; and a mold layer formed to surround the other surface and a side surface of the chip and a side surface of the buffer layer, and formed up to the other surface of the wiring pattern.

Abstract: Disclosed is a semiconductor package including a semiconductor chip having a first surface adjacent to an active layer and a second surface opposite to the first surface; a conductive stud disposed on the first surface of the semiconductor chip and connected to the active layer; an adhesive layer disposed on the second surface of the semiconductor chip; a conductive post disposed outside the semiconductor chip; a first redistribution structure, which is on the first surface of the semiconductor chip and includes a first redistribution insulation layer supporting the conductive stud and the conductive post; a second redistribution structure, which is on the second surface of the semiconductor chip and includes a second redistribution insulation layer disposed on the adhesive layer; and a first molding layer disposed on the first redistribution structure and surrounding the semiconductor chip, the adhesive layer, the conductive stud, and the conductive post.

Abstract: Proposed is a system for closing a drum unit for storing radioactive waste, the system including: a supporting unit configured to be seated on the ground; a drum unit configured to be seated on a top part of the supporting unit and having a plurality of first fastening holes; a moving unit configured to move to a side of the drum unit; a cover unit provided at the inside of the moving unit or at one side of the drum unit and having a plurality of second fastening holes; tightening units configured to be inserted into the associated second fastening holes; a fastening unit configured to grip the cover unit through a gripping part to move the cover unit to the top part of the drum unit simultaneously, thereby closing a gap between the drum unit and the cover unit; and a controller configured to control the fastening unit.

Abstract: Provided is a semiconductor package including a first semiconductor chip having a bottom surface adjacent to a first active layer and an top surface opposite to the bottom surface; a first adhesive layer disposed on the top surface of the first semiconductor chip; a first conductive stud disposed on the bottom surface of the first semiconductor chip and electrically connected to the first active layer; a first conductive post disposed outside the first semiconductor chip; a redistribution structure disposed under the first semiconductor chip and including a redistribution pattern connected to the first conductive stud and the first conductive post and a redistribution insulation layer surrounding the redistribution pattern; and a molding layer surrounding the first semiconductor chip, the first adhesive layer, the first conductive stud, and the first conductive post on the redistribution structure.

Abstract: Proposed is a fines removal apparatus installed on a radioactive liquid waste granulator, the apparatus including: a body unit fastened to an outlet provided on the radioactive liquid waste granulator and configured to receive the granulated radioactive waste by an operation of a first opening/closing valve, the radioactive liquid waste granulator being configured to manufacture concentrated liquid waste and to manufacture granulated radioactive waste by drying the concentrated liquid waste. an air supply unit provided on one side of the body unit and configured to spray air to the supplied granulated radioactive waste at regular periods, thereby scattering and separating fines contained in the granulated radioactive waste; and a reprocessing unit provided in a vacuum state on an opposite side of the body unit and configured to allow the scattered fines to be transferred to the radioactive waste granulator along a transfer pipe by vacuum pressure.

Abstract: A semiconductor package includes an upper structure including a semiconductor chip and a first molding layer for molding the semiconductor chip, a lower structure provided on the upper structure, the lower structure including a conductive post and a second molding layer for molding the conductive post, and a redistribution structure provided between the upper structure and the lower structure, the redistribution structure including a wiring pattern for electrically connecting a pad of the semiconductor chip to the conductive post, in which a thermal expansion coefficient of the second molding layer is different from a thermal expansion coefficient of the first molding layer.

Abstract: An embodiment of the present invention provides a racing tire rubber composition comprising: 30-60 wt % of rubber, 10-30 wt % of carbon black, 1-20 wt % of carbon nanotubes, and 10-50 wt % of oil; and a method for manufacturing same.

Abstract: A semiconductor package includes a semiconductor chip including a chip pad, a first insulating layer provided on the semiconductor chip and including a first via hole, a first wiring pattern provided on the first insulating layer and connected to the chip pad through the first via hole of the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring pattern and including a second via hole, and a second wiring pattern provided on the second insulating layer and connected to the first wiring pattern through the second via hole of the second insulating layer, wherein the first insulating layer includes a first upper surface in contact with the second insulating layer and a first lower surface opposite to the first upper surface, and the first upper surface of the first insulating layer has surface roughness greater that the first lower surface of the first insulating layer.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a lower structure including a semiconductor chip having a chip terminal; an external connection terminal connecting the semiconductor chip to an external device, and an intermediate connection structure including an upper surface and a lower surface opposite to the upper surface, and positioned between the lower structure and the external connection terminal.

Abstract: The induction heater and a method for controlling overheating of an induction heater, and to an induction heater in which overheating of a heating element may be prevented by allowing a coolant to be introduced from a lower side, flow upwardly while being in contact with the heating element, and be then discharged to an upper side to improve air bubble discharge performance of the coolant, in the induction heater heating a heating element in an induction heating manner. In addition, the present invention relates to an induction heater and a method for controlling overheating of an induction heater in which a fault of the induction heater or a fire due to overheating may be prevented by deciding whether or not a heating element is overheated using one or more of a current sensing means and a temperature sensing means capable of sensing overheating of the heating element and performing a control to supply power to an induction coil or block power supplied to the induction coil depending on a decision result.

Abstract: The present invention relates to a vehicle radiation heater being configured to perform heating by directly emitting radiant heat toward a passenger at an early stage of starting of a vehicle in winter. The vehicle radiation heater according to the present invention can be simple in structure, thereby being easy to manufacture, can quickly emit high-temperature radiant heat over the entire area of the heater, thereby enhancing rapid and comforting heating effects, and can maintain a constant temperature, thereby preventing a risk of overheating.

Abstract: A semiconductor package having improved impact resistance and excellent heat dissipation and electromagnetic wave shielding property, and a manufacturing method thereof are provided. There is provided a semiconductor package including: a chip having a contact pad provided on one surface thereof; a buffer layer formed on one surface of the chip; one or more wiring patterns disposed on the buffer layer, electrically connected to the contact pad of the chip, and extended to an outside of the chip; an external pad provided on the wiring pattern and electrically connected to the wiring pattern; an external connection terminal electrically connected to the external pad; and a mold layer formed to surround the other surface and a side surface of the chip and a side surface of the buffer layer, and formed up to the other surface of the wiring pattern.

Abstract: The present disclosure relates to an air conditioning device for a vehicle seat; can include a seat duct formed on a seat of a vehicle, a seat air conditioning unit formed on a lower frame on which the seat is mounted, and a separation space interposed between the seat and the lower frame; and can be formed so that the air is discharged from the air conditioning unit into the separation space, and the air of the separation space is supplied to the seat duct. As a result, it is possible to enhance the mobility of the seat, and to prevent noise and vibration due to driving parts from being delivered to a passenger.

Abstract: The present invention relates to microstructure formulation techniques for botulinum toxin. The microstructure formulation techniques for botulinum toxin according to the present invention make it possible to precisely control the concentration of botulinum toxin and to alleviate the pain occurring when botulinum toxin is administered into the human body, and also enable botulinum toxin to be accurately administered to a desired position. Thus, the present invention is expected to greatly contribute to the safe and convenient medical use of botulinum toxin.

Abstract: The present invention relates to an induction heater and a method for controlling overheating of an induction heater, and to an induction heater in which overheating of a heating element may be prevented by allowing a coolant to be introduced from a lower side, flow upwardly while being in contact with the heating element, and be then discharged to an upper side to improve air bubble discharge performance of the coolant, in the induction heater heating a heating element in an induction heating manner.

Abstract: The present invention relates to a radiant heater for a vehicle, the radiant heater including: a base fabric; a heating member stacked on the base fabric; a fixing member fixing the heating member to the base fabric; and a laminated fabric stacked on an upper side of the fixing member and combined with the base fabric. Thus, the heater can be formed in a woven form and thus manufactured quickly and simply, and a heating temperature of the heater can be easily controlled according to a location by only controlling a resistance pattern, thereby provide a more uniform warmth to a passenger of the vehicle.