Abstract: The present disclosure relates a display device and a method compensating for deterioration thereof, and a mobile terminal including the display device. The display device includes: a display panel including a first pixel area, a second pixel area, and a third pixel area; a first optical device disposed below the display panel or embedded within the display panel in a predetermined sensing area on the display panel, the first optical device facing at least a portion of the first pixel area and a portion of the second pixel area when the display panel is folded or moved; and a pixel deterioration compensation circuit configured to operate to reduce a luminance difference between the first pixel area and the second pixel area by receiving sensing data from the first optical device in a deterioration sensing mode.

Abstract: Disclosed are: a reinforced composite membrane-type polymer electrolyte membrane which can prevent the loss of an ion conductor even when the ion conductor is chemically deteriorated due to long-term use, and thus has remarkably enhanced mechanical and chemical durability; a method for manufacturing same; and an electrochemical device comprising same. The polymer electrolyte membrane of the present invention comprises: a non-crosslinked ion conductor; and a porous support having a plurality of pores filled with the ion conductor, wherein the porous support comprises a polymer having at least one crosslinking functional group, and the crosslinking functional group is a functional group which, when the ion conductor is deteriorated, can cause crosslinking of the ion conductor by binding to the deteriorated ion conductor.

Abstract: A semiconductor package includes a semiconductor chip including a chip pad, a first insulating layer provided on the semiconductor chip and including a first via hole, a first wiring pattern provided on the first insulating layer and connected to the chip pad through the first via hole of the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring pattern and including a second via hole, and a second wiring pattern provided on the second insulating layer and connected to the first wiring pattern through the second via hole of the second insulating layer, wherein the first insulating layer includes a first upper surface in contact with the second insulating layer and a first lower surface opposite to the first upper surface, and the first upper surface of the first insulating layer has surface roughness greater that the first lower surface of the first insulating layer.

Abstract: A semiconductor package includes an upper structure including a semiconductor chip and a first molding layer for molding the semiconductor chip, a lower structure provided on the upper structure, the lower structure including a conductive post and a second molding layer for molding the conductive post, and a redistribution structure provided between the upper structure and the lower structure, the redistribution structure including a wiring pattern for electrically connecting a pad of the semiconductor chip to the conductive post, in which a thermal expansion coefficient of the second molding layer is different from a thermal expansion coefficient of the first molding layer.

Abstract: Provided is a semiconductor package including a first semiconductor chip having a bottom surface adjacent to a first active layer and an top surface opposite to the bottom surface; a first adhesive layer disposed on the top surface of the first semiconductor chip; a first conductive stud disposed on the bottom surface of the first semiconductor chip and electrically connected to the first active layer; a first conductive post disposed outside the first semiconductor chip; a redistribution structure disposed under the first semiconductor chip and including a redistribution pattern connected to the first conductive stud and the first conductive post and a redistribution insulation layer surrounding the redistribution pattern; and a molding layer surrounding the first semiconductor chip, the first adhesive layer, the first conductive stud, and the first conductive post on the redistribution structure.

Abstract: Disclosed is a semiconductor package including a semiconductor chip having a first surface adjacent to an active layer and a second surface opposite to the first surface; a conductive stud disposed on the first surface of the semiconductor chip and connected to the active layer; an adhesive layer disposed on the second surface of the semiconductor chip; a conductive post disposed outside the semiconductor chip; a first redistribution structure, which is on the first surface of the semiconductor chip and includes a first redistribution insulation layer supporting the conductive stud and the conductive post; a second redistribution structure, which is on the second surface of the semiconductor chip and includes a second redistribution insulation layer disposed on the adhesive layer; and a first molding layer disposed on the first redistribution structure and surrounding the semiconductor chip, the adhesive layer, the conductive stud, and the conductive post.

Abstract: An embodiment of the present invention provides a racing tire rubber composition comprising: 30-60 wt % of rubber, 10-30 wt % of carbon black, 1-20 wt % of carbon nanotubes, and 10-50 wt % of oil; and a method for manufacturing same.

Abstract: Disclosed is a heating device for a vehicle, enabling substantially increased heat transfer efficiency, excellent rapid heating, and reduced weight and package. The heating device for a vehicle comprises: a film heating unit comprising a heating element, and a film covering both sides of the heating element in the thickness direction; and a heat dissipation unit comprising a pair of plates spaced in the thickness direction, and a heat-dissipating fin interposed between the pair of plates, wherein the film heating unit and the heat dissipation unit are sequentially laminated by attaching the plates to the film.

Abstract: An embodiment provides a vehicle heating device comprising a heating module which is arranged toward passengers on a flow channel of air, connected to an air conditioning unit, to emit heat, wherein the heating module comprises a heating unit and an overheat protection means for preventing the heating unit from overheating above a predetermined temperature, and the heating unit heats the interior space of a vehicle through at least one of heat convection generated by heating the air and heat radiation obtained by radiating heat directly toward the passengers.

Abstract: An embodiment provides a vehicle heating device for heating a vehicle interior through heat radiation or heat convection using a heating unit connected to an air-conditioning casing. Accordingly, the vehicle heating device may improve the performance, efficiency, and quality in heating the vehicle interior through at least any one of heat convection and heat radiation using the heating unit.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a lower structure including a semiconductor chip having a chip terminal; an external connection terminal connecting the semiconductor chip to an external device; and an intermediate connection structure including an upper surface and a lower surface opposite to the upper surface, and positioned between the lower structure and the external connection terminal.

Abstract: A semiconductor package comprising a fan-out structure and a manufacturing method therefor are disclosed. A semiconductor package according to an embodiment of the present invention comprises: a wiring unit comprising an insulation layer and a wiring layer; a semiconductor chip mounted on the wiring unit and coupled to the wiring layer by flip-chip bonding; a filling member for filling a gap between the semiconductor chip and the wiring unit; and a film member for performing coating so as to cover one surface of each of the semiconductor chip, the filling member, and the wiring unit.

Abstract: An embodiment of the present invention provides a rubber composition for tires and a method for producing same, wherein the rubber composition for tires includes: carbon nanotubes including structural defects on at least a portion of the surface and having a thermal decomposition temperature equal to or less than 600° C.; and a rubber matrix.

Abstract: A technical idea of the present disclosure provides a semiconductor package, as a semiconductor package mounted on a circuit board, including: a body portion including a semiconductor chip, and a first surface and a second surface opposite to each other; and a structure including n insulating layers stacked on at least one of the first surface and the second surface of the body portion, wherein the semiconductor package has a predetermined target coefficient of thermal expansion (CTE), and the n insulating layers and the body portion have a thickness and a CTE satisfying a condition that an effective CTE of the semiconductor package becomes equal to the predetermined target CTE.

Abstract: A semiconductor package having improved impact resistance and excellent heat dissipation and electromagnetic wave shielding property, and a manufacturing method thereof are provided. There is provided a semiconductor package including: a chip having a contact pad provided on one surface thereof; a buffer layer formed on one surface of the chip; one or more wiring patterns disposed on the buffer layer, electrically connected to the contact pad of the chip, and extended to an outside of the chip; an external pad provided on the wiring pattern and electrically connected to the wiring pattern; an external connection terminal electrically connected to the external pad; and a mold layer formed to surround the other surface and a side surface of the chip and a side surface of the buffer layer, and formed up to the other surface of the wiring pattern.

Abstract: Disclosed is a semiconductor package including a semiconductor chip having a first surface adjacent to an active layer and a second surface opposite to the first surface; a conductive stud disposed on the first surface of the semiconductor chip and connected to the active layer; an adhesive layer disposed on the second surface of the semiconductor chip; a conductive post disposed outside the semiconductor chip; a first redistribution structure, which is on the first surface of the semiconductor chip and includes a first redistribution insulation layer supporting the conductive stud and the conductive post; a second redistribution structure, which is on the second surface of the semiconductor chip and includes a second redistribution insulation layer disposed on the adhesive layer; and a first molding layer disposed on the first redistribution structure and surrounding the semiconductor chip, the adhesive layer, the conductive stud, and the conductive post.

Abstract: Proposed is a system for closing a drum unit for storing radioactive waste, the system including: a supporting unit configured to be seated on the ground; a drum unit configured to be seated on a top part of the supporting unit and having a plurality of first fastening holes; a moving unit configured to move to a side of the drum unit; a cover unit provided at the inside of the moving unit or at one side of the drum unit and having a plurality of second fastening holes; tightening units configured to be inserted into the associated second fastening holes; a fastening unit configured to grip the cover unit through a gripping part to move the cover unit to the top part of the drum unit simultaneously, thereby closing a gap between the drum unit and the cover unit; and a controller configured to control the fastening unit.

Abstract: Provided is a semiconductor package including a first semiconductor chip having a bottom surface adjacent to a first active layer and an top surface opposite to the bottom surface; a first adhesive layer disposed on the top surface of the first semiconductor chip; a first conductive stud disposed on the bottom surface of the first semiconductor chip and electrically connected to the first active layer; a first conductive post disposed outside the first semiconductor chip; a redistribution structure disposed under the first semiconductor chip and including a redistribution pattern connected to the first conductive stud and the first conductive post and a redistribution insulation layer surrounding the redistribution pattern; and a molding layer surrounding the first semiconductor chip, the first adhesive layer, the first conductive stud, and the first conductive post on the redistribution structure.

Abstract: Proposed is a fines removal apparatus installed on a radioactive liquid waste granulator, the apparatus including: a body unit fastened to an outlet provided on the radioactive liquid waste granulator and configured to receive the granulated radioactive waste by an operation of a first opening/closing valve, the radioactive liquid waste granulator being configured to manufacture concentrated liquid waste and to manufacture granulated radioactive waste by drying the concentrated liquid waste. an air supply unit provided on one side of the body unit and configured to spray air to the supplied granulated radioactive waste at regular periods, thereby scattering and separating fines contained in the granulated radioactive waste; and a reprocessing unit provided in a vacuum state on an opposite side of the body unit and configured to allow the scattered fines to be transferred to the radioactive waste granulator along a transfer pipe by vacuum pressure.

Abstract: An embodiment of the present invention provides a racing tire rubber composition comprising: 30-60 wt % of rubber, 10-30 wt % of carbon black, 1-20 wt % of carbon nanotubes, and 10-50 wt % of oil; and a method for manufacturing same.