Patents by Inventor Dong-Hwan Lee
Dong-Hwan Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12379746Abstract: A display device includes a display panel; a metal plate and a filling member which are disposed on a lower surface of the display panel, are disposed on the same layer, and include different materials; and a fingerprint sensor which is disposed on a lower surface of the filling member and is overlapped by the filling member in a thickness direction, wherein the metal plate includes a plurality of outlines extending in different directions in plan view, one outline of the metal plate includes a plurality of sides extending along a first direction and a discontinuous part disposed between the sides, an open part recessed from the discontinuous part in a second direction intersecting the first direction is formed in the metal plate, and the filling member is located in the open part in plan view.Type: GrantFiled: January 19, 2022Date of Patent: August 5, 2025Assignee: Samsung Display Co., Ltd.Inventors: Ji Hun Ryu, Kwang Hyun Baek, Dong Hwan Lee, Chae Eun Lee, Jae Hyung Jo, Jeong An Hong
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Patent number: 12349354Abstract: There are provided a semiconductor memory device and a manufacturing method thereof. The semiconductor memory device includes: a gate stack structure including interlayer insulating layers and conductive patterns, which are alternately stacked in a vertical direction on a substrate; a plurality of channel structures penetrating the gate stack structure, each of the plurality of channel structures with one end portion protruding past a boundary of the gate stack structure; and a source layer formed on the gate stack structure. The protruding end portion of each of the plurality of channel structures extends into the source layer. The protruding end portion of each of the plurality of channel structures has a flat section.Type: GrantFiled: February 7, 2024Date of Patent: July 1, 2025Assignee: SK hynix Inc.Inventor: Dong Hwan Lee
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Publication number: 20250194158Abstract: Provided are a thin film transistor and a method for manufacturing the same, and more particularly, to a thin film transistor having improved characteristics and a method for manufacturing the same. A thin film transistor in accordance with an exemplary embodiment includes a gate electrode, an active layer containing oxide of a first metal element and disposed to be vertically spaced apart from the gate electrode, source and drain electrodes disposed to be spaced apart from each other on the active layer, and a contact layer disposed between the active layer and the source and drain electrodes.Type: ApplicationFiled: March 10, 2023Publication date: June 12, 2025Inventors: Il Houng PARK, Seung Hyun CHO, Yun Gu YEO, Won Ju OH, Dong Hwan LEE, Jun Seok LEE, Jeong HEO, Chul Joo HWANG
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Publication number: 20250149233Abstract: A coil componenti includes: a body having a first surface, a second surface opposing the first surface in a first direction, and a plurality of side surfaces connecting the first surface and the second surface to each other; a support member disposed inside the body; and first and second coils disposed on opposite sides of the support member, in which the first coil includes a first coil layer, a first lead portion disposed between the first coil layer and the support member, and a first conductive via connecting the first coil layer and the first lead portion to each other, and the second coil includes a second coil layer, a second lead portion disposed between the second coil layer and the support member, and a second conductive via connecting the second coil layer and the second lead portion to each other.Type: ApplicationFiled: August 27, 2024Publication date: May 8, 2025Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Hyun Kim, Byeong Cheol Moon, Dong Hwan Lee, Dong Jin Lee, Boum Seock Kim
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Publication number: 20250103061Abstract: The present invention relates to an unmanned aerial vehicle provided with a detachable transport mission apparatus, which allows various types of cargo to be detachably attached and transported. To this end, the present invention provides an unmanned aerial vehicle provided with a detachable transport mission apparatus, the unmanned aerial vehicle comprising: a main body, a transport mission apparatus detachably coupled to the main body to transport certain items, a first exchange unit provided to a lower side of the main body to be coupled to or uncoupled from the transport mission apparatus, and a second exchange unit provided to an upper side of the transport mission apparatus to be coupled to or uncoupled from the first exchange unit.Type: ApplicationFiled: August 3, 2022Publication date: March 27, 2025Applicant: VORASKY CORP.Inventor: Dong Hwan LEE
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Publication number: 20250098167Abstract: A semiconductor memory device, and a method of manufacturing the same, includes a gate stack including an interlayer insulating layers and conductive patterns alternately stacked in a vertical direction on a substrate, a channel structure passing through the gate stack and having an upper end protruding above the gate stack, a memory layer surrounding a sidewall of the channel structure, and a source layer formed on the gate stack. The channel structure includes a core insulating layer extending in a central region of the channel structure in the vertical direction, and a channel layer surrounding a sidewall of the core insulating layer, the channel layer formed to be lower in the vertical direction than the core insulating layer and the memory layer.Type: ApplicationFiled: December 2, 2024Publication date: March 20, 2025Applicant: SK hynix Inc.Inventors: Jae Young OH, Dong Hwan LEE, Eun Seok CHOI
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Publication number: 20250095399Abstract: Provided is a display device comprising a display panel, a metal plate on a bottom surface of the display panel, the metal plate including a first surface facing the bottom surface of the display panel and a second surface opposite to the one surface, and a fingerprint sensor overlappingly disposed on the second surface of the metal plate, wherein the metal plate includes an indentation groove recessed in a direction toward the first surface from the second surface of the metal plate, and the fingerprint sensor is disposed on the second surface of the metal plate on which the indentation groove is formed.Type: ApplicationFiled: November 28, 2024Publication date: March 20, 2025Inventors: Kyung Min CHOI, Ji Hun RYU, Su Yul SEO, Kwang Hyun BAEK, Dong Hwan LEE, Won Ki HONG, Jeong An HONG
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Publication number: 20250079060Abstract: A coil component according to an aspect of the present disclosure includes a coil component having a body including a first surface and a second surface opposing each other in a first direction, and a third surface and a fourth surface connecting the first surface to the second surface and opposing each other in a second direction; a coil disposed in the body; an external electrode disposed on the body and connected to the coil; and a first heat dissipation portion disposed on the first surface, wherein the body includes a groove disposed in a region between the first heat dissipation portion and the external electrode.Type: ApplicationFiled: July 16, 2024Publication date: March 6, 2025Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Hyun KIM, Byeong Cheol MOON, Dong Jin LEE, Dong Hwan LEE, Dae Ki LIM, Boum Seock KIM
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Publication number: 20250069789Abstract: A coil component, may include: a body including a first surface and a second surface facing each other in a first direction, and a third surface connecting the first surface and the second surface; a support member disposed within the body; a coil disposed on the support member, and including a coil pattern having at least one turn and a lead-out portion extending from an outer end of the coil pattern to the first surface or the second surface; and an electrode 10 portion extending from the lead-out portion externally of the body and disposed on the body, and having an average thickness smaller than the average thickness of the lead-out portion.Type: ApplicationFiled: April 25, 2024Publication date: February 27, 2025Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Jin LEE, Soon KWANG KWON, Dong Hwan LEE, Tae Hyun KIM, Byeong Cheol MOON, Boum Seock KIM
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Publication number: 20250054685Abstract: A coil component according to an aspect of the present disclosure includes a body including a magnetic material; a coil disposed in the body; an external electrode including a first layer connected to the coil and including at least one of Pd and Cr, a second layer disposed on the first layer and including Ni, and a third layer disposed on the second layer and including a conductive material and resin.Type: ApplicationFiled: June 25, 2024Publication date: February 13, 2025Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Hyun Kim, Dong Hwan Lee, Dong Jin Lee, Boum Seock Kim, Ju Hyoung Park
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Patent number: 12217896Abstract: A coil component includes a body, a planar spiral-shaped coil portion disposed in the body, a lead portion disposed to be spaced apart from the coil portion in the body, a support substrate disposed between the coil portion and the lead portion to correspond to the lead portion, a via penetrating through the support substrate to connect an internal end portion of the coil portion and an internal end portion of the lead portion to each other, an insulating layer covering the coil portion and the lead portion, and a first external electrode and a second external electrode disposed to be spaced apart from each other on a surface of the body and connected to the external end portion of each of the coil portion and the lead portion.Type: GrantFiled: December 9, 2020Date of Patent: February 4, 2025Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Yoon, Dong Hwan Lee, Dong Jin Lee, Sang Soo Park
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Publication number: 20250037927Abstract: According to an aspect of the present disclosure, a coil component includes a body including a first surface and a second surface opposing each other in a first direction; a coil disposed in the body and including a coil pattern and a lead-out portion extending from the coil pattern, wherein the coil pattern is divided into a first region in which the lead-out portion is disposed, and a second region in which the lead-out portion is not disposed with respect to a central line perpendicular to the first direction and passing through a center of the coil pattern, and wherein an outermost turn of the second region includes a plurality of corner portions, and a first connection portion connecting the plurality of corner portions, and a length of the first connection portion is shorter than a length of each of the corner portions.Type: ApplicationFiled: April 12, 2024Publication date: January 30, 2025Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Hwan LEE, Dong Jin LEE, Tae Hyun KIM, Soon Kwang KWON
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Publication number: 20250029777Abstract: According to an aspect of the present disclosure, a coil component includes a body including a first surface and a second surface opposing each other in a first direction, and a third surface connecting the first surface to the second surface; a coil disposed in the body and including a lead-out portion led out to the first surface or the second surface; and an external electrode disposed on the body and connected to the lead-out portion and including a first metal layer and a second metal layer. The first metal layer includes a first side surface facing the body and a second side surface opposing the first side surface, and the second metal layer is disposed on each of the first side surface and the second side surface of the first metal layer.Type: ApplicationFiled: April 30, 2024Publication date: January 23, 2025Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Hyun Kim, Dong Hwan Lee, Dong Jin Lee, Soon Kwang Kwon, Boum Seock Kim
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Patent number: 12197393Abstract: The present invention relates to a method of data structuring for difference between old and new versions of data and a device thereof, when generating and transmitting the difference to update software data comprising programs, kernels and filesystems installed on client devices such as autonomous vehicles and smartphones, provided are a data structuring method and a device necessary for generating and transmitting the difference data representing differential parts between old and new versions of software data.Type: GrantFiled: March 13, 2020Date of Patent: January 14, 2025Assignee: KONAMOBILITY COMPANY LIMITEDInventors: Dong Soo Kang, Dong Hwan Lee, Tae Ho Lee, Seung Wook Baek
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Patent number: 12185541Abstract: A semiconductor memory device, and a method of manufacturing the same, includes a gate stack including an interlayer insulating layers and conductive patterns alternately stacked in a vertical direction on a substrate, a channel structure passing through the gate stack and having an upper end protruding above the gate stack, a memory layer surrounding a sidewall of the channel structure, and a source layer formed on the gate stack. The channel structure includes a core insulating layer extending in a central region of the channel structure in the vertical direction, and a channel layer surrounding a sidewall of the core insulating layer, the channel layer formed to be lower in the vertical direction than the core insulating layer and the memory layer.Type: GrantFiled: December 6, 2021Date of Patent: December 31, 2024Assignee: SK hynix Inc.Inventors: Jae Young Oh, Dong Hwan Lee, Eun Seok Choi
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Patent number: 12183114Abstract: Provided is a display device comprising a display panel, a metal plate on a bottom surface of the display panel, the metal plate including a first surface facing the bottom surface of the display panel and a second surface opposite to the one surface, and a fingerprint sensor overlappingly disposed on the second surface of the metal plate, wherein the metal plate includes an indentation groove recessed in a direction toward the first surface from the second surface of the metal plate, and the fingerprint sensor is disposed on the second surface of the metal plate on which the indentation groove is formed.Type: GrantFiled: July 20, 2022Date of Patent: December 31, 2024Assignee: Samsung Display Co., Ltd.Inventors: Kyung Min Choi, Ji Hun Ryu, Su Yul Seo, Kwang Hyun Baek, Dong Hwan Lee, Won Ki Hong, Jeong An Hong
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Patent number: 12175692Abstract: A localization method includes scanning a surrounding space by using laser outputted from a reference region; processing spatial information about the surrounding space based on a reflection signal of the laser; extracting feature vectors to which the spatial information has been reflected by using a deep learning network which uses space vectors including the spatial information as input data; and comparing the feature vectors with preset reference map data, and thus estimating location information about the reference region.Type: GrantFiled: July 25, 2022Date of Patent: December 24, 2024Assignee: NAVER LABS CORPORATIONInventors: Min Young Chang, Su Yong Yeon, Soo Hyun Ryu, Dong Hwan Lee
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Patent number: 12170054Abstract: A display device includes a compensation value determiner which generates final compensation values for an input image, a timing controller which receives input grayscales of the input image and generate output grayscales by applying the final compensation values to the input grayscales, and a pixel unit which displays an output image corresponding to the output grayscales using pixels. The compensation value determiner determines weights based on display frequencies, display brightnesses, and the input grayscales, the compensation value determiner determines compensation values based on the display frequencies and positions of the pixels, and the compensation value determiner generates the final compensation values by applying the weights to the compensation values.Type: GrantFiled: October 13, 2023Date of Patent: December 17, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Dong Won Moon, Min Kyu Park, Dong Hwan Lee, Weon Jun Choe
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Publication number: 20240404746Abstract: According to an aspect of the present disclosure, a coil component includes a body including a first surface and a second surface opposing each other in a first direction, and a slit disposed in the first surface; a coil disposed in the body and including a coil portion having at least one turn, a lead-out portion extending from an outermost turn of the coil portion, and a protrusion extending to the slit; and an external electrode disposed on the slit to be in contact with the protrusion.Type: ApplicationFiled: February 16, 2024Publication date: December 5, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Jin Lee, Dong Hwan Lee, Byeong Cheol Moon, Boum Seock Kim
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Publication number: 20240392621Abstract: A door handle assembly for a vehicle includes a housing having an opening formed therein; a handle cover configured to be rotated inside the housing in a first direction to uncover the opening, or rotates in a second direction to cover the opening; a switch provided adjacent to the opening of the housing to allow a door of the vehicle to be opened in a state where the handle cover uncovers the opening; and a driving member that rotates the handle cover to uncover or cover the opening. In particular, the driving member allows the handle cover to be rotated with respect to a first rotation axis, and at the same time, a second rotation axis, which is spaced apart from the first rotation axis and revolves around the first rotation axis, such that the handle cover is moved by both a translational motion and a rotational motion.Type: ApplicationFiled: March 6, 2024Publication date: November 28, 2024Inventors: Duk Hyun KIM, Boo Seob KIM, Do Heoun PARK, Dong Hwan LEE, Eun Hee PARK