Abstract: A coil component includes a body, a first coil disposed in the body and including a first winding portion having a turns number less than one turn, a second coil disposed in the body and including a second winding portion having a turns number less than one turn, a first external electrode and a second external electrode, respectively connected to one end and the other end of the first coil, and a third external electrode and a fourth external electrode, respectively connected to one end and the other end of the second coil. A portion of the first winding portion is disposed on an internal side of the second winding portion, and a portion of the second winding portion is disposed on an internal side of the first winding portion.

Abstract: A coil component includes a winding-type coil including a coil portion and first and second lead-out portions respectively connected to the coil portion; a body in which the winding-type coil is disposed, the first and second lead-out portions of the winding-type coil exposed from the body; a noise removal portion including a pattern portion spaced apart from a metal wire of the winding-type coil in the body and having both end portions spaced apart from each other to have an open-loop, and a third lead-out portion connected to the pattern portion and exposed from the body; an insulating layer disposed between the winding-type coil and the noise removal portion; and first to third external electrodes arranged on the body to be spaced apart from each other and respectively connected to the first to third lead-out portions.

Abstract: A coil component includes a body including a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposing each other in a third direction perpendicular to the first direction and the second direction, and including a recess in the third surface, a support member disposed in the body, a coil disposed on the support member and including first and second lead-out portions extending to the third surface of the body, and first and second external electrodes disposed on the sixth surface of the body, extending into the recess and connected to the first and second lead-out portions, respectively.

Abstract: A coil component includes a body, a coil disposed within the body, a first insulating layer covering at least a portion of the coil, an external electrode disposed on one surface of the body and connected to the coil at the one surface of the body, and a magnetic layer disposed on the first insulating layer, covering at least a portion of the first insulating layer and spaced apart from the surface of the body, and in which an the external electrode is disposed on the body, connected to the coil, and spaced apart from the magnetic layer. Additionally, the coil component can include a second insulating layer covering at least a portion of the magnetic layer.

Abstract: A coil component includes a body having first and second surfaces opposing each other in a first direction, first to third coil portions spaced apart from each other in the first direction in the body and having turns wound in the same direction, and an external electrode disposed on the body and connected to each of the first to third coil portions, wherein the number of turns of a portion of the first coil portion disposed in a region between a winding center of the first coil portion and the first surface is greater than the number of turns of a portion of the third coil portion disposed between a winding center of the third coil portion and the second surface, and wherein a distance between the first and second coil portions is wider than a distance between the second and third coil portions.

Abstract: A coil component includes a body having a first surface and a second surface disposed to be perpendicular to a first direction, a third surface and a fourth surface disposed to be perpendicular to a second direction, and a fifth surface and a sixth surface disposed to be perpendicular to a third surface, a coil portion including a first lead-out portion and a second lead-out portion, a first external electrode connected to the first lead-out portion, and a second external electrode connected to the second lead-out portion, wherein the first and second external electrodes are spaced apart from each other in the second direction, and a gap between the first surface and the second surface is greater than a gap between the third surface and the fourth surface and a gap between the fifth surface and the sixth surface.

Abstract: A coil component includes a body including first to sixth surfaces, a first coil portion disposed in the body, and including a first winding portion and first and second extension portions, a second coil portion disposed in the body, and including a second winding portion, and third and fourth extension portions, first and second external electrodes disposed on the body and respectively connected to the first and second extension portions, and third and fourth external electrodes disposed on the body and respectively connected to the third and fourth extension portions. The first and third extension portions include first and third lead-out portions extending from the first surface, respectively, and the second and fourth extension portions include second and fourth lead-out portions extending from the second surface, respectively. The first and second lead-out portions are shifted from each other, and the third and fourth lead-out portions are shifted from each other.

Abstract: Provided is a multi-channel blood viscosity measuring device including: a blood sample preprocessing unit for scanning and shaking a blood collection tube and then removing a blood collection tube cover therefrom; a blood sample transfer unit for moving the blood collection tube stably placed by the blood sample preprocessing unit; a blood viscosity measuring unit including one or more channels and equipped with a blood viscosity measuring kit to measure the viscosity of an injected blood sample; and a blood sample post-processing unit for mounting the blood viscosity measuring kit on the blood viscosity measuring unit and suctioning the blood sample from the blood collection tube transferred by the blood sample transfer unit to inject same into the mounted blood viscosity measuring kit.

Abstract: A coil component includes a body; a coil portion disposed inside the body; a noise removal portion disposed to contact a surface of the body; an insulating layer disposed inside the noise removal portion; first and second external electrodes each connected to the coil portion and disposed on the insulating layer to overlap the noise removal portion; and a third external electrode disposed to be spaced apart from the first and second external electrodes and contacting the noise removal portion.

Abstract: The present invention relates to a method and apparatus for generating difference between old and new versions of data (software data) for updating software, and in more detail, when updating software programs and their related data in client devices like autonomous vehicles and smartphones, an update management server generates the difference by comparing old and new versions of the software data, and provides the generated difference to client devices, thereby provided is a method and apparatus for making software update simple and fast.

Abstract: A coil electronic component includes a support substrate; first and second coil patterns disposed on an upper surface and a lower surface of the support substrate, respectively; an encapsulant covering at least portions of the support substrate and the first and second coil patterns; and first and second external electrodes connected to the first and second coil patterns, respectively, and disposed on portions of a lower surface of the encapsulant, wherein at least one portion of a lower surface of the first coil pattern is exposed from the encapsulant, at least one portion of a lower surface of the second coil pattern is exposed from the encapsulant, and the first and second external electrodes are respectively connected to the at least one portion of the lower surface of the first coil pattern and the at least one portion of the lower surface of the second coil pattern.

Abstract: The data collecting method includes: collecting first and second sensor data respectively through a first and a second sensors while a data collecting apparatus moves within a target area, and tagging a first and a second timestamp values respectively to the first and the second sensor data; generating map data of the target area and location data at a point of time corresponding to the first timestamp value, based on the first sensor data; generating map information of the target area based on the map data, and generating moving path information on the map based on the location data; and estimating a sensing location at a point of time corresponding to the second timestamp value based on the moving path information, and tagging the sensing location to the second sensor data.

Abstract: A coil component includes a body; a wound coil disposed in the body, and having a plurality of turns and first and second lead-out portions exposed to the surfaces of the body; a noise removing portion spaced apart from the wound coil, and including a pattern portion having a first end portion and a second end portion spaced apart from each other and forming an open loop, and a third lead-out portion connected to the pattern portion and exposed to one surface of the body; an insulating layer disposed between the wound coil and the noise removing portion; and first to third external electrodes disposed on the surfaces of the body, spaced apart from one another, and connected to the first to third lead-out portions, respectively, wherein one of the plurality of turns of the wound coil has a line width greater than a thickness thereof.

Abstract: A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1, ? ? ? D × ? ? ? H ? ? ? D + ? ? ? H ? 1.0 , where ?D is a standard deviation of tablet diameters and ?H is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.

Abstract: A semiconductor device and a related fabrication method are provided. The semiconductor device includes a conductive line on a substrate, a capping pattern that extends along an upper surface of the conductive line, a spacer structure that extends along a side surface of the conductive line and a side surface of the capping pattern, a buried contact electrically connected to the substrate, on a side surface of the spacer structure, a barrier conductive film extending along the buried contact and the spacer structure, and a landing pad electrically connected to the buried contact, on the barrier conductive film and the capping pattern, wherein an upper part of the spacer structure includes a spacer recess that is lower than or equal to an uppermost surface of the capping pattern, and the barrier conductive film extends along the spacer recess and does not cover the uppermost surface of the capping pattern.

Abstract: A coil component includes a body including opposing first and second side surfaces and opposing third and fourth side surfaces, a first coil portion disposed in the body, and including a first winding portion and first and second extension portions connected to the first winding portion, a second coil portion disposed in the body, and including a second winding portion disposed between the first side surface and the first winding portion, and third and fourth extension portions connected to the second winding portion, first and second external electrodes disposed on the body and respectively connected to the first and second extension portions, and third and fourth external electrodes disposed on the body and respectively connected to the third and fourth extension portions. The first extension portion of the first coil portion is disposed between the second winding portion and one of the third and fourth side surfaces.

Abstract: A coil component includes a body, a support substrate disposed within the body, a coil portion disposed on the support substrate and having first and second lead-out portions exposed to respective surfaces of the body, a noise removal portion disposed within the body and spaced apart from the coil portion, and including a pattern portion forming an open loop and having a slit between one end portion thereof and another end portion thereof spaced apart from each other. The noise removal portion also includes a third lead-out portion connected to the pattern portion and having one surface exposed to a side surface of the body. An insulating layer is disposed between the coil portion and the noise removal portion, and first to third external electrodes are disposed on respective surfaces of the body and connected to the first to third lead-out portions, respectively.

Abstract: A coil component includes a body; a first coil portion disposed inside of the body and having a first core portion; a first external electrode and a second external electrode disposed outside of the body and connected to both ends of the first coil portion, respectively; a second coil portion disposed on the first coil portion in the body and having a second core portion; and a third external electrode and a fourth external electrode disposed outside of the body and connected to both ends of the second coil portion, respectively, wherein the first core portion comprises a first shared core portion overlapping the second core portion and a first non-shared core portion not overlapping the second core portion, and the second core portion comprises a second shared core portion overlapping the first core portion and a second non-shared core portion not overlapping the first core portion.

Abstract: A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.

Abstract: An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1: