Patents by Inventor Dong Hwi Shin
Dong Hwi Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11919317Abstract: An inkjet printing apparatus, method of printing ink using the same and method of fabricating display device are provided. The method of printing ink includes: ejecting ink in which a plurality of particles is dispersed from an inkjet head; irradiating the ejected ink with a first light and a second light having different wavelengths to acquire data on a first exit light and a second exit light emitted from the ink; calculating a concentration of the particles in the ink from the data on the first exit light and the second exit light; and checking whether the concentration is out of an error range from a reference value, where the first light has a wavelength of about 500 nm or less, and the second light has a wavelength of about 1000 nm or more.Type: GrantFiled: March 23, 2022Date of Patent: March 5, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Dong Jun Lee, Che Ho Lim, Ho Yong Shin, Gyeong Eun Eoh, Jun Hwi Lim, Seon Uk Lee
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Patent number: 11916186Abstract: The present invention relates to a method for preparing a sulfide-based solid electrolyte, a sulfide-based solid electrolyte prepared by the method, and an all-solid-state lithium secondary battery including the sulfide-based solid electrolyte. The method of the present invention includes a) mixing Li2S with P2S5 to prepare a mixed powder, b) placing the mixed powder, an ether, and stirring balls in a container, sealing the container, followed by stirring to prepare a suspension, and c) stirring the suspension under high-temperature and high-pressure conditions to prepare sulfide-based solid particles.Type: GrantFiled: February 15, 2017Date of Patent: February 27, 2024Assignee: SOLIVIS INC.Inventors: Dong Wook Shin, Min Yong Eom, Seung Hyun Oh, Chan Hwi Park, Sun Ho Choi
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Publication number: 20230411078Abstract: A multilayer ceramic electronic component includes a ceramic body; and first and second external electrodes disposed on the ceramic body, wherein the first and second external electrodes include first and second conductive layers disposed on corners of the ceramic body, and first and second base electrodes covering the first and second conductive layers, respectively, and wherein a ratio, A1/A2, of an area, A1, of the first conductive layer disposed on the fifth surface or the second conductive layer disposed on the sixth surface of the ceramic body to an area, A2, of a cross-sectional surface of the ceramic body taken in the second direction and the first direction is in a range of 0.1 to 0.3.Type: ApplicationFiled: August 15, 2023Publication date: December 21, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: In Kyung JUNG, Dong Hwi SHIN
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Patent number: 11837412Abstract: A ceramic electronic component includes a body including a capacitance formation portion including a dielectric layer and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed therebetween and forming capacitance and protective portions disposed on upper and lower surfaces of the capacitance formation portion and external electrodes including electrode layers disposed on the body and connected to the plurality of internal electrodes and conductive resin layers respectively disposed on the electrode layers, wherein ta2/ta1 is 0.05 or greater, where ta1 is the thickness of the electrode layer at a central portion of the capacitance formation portion and ta2 is the thickness of the electrode layer at a boundary between the capacitance formation portion and the protective portion.Type: GrantFiled: April 20, 2022Date of Patent: December 5, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Yeong Kim, Dong Hwi Shin
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Publication number: 20230386742Abstract: A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with each of the plurality of dielectric layers interposed therebetween, and an external electrode disposed on the capacitor body to be connected to the internal electrode. At least one intermetallic compound layer is disposed in a region in which the plurality of internal electrodes and the external electrode are connected, and a total number of the at least one intermetallic compound layer is more than or equal to 55% and less than 100% of a total number of the plurality of internal electrodes.Type: ApplicationFiled: August 9, 2023Publication date: November 30, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: A Ra Cho, Dong Hwi Shin, Seon Young Yoo
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Patent number: 11784002Abstract: A ceramic electronic component includes a body including dielectric layers and a plurality of internal electrodes and an external electrode including a connection portion and a band portion. The external electrode includes an electrode layer, a conductive resin layer, a nickel plating layer, and a tin plating layer. When an electrode layer thickness, a conductive resin layer thickness, a nickel plating layer thickness, a tin plating layer thickness of the band portion are defined as t3, t4, and t5, respectively, t5 is greater than or equal to 0.5 micrometer and less than 7 micrometer, and t5/(t3+t4) satisfies 1?t5/(t3+t4)*100<17.5 in the case in which t3+t4 is less than or equal to 100 micrometers and satisfies 0.3?t5/(t3+t4)*100<4.38 in the case in which t3+t4 is more than 100 micrometers.Type: GrantFiled: July 30, 2021Date of Patent: October 10, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Hwi Shin, Dong Yeong Kim, Do Yeon Kim, Woo Chul Shin
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Patent number: 11769631Abstract: A multilayer ceramic electronic component includes a ceramic body; and first and second external electrodes disposed on the ceramic body, wherein the first and second external electrodes include first and second conductive layers disposed on corners of the ceramic body, and first and second base electrodes covering the first and second conductive layers, respectively, and wherein a ratio, A1/A2, of an area, A1, of the first conductive layer disposed on the fifth surface or the second conductive layer disposed on the sixth surface of the ceramic body to an area, A2, of a cross-sectional surface of the ceramic body taken in the second direction and the first direction is in a range of 0.1 to 0.3.Type: GrantFiled: February 4, 2022Date of Patent: September 26, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: In Kyung Jung, Dong Hwi Shin
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Patent number: 11763987Abstract: A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with each of the plurality of dielectric layers interposed therebetween, and an external electrode disposed on the capacitor body to be connected to the internal electrode. At least one intermetallic compound layer is disposed in a region in which the plurality of internal electrodes and the external electrode are connected, and a total number of the at least one intermetallic compound layer is more than or equal to 55% and less than 100% of a total number of the plurality of internal electrodes.Type: GrantFiled: June 23, 2021Date of Patent: September 19, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: A Ra Cho, Dong Hwi Shin, Seon Young Yoo
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Publication number: 20230253159Abstract: A multilayer ceramic electronic component includes a ceramic body, and first and second external electrodes disposed on the surface of the ceramic body, respectively. The ceramic body includes a capacitance forming portion including a dielectric layer and internal electrodes, margin portions disposed on both sides of the capacitance forming portion, and cover portions disposed on both sides of the capacitance forming portion. The first and second external electrodes include first and second base electrodes, respectively, first and second conductive layers disposed on edges of the first and second base electrodes, respectively, and first and second terminal electrodes covering the first and second base electrodes, respectively.Type: ApplicationFiled: April 17, 2023Publication date: August 10, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: In Kyung JUNG, Dong Hwi SHIN
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Patent number: 11664164Abstract: A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes; a first external electrode including a first electrode layer connected to the first internal electrodes, a first conductive resin layer on the first electrode layer, and a first plating layer on the first conductive resin layer, and including a first connection portion on a third surface of the body and a first band portion extending on first and second surfaces of the body; and a second external electrode connected to the second internal electrodes. L2-L1 is greater than 10 ?m in which L1 is a distance from the third surface to a distal end of the first conductive resin layer in the first band portion, and L2 is a distance from the third surface to a distal end of the first plating layer in the first band portion.Type: GrantFiled: July 19, 2021Date of Patent: May 30, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Eun Hee Jeong, Do Young Jeong, Dong Hwi Shin, Hyung Duk Yun
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Patent number: 11657975Abstract: A multilayer ceramic electronic component includes a ceramic body, and first and second external electrodes disposed on the surface of the ceramic body, respectively. The ceramic body includes a capacitance forming portion including a dielectric layer and internal electrodes, margin portions disposed on both sides of the capacitance forming portion, and cover portions disposed on both sides of the capacitance forming portion. The first and second external electrodes include first and second base electrodes, respectively, first and second conductive layers disposed on edges of the first and second base electrodes, respectively, and first and second terminal electrodes covering the first and second base electrodes, respectively.Type: GrantFiled: March 23, 2022Date of Patent: May 23, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: In Kyung Jung, Dong Hwi Shin
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Publication number: 20230084504Abstract: A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion in which first and second internal electrodes are alternately laminated with respective dielectric layers interposed therebetween, and first and second external electrodes respectively disposed on surfaces of the ceramic body. The first and second internal electrodes are respectively exposed to surfaces of the ceramic body, and first and second protrusions, each including a carbon compound, are respectively disposed on end portions of the first and second internal electrodes exposed to the surfaces of the ceramic body.Type: ApplicationFiled: November 10, 2022Publication date: March 16, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Duk YUN, Young Hoon SONG, Dong Hwi SHIN, Seon Young YOO, Yu Seop LEE
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Patent number: 11527359Abstract: A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion in which first and second internal electrodes are alternately laminated with respective dielectric layers interposed therebetween, and first and second external electrodes respectively disposed on surfaces of the ceramic body. The first and second internal electrodes are respectively exposed to surfaces of the ceramic body, and first and second protrusions, each including a carbon compound, are respectively disposed on end portions of the first and second internal electrodes exposed to the surfaces of the ceramic body.Type: GrantFiled: July 28, 2020Date of Patent: December 13, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Duk Yun, Young Hoon Song, Dong Hwi Shin, Seon Young Yoo, Yu Seop Lee
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Publication number: 20220246357Abstract: A ceramic electronic component includes a body including a capacitance formation portion including a dielectric layer and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed therebetween and forming capacitance and protective portions disposed on upper and lower surfaces of the capacitance formation portion and external electrodes including electrode layers disposed on the body and connected to the plurality of internal electrodes and conductive resin layers respectively disposed on the electrode layers, wherein ta2/ta1 is 0.05 or greater, where ta1 is the thickness of the electrode layer at a central portion of the capacitance formation portion and ta2 is the thickness of the electrode layer at a boundary between the capacitance formation portion and the protective portion.Type: ApplicationFiled: April 20, 2022Publication date: August 4, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Yeong KIM, Dong Hwi SHIN
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Patent number: 11393627Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes stacked with the dielectric layer interposed therebetween, and including first and second external electrodes disposed on the fifth surface and the sixth surface of the ceramic body, respectively, the first and second external electrodes include first and second base electrodes including a first conductive metal and reactive glass, in contact with the ceramic body, and first and second conductive layers including and a second conductive metal, disposed on the first and second base electrodes, and a nanostructure may be disposed on surfaces of the first and second conductive layers.Type: GrantFiled: May 6, 2020Date of Patent: July 19, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Duk Yun, Seonyoung Yoo, Byeongguk Choi, Young Hoon Song, Yuseop Lee, A Ra Cho, Dong Hwi Shin
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Publication number: 20220216009Abstract: A multilayer ceramic electronic component includes a ceramic body, and first and second external electrodes disposed on the surface of the ceramic body, respectively. The ceramic body includes a capacitance forming portion including a dielectric layer and internal electrodes, margin portions disposed on both sides of the capacitance forming portion, and cover portions disposed on both sides of the capacitance forming portion. The first and second external electrodes include first and second base electrodes, respectively, first and second conductive layers disposed on edges of the first and second base electrodes, respectively, and first and second terminal electrodes covering the first and second base electrodes, respectively.Type: ApplicationFiled: March 23, 2022Publication date: July 7, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: In Kyung JUNG, Dong Hwi SHIN
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Publication number: 20220208451Abstract: A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with each of the plurality of dielectric layers interposed therebetween, and an external electrode disposed on the capacitor body to be connected to the internal electrode. At least one intermetallic compound layer is disposed in a region in which the plurality of internal electrodes and the external electrode are connected, and a total number of the at least one intermetallic compound layer is more than or equal to 55% and less than 100% of a total number of the plurality of internal electrodes.Type: ApplicationFiled: June 23, 2021Publication date: June 30, 2022Inventors: A Ra Cho, Dong Hwi Shin, Seon Young Yoo
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Publication number: 20220165497Abstract: A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes; a first external electrode including a first electrode layer connected to the first internal electrodes, a first conductive resin layer on the first electrode layer, and a first plating layer on the first conductive resin layer, and including a first connection portion on a third surface of the body and a first band portion extending on first and second surfaces of the body; and a second external electrode connected to the second internal electrodes. L2-L1 is greater than 10 ?m in which L1 is a distance from the third surface to a distal end of the first conductive resin layer in the first band portion, and L2 is a distance from the third surface to a distal end of the first plating layer in the first band portion.Type: ApplicationFiled: July 19, 2021Publication date: May 26, 2022Inventors: Eun Hee JEONG, Do Young JEONG, Dong Hwi SHIN, Hyung Duk YUN
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Publication number: 20220157529Abstract: A multilayer ceramic electronic component includes a ceramic body; and first and second external electrodes disposed on the ceramic body, wherein the first and second external electrodes include first and second conductive layers disposed on corners of the ceramic body, and first and second base electrodes covering the first and second conductive layers, respectively, and wherein a ratio, A1/A2, of an area, A1, of the first conductive layer disposed on the fifth surface or the second conductive layer disposed on the sixth surface of the ceramic body to an area, A2, of a cross-sectional surface of the ceramic body taken in the second direction and the first direction is in a range of 0.1 to 0.3.Type: ApplicationFiled: February 4, 2022Publication date: May 19, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: In Kyung JUNG, Dong Hwi SHIN
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Patent number: 11335506Abstract: A ceramic electronic component includes a body including a capacitance formation portion including a dielectric layer and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed therebetween and forming capacitance and protective portions disposed on upper and lower surfaces of the capacitance formation portion and external electrodes including electrode layers disposed on the body and connected to the plurality of internal electrodes and conductive resin layers respectively disposed on the electrode layers, wherein ta2/ta1 is 0.05 or greater, where ta1 is the thickness of the electrode layer at a central portion of the capacitance formation portion and ta2 is the thickness of the electrode layer at a boundary between the capacitance formation portion and the protective portion.Type: GrantFiled: November 20, 2018Date of Patent: May 17, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Yeong Kim, Dong Hwi Shin