Patents by Inventor Dong Hwi Shin

Dong Hwi Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10395839
    Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrodes disposed on first and second external surfaces of the ceramic body, respectively, the first and second external electrodes each including first and second base electrode layers having at least a portion in contact with first and second external surfaces of the ceramic body, respectively, and first and second plating layers, and a water repellent layer including a portion disposed to cover a gap between the ceramic body and the first and second plating layers, having a first thickness and a portion disposed to cover a surface of the ceramic body, to having a second thickness, smaller than the first thickness.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: August 27, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chae Min Park, Ki Won Kim, Ji Hee Moon, Dong Hwi Shin, Sang Soo Park, Woo Chul Shin
  • Patent number: 10395840
    Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers disposed therebetween, first and second external electrodes disposed on first and second external surfaces of the ceramic body, respectively, the first and second external electrodes each including first and second base electrode layers having at least a portion in contact with first and second external surfaces of the ceramic body, respectively, and first and second plating layers disposed to cover the first and second base electrode layers, respectively, and a water repellent layer disposed to cover both external side surfaces of the first and second plating layers and a surface of the ceramic body.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: August 27, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chae Min Park, Ki Won Kim, Ji Hee Moon, Dong Hwi Shin, Sang Soo Park, Woo Chul Shin
  • Patent number: 10354802
    Abstract: A ceramic electronic component includes a body including dielectric layers and a plurality of internal electrodes disposed to face each other while having each of the dielectric layers interposed therebetween; and external electrodes including a connection portion disposed on end surfaces of the body opposing each other and band portions extending onto portions of upper and lower surfaces of the body from the connection portion, wherein the external electrodes include electrode layers connected to the plurality of internal electrodes, conductive resin layers disposed on the electrode layers, Ni plating layers disposed on the conductive resin layers, and Sn plating layers disposed on the Ni plating layers, and tc1 is 0.5 ?m or more and tc2/tc1 is 1.2 or less, in which a thickness of the Ni plating layer in the connection portion is “tc1” and a thickness of the Ni plating layer in the band portion is tc2.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: July 16, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Bum Chul Bae, Woo Chul Shin, Sang Soo Park, Ki Won Kim, Dong Hwi Shin
  • Patent number: 7815399
    Abstract: A method of mechanized construction has developed for installing an earth wire under-bracing by using an auger crane and adjustable excavating unit with an auger crane. The extendable excavating unit is mounted to the lower end of an auger shaft of the auger crane and excavation teeth extendable and retractable are mounted to the excavating unit, thereby allowing excavation of a burial hole suitable to the size of the earth wire under-bracing. Whether it is needed to bury the earth wire under-bracing having a larger diameter than the diameter of excavation existing on the auger crane, or bury small-sized earth wire under-bracing, a method for mechanized construction of the earth wire under-bracing is enabled without difficulty by using an auger crane and adjustable excavating unit.
    Type: Grant
    Filed: October 10, 2006
    Date of Patent: October 19, 2010
    Assignee: Daewon Electric Co. Ltd.
    Inventors: Sae Won Kwon, Dong Hwi Shin, Dong Hwan Park
  • Publication number: 20090260891
    Abstract: A method of mechanized construction has developed for installing an earth wire under-bracing by using an auger crane and adjustable excavating unit with an auger crane. The extendable excavating unit is mounted to the lower end of an auger shaft of the auger crane and excavation teeth extendable and retractable are mounted to the excavating unit, thereby allowing excavation of a burial hole suitable to the size of the earth wire under-bracing. Whether it is needed to bury the earth wire under-bracing having a larger diameter than the diameter of excavation existing on the auger crane, or bury small-sized earth wire under-bracing, a method for mechanized construction of the earth wire under-bracing is enabled without difficulty by using an auger crane and adjustable excavating unit.
    Type: Application
    Filed: October 10, 2006
    Publication date: October 22, 2009
    Inventors: Sae Won Kwon, Dong Hwi Shin, Dong Hwan Park