Patents by Inventor Dong Joo Park
Dong Joo Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240130232Abstract: The present specification relates to a heterocyclic compound, an organic light emitting device, and a composition for an organic material layer of an organic light emitting device.Type: ApplicationFiled: July 25, 2023Publication date: April 18, 2024Applicant: LT MATERIALS CO., LTD.Inventors: Hyun-Joo LEE, Geon-Yu PARK, Young-Seok NO, Dong-Jun KIM, Dae-Hyuk CHOI
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Patent number: 11961775Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.Type: GrantFiled: November 8, 2022Date of Patent: April 16, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
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Patent number: 11931683Abstract: A scrubber system may include a scrubber housing including a vertically extended cleaning space, an inflow chamber coupled to a bottom portion of the scrubber housing, and first and second inflow portions, each of which is configured to supply a gas into the inflow chamber. The inflow chamber may include a mixing space, and the mixing space may be connected to the cleaning space. The first inflow portion may include a first connection pipe coupled to the inflow chamber to provide a first connection path and the second inflow portion may include a second connection pipe coupled to the inflow chamber to provide a second connection path. The first and second connection paths may be extended toward the mixing space in opposite directions, respectively, and may be connected to opposite portions of the mixing space, respectively.Type: GrantFiled: October 15, 2021Date of Patent: March 19, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Young Seok Roh, Suji Gim, Heesub Kim, Hee Ock Park, Jongyong Bae, Sung Chul Yoon, Sunsoo Lee, Dong Keun Jeon, Jinkyoung Joo
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Publication number: 20240072228Abstract: A display device comprises a first pixel including a first emission area, a second pixel including a second emission area spaced apart from the first emission area in a first direction, and a bank partitioning the first emission area and the second emission area, wherein the first pixel includes a first alignment electrode, a second alignment electrode, and a third alignment electrode sequentially located, spaced apart from each other in the first direction, and overlapping with the first emission area, first light-emitting elements above, and overlapping with, the first alignment electrode and the second alignment electrode, second light-emitting elements above, and overlapping with, the second alignment electrode and the third alignment electrode, and a dummy electrode between the first emission area and the second emission area, and overlapping with the bank.Type: ApplicationFiled: August 2, 2023Publication date: February 29, 2024Inventors: Won Jun LEE, Dong Woo KIM, Do Yeong PARK, Se Hyun LEE, Kwi Hyun KIM, Min Gyeong SHIN, Jin Joo HA
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Patent number: 11869829Abstract: In accordance with the present description, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body.Type: GrantFiled: July 10, 2020Date of Patent: January 9, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dong Joo Park, Jin Seong Kim, Ki Wook Lee, Dae Byoung Kang, Ho Choi, Kwang Ho Kim, Jae Dong Kim, Yeon Soo Jung, Sung Hwan Cho
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Publication number: 20230411342Abstract: In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: August 31, 2023Publication date: December 21, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dong Hyeon Park, Min Ho Kim, Dong Su Ryu, Seok Ho Na, Choong Hoe Kim, Yun Seok Song, Woo Kyung Ju, Dong Joo Park
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Patent number: 11788691Abstract: A hidden lighting lamp uses a color conversion material and is applied to a vehicle. A color conversion member is spaced apart from a light source by a light source air gap (La) such that the color conversion member is integrally engaged with a lens for projecting light of the light source to the outside or such that the color conversion member is spaced apart from the lens by a lens air gap (Lb). Hidden lighting without deterioration of optical efficiency of LED light from the light source is thereby implemented. One or more of a black painting, a coating layer, an application layer, and a deposition layer are provided, thereby providing concealment of the lamp inner space of the lens, anti-peeling of a deposit, and diversity of fluorescent color.Type: GrantFiled: August 17, 2022Date of Patent: October 17, 2023Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, HYUNDAI MOBIS CO., LTD.Inventors: Seung-Pyo Hong, Yun-Min Cho, Ju-Hyun Kim, Chang-Hwan Oh, Jung-Woo Shin, Dong-Joo Park, Han-Soo Park
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Publication number: 20230290699Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.Type: ApplicationFiled: May 18, 2023Publication date: September 14, 2023Inventors: Ji Young Chung, Dong Joo Park, Jin Seong Kim, Jae Sung Park, Se Hwan Hong
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Patent number: 11746981Abstract: A multi-faceted reflective hidden lighting lamp applied to a vehicle may block a portion of external light and repeatedly reflect internal light in two or more steps with a reflective surface on one side surface of a light reflective portion having a triangular sawtooth shape formed on a lens in a direction facing a light source and a transmissive surface on the other side surface thereof in an internal space of the lamp, and form a reflective layer on the reflective surface in painting/deposition/plating processes, a laser perforation process, a masking process, and a film insert process to reduce a color conversion material for the same color conversion effect and increase the utilization of an overlap skin portion of the lens, increasing the light blocking ability for a region other than the region required by regulations in addition to increasing the transmissive/light-receiving ability for the region required by regulations.Type: GrantFiled: August 23, 2022Date of Patent: September 5, 2023Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, HYUNDAI MOBIS CO., LTD.Inventors: Seung-Pyo Hong, Yun-Min Cho, Chang-Hwan Oh, Dong-Joo Park, Han-Soo Park, Ju-Hyun Kim, Jung-Woo Shin
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Publication number: 20230235870Abstract: A multi-faceted reflective hidden lighting lamp applied to a vehicle may block a portion of external light and repeatedly reflect internal light in two or more steps with a reflective surface on one side surface of a light reflective portion having a triangular sawtooth shape formed on a lens in a direction facing a light source and a transmissive surface on the other side surface thereof in an internal space of the lamp, and form a reflective layer on the reflective surface in painting/deposition/plating processes, a laser perforation process, a masking process, and a film insert process to reduce a color conversion material for the same color conversion effect and increase the utilization of an overlap skin portion of the lens, increasing the light blocking ability for a region other than the region required by regulations in addition to increasing the transmissive/light-receiving ability for the region required by regulations.Type: ApplicationFiled: August 23, 2022Publication date: July 27, 2023Inventors: Seung-Pyo HONG, Yun-Min CHO, Chang-Hwan OH, Dong-Joo PARK, Han-Soo PARK, Ju-Hyun KIM, Jung-Woo SHIN
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Patent number: 11682598Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.Type: GrantFiled: November 16, 2021Date of Patent: June 20, 2023Assignee: Amkor Technology Singapore Holding Pte.Inventors: Ji Young Chung, Dong Joo Park, Jin Seong Kim, Jae Sung Park, Se Hwan Hong
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Publication number: 20230117746Abstract: In one example, a semiconductor device comprises a spacer substrate, a first lens substrate over the first spacer substrate, and a lens protector over the first lens dielectric adjacent to the first lens. The spacer substrate comprises a spacer dielectric, a spacer top terminal, a spacer bottom terminal, and a spacer via. The first lens substrate comprises a first lens dielectric, a first lens, a first lens top terminal, a first lens bottom terminal, and a first lens via. A first interconnect is coupled with the spacer top terminal and the first lens bottom terminal. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: December 20, 2022Publication date: April 20, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Ki Dong Sim, Dong Joo Park, Jin Young Khim
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Publication number: 20230110213Abstract: In one example, an electronic device, comprises a first substrate comprising a first conductive structure, a second substrate comprising a second conductive structure, wherein the first substrate is over the second substrate, a first electronic component between the first substrate and the second substrate, a vertical interconnect between the first substrate and the second substrate, wherein the vertical interconnect is coupled with the first conductive structure and the second conductive structure, and an encapsulant between the first substrate and the second substrate and covering the vertical interconnect. A vertical port on the first electronic component is exposed by an aperture of the first substrate. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: October 25, 2022Publication date: April 13, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Myung Jea Choi, Gyu Wan Han, Gi Tae Lim, Dong Joo Park, Ji Hun Yi, Jin Young Khim
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Publication number: 20230088061Abstract: In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: November 29, 2022Publication date: March 23, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dong Hyeon Park, Min Ho Kim, Dong Su Ryu, Seok Ho Na, Choong Hoe Kim, Yun Seok Song, Woo Kyung Ju, Dong Joo Park
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Publication number: 20230073432Abstract: A hidden lighting lamp uses a color conversion material and is applied to a vehicle. A color conversion member is spaced apart from a light source by a light source air gap (La) such that the color conversion member is integrally engaged with a lens for projecting light of the light source to the outside or such that the color conversion member is spaced apart from the lens by a lens air gap (Lb). Hidden lighting without deterioration of optical efficiency of LED light from the light source is thereby implemented. One or more of a black painting, a coating layer, an application layer, and a deposition layer are provided, thereby providing concealment of the lamp inner space of the lens, anti-peeling of a deposit, and diversity of fluorescent color.Type: ApplicationFiled: August 17, 2022Publication date: March 9, 2023Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, HYUNDAI MOBIS CO., LTD.Inventors: Seung-Pyo Hong, Yun-Min Cho, Ju-Hyun Kim, Chang-Hwan Oh, Jung-Woo Shin, Dong-Joo Park, Han-Soo Park
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Publication number: 20230070922Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.Type: ApplicationFiled: November 8, 2022Publication date: March 9, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
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Patent number: 11545604Abstract: In one example, a semiconductor device comprises a spacer substrate, a first lens substrate over the first spacer substrate, and a lens protector over the first lens dielectric adjacent to the first lens. The spacer substrate comprises a spacer dielectric, a spacer top terminal, a spacer bottom terminal, and a spacer via. The first lens substrate comprises a first lens dielectric, a first lens, a first lens top terminal, a first lens bottom terminal, and a first lens via. A first interconnect is coupled with the spacer top terminal and the first lens bottom terminal. Other examples and related methods are also disclosed herein.Type: GrantFiled: May 15, 2020Date of Patent: January 3, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Ki Dong Sim, Dong Joo Park, Jin Young Khim
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Publication number: 20220415769Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.Type: ApplicationFiled: August 29, 2022Publication date: December 29, 2022Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
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Patent number: 11495505Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.Type: GrantFiled: September 11, 2020Date of Patent: November 8, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
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Patent number: 11482496Abstract: In one example, an electronic device, comprises a first substrate comprising a first conductive structure, a second substrate comprising a second conductive structure, wherein the first substrate is over the second substrate, a first electronic component between the first substrate and the second substrate, a vertical interconnect between the first substrate and the second substrate, wherein the vertical interconnect is coupled with the first conductive structure and the second conductive structure, and an encapsulant between the first substrate and the second substrate and covering the vertical interconnect. A vertical port on the first electronic component is exposed by an aperture of the first substrate. Other examples and related methods are also disclosed herein.Type: GrantFiled: October 16, 2020Date of Patent: October 25, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Myung Jea Choi, Gyu Wan Han, Gi Tae Lim, Dong Joo Park, Ji Hun Yi, Jin Young Khim