Patents by Inventor Dong Joo Park

Dong Joo Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11869829
    Abstract: In accordance with the present description, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: January 9, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Dong Joo Park, Jin Seong Kim, Ki Wook Lee, Dae Byoung Kang, Ho Choi, Kwang Ho Kim, Jae Dong Kim, Yeon Soo Jung, Sung Hwan Cho
  • Publication number: 20230411342
    Abstract: In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: August 31, 2023
    Publication date: December 21, 2023
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Dong Hyeon Park, Min Ho Kim, Dong Su Ryu, Seok Ho Na, Choong Hoe Kim, Yun Seok Song, Woo Kyung Ju, Dong Joo Park
  • Patent number: 11788691
    Abstract: A hidden lighting lamp uses a color conversion material and is applied to a vehicle. A color conversion member is spaced apart from a light source by a light source air gap (La) such that the color conversion member is integrally engaged with a lens for projecting light of the light source to the outside or such that the color conversion member is spaced apart from the lens by a lens air gap (Lb). Hidden lighting without deterioration of optical efficiency of LED light from the light source is thereby implemented. One or more of a black painting, a coating layer, an application layer, and a deposition layer are provided, thereby providing concealment of the lamp inner space of the lens, anti-peeling of a deposit, and diversity of fluorescent color.
    Type: Grant
    Filed: August 17, 2022
    Date of Patent: October 17, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, HYUNDAI MOBIS CO., LTD.
    Inventors: Seung-Pyo Hong, Yun-Min Cho, Ju-Hyun Kim, Chang-Hwan Oh, Jung-Woo Shin, Dong-Joo Park, Han-Soo Park
  • Publication number: 20230290699
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
    Type: Application
    Filed: May 18, 2023
    Publication date: September 14, 2023
    Inventors: Ji Young Chung, Dong Joo Park, Jin Seong Kim, Jae Sung Park, Se Hwan Hong
  • Patent number: 11746981
    Abstract: A multi-faceted reflective hidden lighting lamp applied to a vehicle may block a portion of external light and repeatedly reflect internal light in two or more steps with a reflective surface on one side surface of a light reflective portion having a triangular sawtooth shape formed on a lens in a direction facing a light source and a transmissive surface on the other side surface thereof in an internal space of the lamp, and form a reflective layer on the reflective surface in painting/deposition/plating processes, a laser perforation process, a masking process, and a film insert process to reduce a color conversion material for the same color conversion effect and increase the utilization of an overlap skin portion of the lens, increasing the light blocking ability for a region other than the region required by regulations in addition to increasing the transmissive/light-receiving ability for the region required by regulations.
    Type: Grant
    Filed: August 23, 2022
    Date of Patent: September 5, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, HYUNDAI MOBIS CO., LTD.
    Inventors: Seung-Pyo Hong, Yun-Min Cho, Chang-Hwan Oh, Dong-Joo Park, Han-Soo Park, Ju-Hyun Kim, Jung-Woo Shin
  • Publication number: 20230235870
    Abstract: A multi-faceted reflective hidden lighting lamp applied to a vehicle may block a portion of external light and repeatedly reflect internal light in two or more steps with a reflective surface on one side surface of a light reflective portion having a triangular sawtooth shape formed on a lens in a direction facing a light source and a transmissive surface on the other side surface thereof in an internal space of the lamp, and form a reflective layer on the reflective surface in painting/deposition/plating processes, a laser perforation process, a masking process, and a film insert process to reduce a color conversion material for the same color conversion effect and increase the utilization of an overlap skin portion of the lens, increasing the light blocking ability for a region other than the region required by regulations in addition to increasing the transmissive/light-receiving ability for the region required by regulations.
    Type: Application
    Filed: August 23, 2022
    Publication date: July 27, 2023
    Inventors: Seung-Pyo HONG, Yun-Min CHO, Chang-Hwan OH, Dong-Joo PARK, Han-Soo PARK, Ju-Hyun KIM, Jung-Woo SHIN
  • Patent number: 11682598
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: June 20, 2023
    Assignee: Amkor Technology Singapore Holding Pte.
    Inventors: Ji Young Chung, Dong Joo Park, Jin Seong Kim, Jae Sung Park, Se Hwan Hong
  • Publication number: 20230117746
    Abstract: In one example, a semiconductor device comprises a spacer substrate, a first lens substrate over the first spacer substrate, and a lens protector over the first lens dielectric adjacent to the first lens. The spacer substrate comprises a spacer dielectric, a spacer top terminal, a spacer bottom terminal, and a spacer via. The first lens substrate comprises a first lens dielectric, a first lens, a first lens top terminal, a first lens bottom terminal, and a first lens via. A first interconnect is coupled with the spacer top terminal and the first lens bottom terminal. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: December 20, 2022
    Publication date: April 20, 2023
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ki Dong Sim, Dong Joo Park, Jin Young Khim
  • Publication number: 20230110213
    Abstract: In one example, an electronic device, comprises a first substrate comprising a first conductive structure, a second substrate comprising a second conductive structure, wherein the first substrate is over the second substrate, a first electronic component between the first substrate and the second substrate, a vertical interconnect between the first substrate and the second substrate, wherein the vertical interconnect is coupled with the first conductive structure and the second conductive structure, and an encapsulant between the first substrate and the second substrate and covering the vertical interconnect. A vertical port on the first electronic component is exposed by an aperture of the first substrate. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: October 25, 2022
    Publication date: April 13, 2023
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Myung Jea Choi, Gyu Wan Han, Gi Tae Lim, Dong Joo Park, Ji Hun Yi, Jin Young Khim
  • Publication number: 20230088061
    Abstract: In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: November 29, 2022
    Publication date: March 23, 2023
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Dong Hyeon Park, Min Ho Kim, Dong Su Ryu, Seok Ho Na, Choong Hoe Kim, Yun Seok Song, Woo Kyung Ju, Dong Joo Park
  • Publication number: 20230073432
    Abstract: A hidden lighting lamp uses a color conversion material and is applied to a vehicle. A color conversion member is spaced apart from a light source by a light source air gap (La) such that the color conversion member is integrally engaged with a lens for projecting light of the light source to the outside or such that the color conversion member is spaced apart from the lens by a lens air gap (Lb). Hidden lighting without deterioration of optical efficiency of LED light from the light source is thereby implemented. One or more of a black painting, a coating layer, an application layer, and a deposition layer are provided, thereby providing concealment of the lamp inner space of the lens, anti-peeling of a deposit, and diversity of fluorescent color.
    Type: Application
    Filed: August 17, 2022
    Publication date: March 9, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, HYUNDAI MOBIS CO., LTD.
    Inventors: Seung-Pyo Hong, Yun-Min Cho, Ju-Hyun Kim, Chang-Hwan Oh, Jung-Woo Shin, Dong-Joo Park, Han-Soo Park
  • Publication number: 20230070922
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Application
    Filed: November 8, 2022
    Publication date: March 9, 2023
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Patent number: 11545604
    Abstract: In one example, a semiconductor device comprises a spacer substrate, a first lens substrate over the first spacer substrate, and a lens protector over the first lens dielectric adjacent to the first lens. The spacer substrate comprises a spacer dielectric, a spacer top terminal, a spacer bottom terminal, and a spacer via. The first lens substrate comprises a first lens dielectric, a first lens, a first lens top terminal, a first lens bottom terminal, and a first lens via. A first interconnect is coupled with the spacer top terminal and the first lens bottom terminal. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: January 3, 2023
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ki Dong Sim, Dong Joo Park, Jin Young Khim
  • Publication number: 20220415769
    Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
    Type: Application
    Filed: August 29, 2022
    Publication date: December 29, 2022
    Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
  • Patent number: 11495505
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: November 8, 2022
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Patent number: 11482496
    Abstract: In one example, an electronic device, comprises a first substrate comprising a first conductive structure, a second substrate comprising a second conductive structure, wherein the first substrate is over the second substrate, a first electronic component between the first substrate and the second substrate, a vertical interconnect between the first substrate and the second substrate, wherein the vertical interconnect is coupled with the first conductive structure and the second conductive structure, and an encapsulant between the first substrate and the second substrate and covering the vertical interconnect. A vertical port on the first electronic component is exposed by an aperture of the first substrate. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: October 25, 2022
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Myung Jea Choi, Gyu Wan Han, Gi Tae Lim, Dong Joo Park, Ji Hun Yi, Jin Young Khim
  • Patent number: 11430723
    Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: August 30, 2022
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
  • Patent number: 11398455
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The second internal interconnect can be coupled to the second electronic device and the first electronic device. The encapsulant can cover the substrate inner sidewall and the device stack, and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: July 26, 2022
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee
  • Publication number: 20220122921
    Abstract: In one example, an electronic device, comprises a first substrate comprising a first conductive structure, a second substrate comprising a second conductive structure, wherein the first substrate is over the second substrate, a first electronic component between the first substrate and the second substrate, a vertical interconnect between the first substrate and the second substrate, wherein the vertical interconnect is coupled with the first conductive structure and the second conductive structure, and an encapsulant between the first substrate and the second substrate and covering the vertical interconnect. A vertical port on the first electronic component is exposed by an aperture of the first substrate. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: October 16, 2020
    Publication date: April 21, 2022
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Myung Jea Choi, Gyu Wan Han, Gi Tae Lim, Dong Joo Park, Ji Hun Yi, Jin Young Khim
  • Publication number: 20220077013
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
    Type: Application
    Filed: November 16, 2021
    Publication date: March 10, 2022
    Inventors: Ji Young Chung, Dong Joo Park, Jin Seong Kim, Jae Sung Park, Se Hwan Hong