Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

Abstract: In accordance with the present invention, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body.

Abstract: A stacked semiconductor package and a manufacturing method thereof. For example and without limitation, various aspects of this disclosure provide a semiconductor package in which an upper interposer and/or package are electrically and mechanically coupled to a lower package utilizing an adhesive member comprising conductive particles.

Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

Abstract: A stacked semiconductor package and a manufacturing method thereof. For example and without limitation, various aspects of this disclosure provide a semiconductor package in which an upper interposer and/or package are electrically and mechanically coupled to a lower package utilizing an adhesive member comprising conductive particles.

Abstract: Embodiments of the present invention may provide an apparatus and a method for transmitting and receiving a random access channel (RACH) in a single carrier-frequency division multiple access (SC-FDMA) system. A frequency domain RACH signal may be mapped to a localized sub-frequency band of an entire frequency band available to the SC-FDMA system. A guard band including at least one sub carrier may be allocated between the RACH signal band and other channel signal bands. A guard time may be allocated between the RACE signal and other channel signals in the time domain. The RACH signal may include a short message including information related to a mobile station. The RACE signal may be detected in a frequency based method, a time based method or a sliding matched filter based method. Receiver complexity can be decreased if the RACH signal includes a CAZAC code sequence for a preamble. In such a case, a receive delay may be simply calculated and then adjusted more accurately.

Abstract: Disclosed is a semiconductor device having overlapped via apertures formed in an encapsulant to outwardly expose solder balls. When different types of semiconductor devices are electrically connected to the solder balls through the overlapped via apertures, flux or solder paste is unlikely to contact sidewall portions of the overlapped via apertures. Therefore, different types of semiconductor devices can be mounted with improved efficiency.

Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: Embodiments of the present invention may provide an apparatus and a method for transmitting and receiving a random access channel (RACH) in a single carrier-frequency division multiple access (SC-FDMA) system. A frequency domain RACH signal may be mapped to a localized sub-frequency band of an entire frequency band available to the SC-FDMA system. A guard band including at least one sub carrier may be allocated between the RACH signal band and other channel signal bands. A guard time may be allocated between the RACE signal and other channel signals in the time domain. The RACH signal may include a short message including information related to a mobile station. The RACH signal may be detected in a frequency based method, a time based method or a sliding matched filter based method. Receiver complexity can be decreased if the RACH signal includes a CAZAC code sequence for a preamble. In such a case, a receive delay may be simply calculated and then adjusted more accurately.

Abstract: Disclosed is a semiconductor device having overlapped via apertures formed in an encapsulant to outwardly expose solder balls. When different types of semiconductor devices are electrically connected to the solder balls through the overlapped via apertures, flux or solder paste is unlikely to contact sidewall portions of the overlapped via apertures. Therefore, different types of semiconductor devices can be mounted with improved efficiency.

Abstract: Embodiments of the present invention may provide an apparatus and a method for transmitting and receiving a random access channel (RACH) in a single carrier-frequency division multiple access (SC-FDMA) system. A frequency domain RACH signal may be mapped to a localized sub-frequency band of an entire frequency band available to the SC-FDMA system. A guard band including at least one sub carrier may be allocated between the RACH signal band and other channel signal bands. A guard time may be allocated between the RACE signal and other channel signals in the time domain. The RACH signal may include a short message including information related to a mobile station. The RACE signal may be detected in a frequency based method, a time based method or a sliding matched filter based method. Receiver complexity can be decreased if the RACH signal includes a CAZAC code sequence for a preamble. In such a case, a receive delay may be simply calculated and then adjusted more accurately.

Abstract: Embodiments of the present invention may provide an apparatus and a method for transmitting and receiving a random access channel (RACH) in a single carrier-frequency division multiple access (SC-FDMA) system. A frequency domain RACH signal may be mapped to a localized sub-frequency band of an entire frequency band available to the SC-FDMA system. A guard band including at least one sub carrier may be allocated between the RACH signal band and other channel signal bands. A guard time may be allocated between the RACE signal and other channel signals in the time domain. The RACH signal may include a short message including information related to a mobile station. The RACH signal may be detected in a frequency based method, a time based method or a sliding matched filter based method. Receiver complexity can be decreased if the RACH signal includes a CAZAC code sequence for a preamble. In such a case, a receive delay may be simply calculated and then adjusted more accurately.

Abstract: Disclosed are a semiconductor device capable of efficiently radiating heat of a semiconductor die and a method of fabricating the same. The semiconductor device efficiently radiates the heat by preventing an encapsulant from reaching the semiconductor die by an encapsulant dam so that an upper surface of the semiconductor die is exposed out of the encapsulant. In addition, the semiconductor device is configured to expose a pre-solder ball or a conductive pattern of a substrate through a via of the encapsulant. Therefore, electrical connection between the pre-solder ball and a solder ball of another semiconductor device stacked thereon is easily achieved.

Abstract: Embodiments of the present invention may provide an apparatus and a method for transmitting and receiving a random access channel (RACH) in a single carrier-frequency division multiple access (SC-FDMA) system. A frequency domain RACH signal may be mapped to a localized sub-frequency band of an entire frequency band available to the SC-FDMA system. A guard band including at least one sub carrier may be allocated between the RACH signal band and other channel signal bands. A guard time may be allocated between the RACH signal and other channel signals in the time domain. The RACH signal may include a short message including information related to a mobile station. The RACH signal may be detected in a frequency based method, a time based method or a sliding matched filter based method. Receiver complexity can be decreased if the RACH signal includes a CAZAC code sequence for a preamble. In such a case, a receive delay may be simply calculated and then adjusted more accurately.

Abstract: In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package of the present invention includes a generally planar die pad or die paddle defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads are provided in two concentric rows or rings which at least partially circumvent the die pad, with other leads including portions which protrude from respective side surfaces of a package body of the semiconductor package. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads. At least portions of the die pad, the leads, and the semiconductor die are encapsulated by the package body.

Abstract: Embodiments of the present invention may provide an apparatus and a method for transmitting and receiving a random access channel (RACH) in a single carrier-frequency division multiple access (SC-FDMA) system. A frequency domain RACH signal may be mapped to a localized sub-frequency band of an entire frequency band available to the SC-FDMA system. A guard band including at least one sub carrier may be allocated between the RACH signal band and other channel signal bands. A guard time may be allocated between the RACH signal and other channel signals in the time domain. The RACH signal may include a short message including information related to a mobile station. The RACH signal may be detected in a frequency based method, a time based method or a sliding matched filter based method. Receiver complexity can be decreased if the RACH signal includes a CAZAC code sequence for a preamble. In such a case, a receive delay may be simply calculated and then adjusted more accurately.