Patents by Inventor Dong-Ju Jeon

Dong-Ju Jeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130000960
    Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a copper pad surface roughness-treated to have a surface roughness of 0.1 to 1.0 ?m pitch period; and an electroless surface treatment plating layer formed on the copper pad. According to the present invention, when the copper pad has a surface roughness of a predetermined pitch period, the electroless surface treatment plating layer formed on the copper pad also has a surface roughness of the predetermined pitch period, thereby having an effect of widening a surface area and improving workability at the time of a wire bonding process for connection with an external device.
    Type: Application
    Filed: May 15, 2012
    Publication date: January 3, 2013
    Inventors: Dong Jun LEE, Dong Ju Jeon, Jung Youn Pang, Seong Min Cho, Chi Seong Kim
  • Publication number: 20130003332
    Abstract: Disclosed herein are an electroless surface treatment plated layer of a printed circuit board, a method for preparing the same, and printed circuit board including the same. The electroless surface treatment plated layer includes: electroless nickel (Ni) plated coating/palladium (Pd) plated coating/gold (Au) plated coating, wherein each of the electroless nickel, palladium, and gold plated coatings has a thickness of 0.02 to 1 ?m, 0.01 to 0.3 ?m, and 0.01 to 0.5 ?m. In the electroless surface treatment plated layer of the printed circuit board, a thickness of the nickel plated coating is specially minimized to 0.02 to 1 ?m, thereby making it possible to form an optimized electroless Ni/Pd/Au surface treatment plated layer.
    Type: Application
    Filed: June 25, 2012
    Publication date: January 3, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Jun Lee, Dong Ju Jeon, Jung Youn Pang, Seong Min Cho, Chi Seong Kim
  • Publication number: 20120322802
    Abstract: The present invention relates to novel 2,4-pyrimidine derivatives and a use thereof, and more particularly, to pyrimidine derivatives which are effective for systemic lupus erythematosus, a composition for preventing and treating systemic lupus erythematosus comprising the same as an active ingredient and a method for screening the same. The present inventors found novel materials inhibiting surface translocation of gp96 by mimicking a function of AIMP1 which is a molecular anchor for an intracellular residence of gp96, and identified in vitro and in vivo activity of the materials for preventing and treating SLE by alleviating SLE plasma in autoimmune diseases. Therefore, the present invention provides a novel method for screening a therapeutic agent for SLE, and preventing or treating SLE using the mechanism.
    Type: Application
    Filed: November 2, 2010
    Publication date: December 20, 2012
    Applicants: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY, SNU R&DB FOUNDATION
    Inventors: Sunghoon Kim, Jung Min Han, Hyeong Rae Kim, Dong Ju Jeon, Jong Hwan Song, Kyung Eun Park
  • Patent number: 8143262
    Abstract: The present invention relates to novel {7-(3?,4?-dialkoxyphenyl)-[1,2,4]-triazolo[1,5-a]pyrimidine compounds or pharmaceutically acceptable salts thereof, a process for preparing the same, and pharmaceutical compositions for treating or preventing inflammatory diseases including asthma and chronic obstructive pulmonary disease, arthritis, atopic dermatitis, cancers including leukemia, and degenerative brain diseases including Alzheimer's disease, depression and memory impairment, which comprises the same as an active ingredient.
    Type: Grant
    Filed: March 7, 2008
    Date of Patent: March 27, 2012
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Dong Ju Jeon, Zaesung No, Jong Hwan Song, Gehyeong Lee, Ikyon Kim, Chang Min Park, Hyae Gyeong Cheon, Young Sik Cho, Jin Sook Song, Myung Ae Bae, Sung-eun Yoo
  • Publication number: 20110079349
    Abstract: The present invention provides a method of manufacturing a printed circuit board including the steps of: preparing a pair of raw materials, each formed by sequentially stacking a release film and a first insulating layer, and an adhesive layer, respectively; embedding the pair of raw materials, which are opposed to each other, in the adhesive layer while disposing the release films toward an inner layer; forming a second insulating layer, which has a via formed therethrough and a circuit pattern formed on an upper surface to be connected to the via, on the first insulating layer; cutting edge portions of the second and first insulating layers, the release film, and the adhesive layer; and removing the release film from the first insulating layer.
    Type: Application
    Filed: December 17, 2009
    Publication date: April 7, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Suk Hyeon Cho, Chang Sup Ryu, Jin Yong An, Soon Oh Jung, Sung Won Jeong, Byung Moon Kim, Dong Ju Jeon, Seok Kyu Lee, Jin Ho Kim
  • Publication number: 20110061922
    Abstract: Disclosed is a package substrate, which includes an insulating layer including a circuit layer having a via for connecting layers and an insulating member formed in the insulating layer so as to separate the insulating layer, thus preventing the package substrate from warping and reducing land co-planarity of the substrate. A method of fabricating the package substrate is also provided, including (a) forming a first circuit layer on a carrier, (b) forming an insulating layer on the carrier having the first circuit layer, (c) forming an insulating member in the insulating layer so as to separate the insulating layer, (d) forming a second circuit layer including a via on the insulating layer and the insulating member, and (e) removing the carrier.
    Type: Application
    Filed: October 30, 2009
    Publication date: March 17, 2011
    Inventors: Jae Joon LEE, Jin Yong Ahn, Jin Ho Kim, Dong Ju Jeon
  • Publication number: 20110056614
    Abstract: A manufacturing method of a circuit board is disclosed. The manufacturing method of a circuit board in accordance with the present invention includes forming a separation layer on a carrier, stacking an adhesion layer which is coupled to the carrier and covers the separation layer, forming a circuit layer on the adhesion layer, forming a circuit board unit by cutting the separation layer, the adhesion layer and the circuit layer such that the separation layer is separated from the carrier, and forming a stiffener by processing the separation layer of the circuit board unit. The manufacturing method of a circuit board in accordance with the present invention can reduce the cost and time for forming the stiffener by forming the stiffener together in the manufacturing process of the circuit board.
    Type: Application
    Filed: December 30, 2009
    Publication date: March 10, 2011
    Inventors: Jin-Yong AN, Soon-Oh Jung, Dong-Ju Jeon
  • Publication number: 20110048786
    Abstract: Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening exposing a pad unit of the inner circuit layer; and a bump that is integrally formed with the pad unit and is protruded from the inner side of the protective layer to the outside of the protective layer through the opening. The bump is integrally formed with the pad unit, thereby improving bonding strength between the bump and the printed circuit board, and the surface area of the bump is formed to be wide, thereby improving bonding strength between a solder ball and the printed circuit board.
    Type: Application
    Filed: August 27, 2010
    Publication date: March 3, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Suk Hyeon Cho, Jin Yong Ahn, Soon Oh Jung, Dong Ju Jeon, Ki Hwan Kim, Byung Moon Kim
  • Publication number: 20100105704
    Abstract: The present invention relates to novel {7-(3?,4?-dialkoxyphenyl)-[1,2,4]-triazolo[1,5-a]pyrimidine compounds or pharmaceutically acceptable salts thereof, a process for preparing the same, and pharmaceutical compositions for treating or preventing inflammatory diseases including asthma and chronic obstructive pulmonary disease, arthritis, atopic dermatitis, cancers including leukemia, and degenerative brain diseases including Alzheimer's disease, depression and memory impairment, which comprises the same as an active ingredient.
    Type: Application
    Filed: March 7, 2008
    Publication date: April 29, 2010
    Applicant: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY
    Inventors: Dong Ju Jeon, Zaesung No, Jong Hwan Song, Gehyeong Lee, Ikyon Kim, Chang Min Park, Hyae Gyeong Cheon, Young Sik Cho, Jin Sook Song, Myung Ae Bae, Sung-eun Yoo
  • Publication number: 20090027864
    Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. A printed circuit board, which includes an insulation layer, a circuit pattern formed on a surface of the insulation layer that includes at least one pad, and a solder resist which covers the circuit pattern, and in which an opening is formed that exposes a portion of a side and a surface of the pad, can ensure a sufficient amount of attachment area for the pads and the solder resist, to strengthen the adhesion of the pads. Also, the adhesion can be increased between the electronic components and the printed circuit board, and heat release characteristics can be improved.
    Type: Application
    Filed: January 14, 2008
    Publication date: January 29, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chung-Woo Cho, Jong-Jin Lee, Soon-Jin Cho, Yong-Duk Lee, Ki-Young Yoo, Woo-Young Lee, Chin-Kwan Kim, Jong-Yong Kim, Dong-Ju Jeon
  • Patent number: 6846934
    Abstract: Novel photochromic diarylethenes substituted with an isoxazole group and the method of preparation are disclosed. Also disclosed are compositions made with the photochromic diarylethenes. The preparation of thin films with the photochromic diarylethenes or compositions thereof are disclosed. The photochromic diarylethenes or compositions thereof may be used, for example in recording materials, photochromic windows, indicating elements, plastic mirrors, photochromic filters, photo switches, photosensitive drums, recording elements, solar cells, lens, fibers and optical elements.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: January 25, 2005
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Eun Kyoung Kim, Song Yun Cho, Dong Ju Jeon, Young Mi Kim
  • Patent number: 6838416
    Abstract: The present invention provided with novel 5-benzyloxymethyl-1,2-isoxazoline derivatives of the formula (1), their preparation method and their use as herbicides. The 5-benzyloxymethyl-1,2-isoxazoline derivatives according to the present invention have sufficiently high herbicidal activity against the weeds in the paddy field rice even at low dose rates and excellent selectivity to transferred rice in particular. As thus, the compounds of the present invention are typically useful as herbicides for control of paddy weeds in rice.
    Type: Grant
    Filed: September 5, 2001
    Date of Patent: January 4, 2005
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Eung-Kul Ryu, Hyoung-Rae Kim, Dong-Ju Jeon, Jong-Whan Song, Kyoung-Mahn Kim, Jung-No Lee, Hyoung-Cheul Kim, Kyung-Sik Hong
  • Publication number: 20040023808
    Abstract: The present invention provided with novel 5-benzyloxymethyl-1,2-isoxazoline derivatives of the formula (1), their preparation method and their use as herbicides. The 5-benzyloxymethyl-1,2-isoxazoline derivatives according to the present invention have sufficiently high herbicidal activity against the weeds in the paddy field rice even at low dose rates and excellent selectivity to transferred rice in particular. As thus, the compounds of the present invention are typically useful as herbicides for control of paddy weeds in rice.
    Type: Application
    Filed: March 6, 2003
    Publication date: February 5, 2004
    Inventors: Eung-Kul Ryu, Hyoung-Rae Kim, Dong-Ju Jeon, Jong-Whan Song, Kyoung-Mahn Kim, Jung-No Lee, Hyoung-cheul Kim, Kyung-Sik Hong
  • Patent number: 6239076
    Abstract: The present invention relates to 2-(5-isoxazolinylmethyloxyphenyl)-4,5,6,7-tetrahydro-2H-indazole derivatives of formula 1, their preparation method and their use as herbicides. As the compounds have excellent herbicidal activity against paddy weeds comprising ECHOR, SCPJU, MOOVA, CYPSE and SAGPY, and better selectivity, the compounds of the present invention are typically useful as herbicides for control of paddy weeds in conditions with seeded rice and transferred rice.
    Type: Grant
    Filed: October 6, 2000
    Date of Patent: May 29, 2001
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Eung Kul Ryu, Dong Ju Jeon, Jong Hwan Song, Hyoung Rae Kim, Jung No Lee, Kyoung Mahn Kim, Kwang Yun Cho
  • Patent number: 5461024
    Abstract: A novel thiophenesulfonylurea derivative having herbicidal activity, having the formula (I): ##STR1## wherein the substituents are herein described.
    Type: Grant
    Filed: December 9, 1993
    Date of Patent: October 24, 1995
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Dae-Whang Kim, Dong Ju Jeon, Sang Soon Park, Jae Chun Woo, Tae Jun Kim