Patents by Inventor Dong Lee

Dong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12381749
    Abstract: A method and apparatus for reducing orphan blocks for a blockchain is provided. The second wireless device obtains information on a first block generated by a first wireless device. The second wireless device initiates to generate a second block based on the information. The second wireless device generates an indication informing that a generation of the second block is initiated. The second wireless device shares the generated indication among participants of the blockchain.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: August 5, 2025
    Assignee: LG ELECTRONICS INC.
    Inventor: Ki-Dong Lee
  • Publication number: 20250232977
    Abstract: Methods of forming a crystalline wafers such as silicon carbide wafers are disclosed. Such a method may include providing a crystalline substrate comprising a substrate first surface and a substrate second surface opposite the substrate first surface. The method may also include creating a separation layer at a first depth from the substrate first surface and creating a mitigation layer at a second depth from a substrate second surface. Creating the separation layer may cause the crystalline substrate to bow, and creating the mitigation layer may reduce the bow of the crystalline substrate. The method may further include separating the wafer from the crystalline substrate along the separation layer.
    Type: Application
    Filed: December 16, 2024
    Publication date: July 17, 2025
    Inventors: Jeremy Andre Turcaud, Dong Lee, Dennis Rossman, Greg Lucchesi, Ben Chan
  • Patent number: 12362149
    Abstract: Embodiments of the present disclosure include methods and apparatus for depositing a plurality of layers on a large area substrate. In one embodiment, a processing chamber for plasma deposition is provided. The processing chamber includes a showerhead and a substrate support assembly. The showerhead is coupled to an RF power source and a ground and includes a plurality of perforated gas diffusion members. A plurality of plasma applicators is disposed within the showerhead, wherein one plasma applicator of the plurality of plasma applicators corresponds to one of the plurality of perforated gas diffusion members. Further, a DC bias power source is coupled to a substrate support assembly.
    Type: Grant
    Filed: December 4, 2023
    Date of Patent: July 15, 2025
    Assignee: Applied Materials, Inc.
    Inventors: Chien-Teh Kao, Tae Kyung Won, Carl A. Sorensen, Sanjay D. Yadav, Young Dong Lee, Shinichi Kurita, Soo Young Choi
  • Publication number: 20250219627
    Abstract: The present disclosure relates to a harmonics cancellation circuit and a vector synthesis device using a harmonics cancellation circuit. A harmonics cancellation circuit according to an embodiment of the present disclosure includes a plurality of capacitors that one end is connected to a source node of a plurality of amplifiers receiving a plurality of quadrature phase signals, respectively; and a virtual ground to which the other end of each of the plurality of capacitors is commonly connected, wherein the source node of the plurality of amplifiers may be connected to a plurality of current controllers, respectively.
    Type: Application
    Filed: November 25, 2024
    Publication date: July 3, 2025
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Seung Hun WANG, Sun Woo KONG, Bong Hyuk PARK, Hui Dong LEE, Seung Hyun JANG, Jung Hwan HWANG
  • Publication number: 20250218689
    Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers, internal electrodes, and a reinforcing pattern and an external electrode on the body. The internal electrodes are disposed alternately with the dielectric layer therebetween in the first direction. The reinforcing pattern is disposed on surfaces of a capacitance formation portion in the first direction. The reinforcing pattern contacts a surface of the body in a second direction. The reinforcing pattern includes four parts in a third direction from one end to the other end in the third direction. A length of the reinforcing pattern at a ¼ point in the second direction is greater than a length thereof at a ½ point in the second direction and a length thereof at a ¾ point in the second direction is greater than the length thereof at the ½ point in the second direction.
    Type: Application
    Filed: December 23, 2024
    Publication date: July 3, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Wun HWANG, Chae Dong LEE
  • Publication number: 20250216429
    Abstract: The present disclosure relates to an apparatus and a method for detecting a relative phase. The apparatus includes: a signal superposition unit configured to receive and switch a first input signal and a second input signal having a phase delay ?d with respect to the first input signal so that the first input signal and the second input signal pass through a sensing resistor or a sensing capacitor, respectively, and to superpose and output the passed signals; a signal power detection unit configured to detect power of the signal output from the signal superposition unit; and a differential signal detection unit configured to generate a differential signal for the power of the signal output according to the switching of the first input signal and the second input signal in the signal superposition unit, and to detect the differential signal that changes according to the phase delay ?d.
    Type: Application
    Filed: December 26, 2024
    Publication date: July 3, 2025
    Inventors: Seunghyun Jang, Sunwoo Kong, Bong Hyuk Park, SEUNG HUN WANG, HUI DONG LEE, Jung Hwan Hwang
  • Publication number: 20250218669
    Abstract: In a multilayer electronic component according to an embodiment of the present disclosure, a step of the multilayer electronic component may be alleviated by adjusting the shape of the reinforcing pattern included in the reinforcing portion disposed on at least one of one surface and the other surface of the capacitance formation portion in the first direction, and the occurrence of bending cracks may be suppressed.
    Type: Application
    Filed: November 22, 2024
    Publication date: July 3, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Wun Hwang, Chae Dong Lee
  • Patent number: 12348338
    Abstract: A reconfigurable circuit for differential network includes: first circuit which is a two-port differential circuit; first cross-coupled switch circuit connected to first port on one side of the first circuit in parallel; and second circuit connected to second port on the other side of the first cross-coupled switch circuit in series. The first cross-coupled switch circuit includes: first-series switch disposed between and connected to first terminal of the first port and first terminal of the second port in series; second-series switch disposed between and connected to second terminal of the first port and second terminal of the second port in series; first cross-coupled element disposed between and connected to the first terminal of the first port and the second terminal of the second port; and second cross-coupled element disposed between and connected to the second terminal of the first port and the first terminal of the second port.
    Type: Grant
    Filed: December 26, 2023
    Date of Patent: July 1, 2025
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Seung Hun Wang, Sun Woo Kong, Bong Hyuk Park, Hui Dong Lee, Seung Hyun Jang, Seok Bong Hyun
  • Publication number: 20250205733
    Abstract: Disclosed is a substrate treating apparatus including a valve assembly. The valve assembly includes a body and a diagram, and the body includes an inlet port through which the treatment liquid is introduced from a liquid supply source side, an outlet port through which the treatment liquid is discharged to the liquid treating chamber side, and a recirculation port through which the treatment liquid returns to the liquid supply source side. The diaphragm opens and closes a flow path of the treatment liquid flowing toward the outlet port side. The treatment liquid introduced into the body of the valve assembly is supplied to a nozzle through the outlet port or recovered to the liquid supply source side through the recirculation port.
    Type: Application
    Filed: December 12, 2024
    Publication date: June 26, 2025
    Applicant: SEMES CO., LTD.
    Inventors: Ju Dong LEE, Hyun Jin YANG, Seung Tae YANG
  • Publication number: 20250210258
    Abstract: A multilayer electronic component includes a body including a dielectric layer, and internal electrode layers disposed alternately in a first direction with the dielectric layer, and; first and second external electrodes disposed on the third and fourth surfaces, respectively, wherein internal electrode layer includes a main portion and an internal electrode extending from the main portion and connected to the external electrode through the lead portion, and a dummy electrode spaced apart from the internal electrode and connected to the external electrode, and a width of the lead portion may be smaller than a width of the main portion, at least a portion of the dummy electrode overlap the internal electrode in a length direction, and the dummy electrode may not overlap the internal electrode of another layer in a laminate direction.
    Type: Application
    Filed: October 29, 2024
    Publication date: June 26, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Wun Hwang, Chae Dong Lee, Sun Kyoung Park, Ji Hye Oh
  • Publication number: 20250202524
    Abstract: A radio frequency (RF) SPDT (single pole double throw) switch device for differential signal conversion is disclosed. According to one embodiment of the present disclosure, an RF SPDT switch device for differential signal conversion may include a central metal line; a first metal line and a second metal line connected to a first direction side of the central metal line; and a third metal line and a fourth metal line connected to a second direction side of the central metal line.
    Type: Application
    Filed: December 11, 2024
    Publication date: June 19, 2025
    Inventors: Sun Woo KONG, Bong Hyuk PARK, Seung Hun WANG, Hui Dong LEE, Seung Hyun JANG, Jung Hwan HWANG
  • Publication number: 20250201971
    Abstract: A battery module includes a housing that includes an internal space, a cell stack accommodated in the internal space and including a plurality of battery cells stacked in a first direction and a plurality of thermal blocking members disposed between battery cells in the plurality of battery cells, a plurality of electrically conductive members electrically connected to the plurality of battery cells, and a frame supporting the plurality of electrically conductive members. Each battery cell includes an electrode assembly and an electrode accommodating portion accommodating the electrode assembly. At least one of the thermal blocking members includes: a body portion configured to face the electrode accommodating portion and blocking 10 heat propagation between the plurality of battery cells, and one or more blocking portions extending from the body portion in a second direction perpendicular to the first direction, and configured to at least partially block gas flow in the first direction.
    Type: Application
    Filed: February 3, 2025
    Publication date: June 19, 2025
    Inventors: Eung Ho LEE, Ho Yeon KIM, Seung Dong LEE, Hae Ryong JEON
  • Publication number: 20250203847
    Abstract: A semiconductor memory device includes a substrate including: a first active pattern, a second active pattern, and a third active pattern; a bit line on the second active pattern; a first contact, at least a portion of the first contact being disposed on the first active pattern; and a second contact, at least a portion of the second contact being disposed on the third active pattern. The first active pattern includes a first recessed top surface that is in contact with the first contact. The third active pattern includes a second recessed top surface that is in contact with the second contact. A lowermost portion of the first recessed top surface of the first active pattern is disposed lower than a lowermost portion of the second recessed top surface of the third active pattern.
    Type: Application
    Filed: March 6, 2025
    Publication date: June 19, 2025
    Inventors: Minsu Choi, Myeong-Dong Lee, Hyeon-Woo Jang, Keunnam Kim, Sooho Shin, Yoosang Hwang
  • Publication number: 20250191563
    Abstract: The present disclosure relates to a liquid oxygen vent silencer implemented so as to eliminate potentially explosive elements, and the liquid oxygen vent silencer is manufactured using copper plates and stainless (SUS) having no risk of explosions to minimize an edge that collide with oxygen gas, and includes a silencer body that receives cryogenic liquid gas and moves an internal space up and down to reduce noise; and a raising/lowering support portion that is installed along an outside of the silencer body and supports the silencer body by raising or lowering the silencer body from a ground.
    Type: Application
    Filed: February 21, 2025
    Publication date: June 12, 2025
    Applicant: LET ENGINEERING CO., LTD.
    Inventors: Ju Sik LEE, Hyung Dong LEE, Sun Byeul JO, Won Myeong SEO, Tae Kyu KIM, Dong Guen LEE
  • Publication number: 20250191564
    Abstract: The present disclosure relates to a liquid oxygen vent silencer used in an oxygen production process implemented so as to eliminate potentially explosive elements, and the vent silencer is manufactured using copper plates and stainless (SUS) having no risk of explosions to minimize an edge that collide with oxygen gas, and includes a silencer body that receives cryogenic liquid gas and moves an internal space up and down to reduce noise; and a body support that is installed along an outside of the silencer body and supports the silencer body by raising or lowering the silencer body from a ground.
    Type: Application
    Filed: February 21, 2025
    Publication date: June 12, 2025
    Applicant: LET ENGINEERING CO., LTD.
    Inventors: Ju Sik LEE, Hyung Dong LEE, Sun Byeul JO, Won Myeong SEO, Tae Kyu KIM, Dong Guen LEE
  • Publication number: 20250192425
    Abstract: A multi-channel beamforming chip-antenna package is provided. The multi-channel beamforming chip-antenna package includes a multi-channel beamforming chip including a plurality of channels, a plurality of waveguides, and a plurality of coupling circuits configured to combine the plurality of channels with the plurality of waveguides, wherein each of the plurality of coupling circuits may include a matching circuit configured to combine a wire bonded to each of the plurality of channels and a microstrip line and a converting circuit configured to combine the microstrip line and the plurality of waveguides.
    Type: Application
    Filed: June 26, 2024
    Publication date: June 12, 2025
    Inventors: Bong Hyuk PARK, Sunwoo KONG, SEUNG HUN WANG, HUI DONG LEE, Seunghyun JANG, Jung Hwan HWANG
  • Publication number: 20250192430
    Abstract: Proposed are an apparatus and a method for a high frequency phase shifter. The apparatus of the phase shifter configured for a beamforming system includes a first path switch controlling an activation and a deactivation of a first path, a first path resonator having an impedance capable of realizing a parallel resonance with an impedance seen at both ends of the first path switch when the first path switch is in a control mode for the deactivation, a first inductor rendering an impedance seen from a connected terminal to exhibit an inductive characteristic, a second inductor rendering an impedance seen from a connected terminal to exhibit an inductive characteristic, and a path-based impedance converter converting an impedance thereof into an impedance generating a phase delay or into an impedance such that an impedance as large as possible is seen at both terminals of a second path.
    Type: Application
    Filed: December 10, 2024
    Publication date: June 12, 2025
    Inventors: Seunghyun JANG, Sunwoo Kong, Bong Hyuk Park, Seung Hun Wang, Hui Dong Lee, Jung Hwan Hwang
  • Patent number: 12323893
    Abstract: A first user equipment (UE) receives, from a second UE, a precursory minimum set of data (MSD) via a first block. The 5 first UE starts a timer upon receiving the precursory MSD from the second UE, and waits to receive a report via a second block while the timer is running. The first UE makes a third block based on whether or not the report via the second block has been received, and transmits, to a network, the third block.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: June 3, 2025
    Assignee: LG ELECTRONICS INC.
    Inventor: Ki-Dong Lee
  • Publication number: 20250174812
    Abstract: A battery module includes a cell assembly including a plurality of battery cells, each battery cell including a body portion, a flange portion, and an electrode lead exposed in a first direction to the outside of the flange portion, a busbar coupled to the electrode lead, and a support plate disposed between the battery cell and the busbar and including a through-hole through which the electrode lead passes in the first direction, wherein the flange portion includes a sealing region, the through-portion includes a first region disposed closer to the busbar than the body portion and a second region disposed closer to the body portion than the busbar, and the first region is configured to cover 60% or more of a sealing length, which is a length of the sealing region, based on the first direction.
    Type: Application
    Filed: November 12, 2024
    Publication date: May 29, 2025
    Inventors: Seo Roh RHEE, Seung Dong LEE, Dong Jin KIM, Hyun Kyu LEE
  • Patent number: 12313474
    Abstract: Provided are a semiconductor-based temperature sensor and a method of operating the semiconductor-based temperature sensor. A temperature sensor includes an electrical temperature signal generator configured to generate a first electrical temperature signal that changes according to temperature and a second electrical temperature signal that changes according to temperature at a different rate from that of the first electrical temperature signal, a differential signal generator configured to generate a differential electrical temperature signal between the first electrical temperature signal and the second electrical temperature signal, and an analog digital converter (ADC) configured to convert the differential electrical temperature signal into digital temperature information.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: May 27, 2025
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Seunghyun Jang, Sunwoo Kong, Bong Hyuk Park, Hui Dong Lee, Seok Bong Hyun