Abstract: A structure of heat dissipating fins that can be assembled with increased efficiency without the use of adhesive agents such as soldering tin, and so on, while ensuring a tight fit on cooling ducts. More than one through hole defined in each of the heat dissipating fins that provide for cooling ducts to insert therein. A staircase-like member extends backward from each of the through holes to form a catch groove, and a catch end further extends backward from each of the catch grooves. When the heat dissipating fins are being successively disposed onto the cooling ducts through the through holes, the catch ends are respectively disposed into the catch grooves of the heat dissipating fin positioned therebehind, thereby producing a tight clamping effect on the cooling ducts, further causing an immobile mutual fastening between the heat dissipating fins without the use of soldering tin.

Abstract: The present invention relates to a radiator sheet improvement and more particularly to a structure with enhanced strength and increased heat exchange surface after assembling, which is achieved first by forming large holes and adjacent small holes on each radiator sheet, wherein a radiator tube passing through each large hole and a solder rod or tin solder inserted into each small hole, and then by using heat to melt solder to fill the space between the radiator sheet and the radiator tube, thereby enabling a firm bonding effect therebetween.

Abstract: The present invention relates to a radiator sheet improvement and more particularly to a structure with enhanced strength and increased heat exchange surface after assembling, which is achieved first by forming large holes and adjacent small holes on each radiator sheet, wherein a radiator tube passing through each large hole and a solder rod or tin solder inserted into each small hole, and then by using heat to melt solder to fill the space between the radiator sheet and the radiator tube, thereby enabling a firm bonding effect therebetween.

Abstract: A radiator with seamless heat conductor at least consists of two heat sink modules and a heat conductor. The two heat sink modules can be jointed with each other. At jointing edges of the heat sink modules, arc slots are provided corresponding to the heat conductor thereby forming penetrating holes after jointing the two heat sink module altogether. The heat conductor is made in one unity and is seamless provided with multiple directions. When assembling, the heat conductor is placed into the arc slot on one of the heat sink module before installing the other heat sink module thereby fixedly jointing the two heat sink modules with the heat conductor clipped therein, achieving the objective in making radiator with seamless heat conductor.

Abstract: A radiator with seamless heat conductor at least consists of two heat sink modules and a heat conductor. The two heat sink modules can be jointed with each other. At jointing edges of the heat sink modules, arc slots are provided corresponding to the heat conductor thereby forming penetrating holes after jointing the two heat sink module altogether. The heat conductor is made in one unity and is seamless provided with multiple directions. When assembling, the heat conductor is placed into the arc slot on one of the heat sink module before installing the other heat sink module thereby fixedly jointing the two heat sink modules with the heat conductor clipped therein, achieving the objective in making radiator with seamless heat conductor.