Abstract: The present disclosure relates to a method of treating a disease or disorder associated with an abnormality in CNS function. Also provided is a method for diagnosing and/or identifying a subject having an abnormality in CNS function. FAM19A1 antagonists that can be used with the present disclosures are also provided.

Abstract: The present disclosure provides antibodies that specifically bind to human FAM19A5 and compositions comprising such antibodies. Also provided herein are methods for treating fibrosis or cancer using the anti-FAM19A5 antibodies.

Abstract: The present disclosure relates to the pharmaceutical use of antagonists (e.g., an antibody or antigen-binding portion thereof) that specifically bind to FAM19A5 to promote a blood vessel normalization and treat a disease (e.g., cancer) in a subject in need thereof, e.g., by promoting a blood vessel normalization.

Abstract: The present disclosure relates to an inverter mounting structure having improved ease of assembly and durability, and capable of simplifying the structure of an inverter. According to one aspect of the present invention, provided is an inverter mounting structure comprising: a bracket fixed to an enclosure or a wall surface and forming an inverter accommodation space in which the inverter is accommodated and coupled; and an option case coupled to the outside of the bracket.

Abstract: A steric epitope of CEACAM1 is disclosed. An anti-CEACAM1 antibody or a fragment thereof, which specifically binds to CEACAM1 is disclosed. A steric epitope of CEACAM1 includes all amino acids in critical positions for specific binding to an anti-CEACAM1 antibody and maintains an appropriate three-dimensional structure, and thus can high affinity for an anti-CEACAM1 antibody. In addition, an antibody, or a fragment thereof, that specifically binds to a steric epitope can effectively suppress CEACAM1-CEACAM1 interaction and CEACAM1-CEACAM6 interaction.

Abstract: The present invention relates to a novel antibody library and an antibody-screening method using same. Having a human sequence-derived specific VH or VL scaffold, the antibody library according to the present invention exhibits high thermodynamic stability and enjoys the advantages of allowing high soluble expression as well as reversible folding. In addition, the antibody according to the present invention includes a variety of rationally controlled CDRs so as to exhibit high specificity and high affinity to all antigens and thus can be advantageously used for selecting an adequate candidate antibody against a target antigen.

Abstract: The present invention relates to an anti-MSLN antibody and a pharmaceutical composition for cancer treatment comprising same. The anti-MSLN antibody according to the present invention has high affinity and specificity for MSLN and thus can be effectively used in cancer prevention or treatment.

Abstract: A thermoelectric module that has excellent thermal, electric properties, can realize high joining force between thermoelectric elements and an electrode, and can maintain stable joining even at a high temperature.

Abstract: The present disclosure provides antibodies that specifically bind to human FAM19A5 and compositions comprising such antibodies. In some embodiments, antibodies are de-immunized to reduce immunogenicity in a human subject. In certain embodiments, antibodies have undergone affinity maturation. In some embodiments, the anti-FAM19A5 antibodies can modulate FAM19A5 activity, e.g, inhibit, suppress, reduce, or reverse the onset of reactive gliosis and/or excessive proliferation of reactive astrocytes, utilizing such antibodies. The present disclosure also provides methods for treating disorders, such as central nervous system damage, a degenerative brain disorder, a neuropathic pain, or a cancer, by administering an antibody that specifically binds to human FAM19A5.

Abstract: A thermoelectric module including at least a first and a second thermoelectric element comprising a thermoelectric semiconductor; an electrode connecting the first and second thermoelectric elements; and at least a first and a second joining layer, the first joining layer positioned between the first thermoelectric element and the electrode, and the second joining layer positioned between the second thermoelectric element and the electrode; and at least a first and a second barrier layer including an alloy including Cu, Mo and Ti, the first barrier layer positioned between the first thermoelectric element and the first joining layer, and the second barrier layer positioned between the second thermoelectric element and the second joining layer.

Abstract: The present disclosure relates to the pharmaceutical use of antagonists (e.g., an antibody or antigen-binding portion thereof) that specifically bind to FAM19A5 to treat or to diagnose a fibrosis and/or a fibrosis-associated disease in a subject in need thereof.

Abstract: The present disclosure relates to the pharmaceutical use of antagonists (e.g., an antibody or antigen-binding portion thereof) that specifically bind to FAM19A5 to treat an atherosclerosis in a subject in need thereof.

Abstract: The present disclosure provides adeno-associated vims (AAV) vectors and uses thereof. In certain embodiments, the AAV vectors comprise a nucleic acid that encodes an antagonist against a family with sequence similarity 19, member A5 (FAM19A5) protein, e.g., anti-FAM19A5 antibody, e.g., anti-FAM19A5 scFv.

Abstract: The present disclosure relates to the pharmaceutical use of antagonists (e.g., an antibody or antigen-binding portion thereof) that specifically bind to FAM19A5 to treat a retinopathy (e.g., diabetic retinopathy) and/or maculopathy (e.g., age-related macular degeneration) in a subject in need thereof.

Abstract: The present disclosure relates to the pharmaceutical use of antagonists (e.g., an antibody or antigen-binding portion thereof) that specifically bind to FAM19A5 to treat or to diagnose a fibrosis and/or a fibrosis-associated disease in a subject in need thereof.

Abstract: A thermoelectric module that has excellent thermal, electric properties, can realize high joining force between thermoelectric elements and an electrode, and can maintain stable joining even at a high temperature.

Abstract: Disclosed herein is a patterning formation method including printing on a film base, a manufacturing method of an electrical device using the same, and a vehicular electrical device. More particularly, disclosed herein is a patterning formation method including arranging a poly cyclohexylene dimethylene terephthalate (PCT) film as a base film or as an upper part film such as a coverlay film, and patterning a material such as a metal by a printing method or connecting printing electronic technologies on at least a part of the PCT film. Also disclosed herein is a manufacturing method of an electrical device using the same and a vehicular electrical device.

Abstract: The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.

Abstract: The present invention provides an FFC using a PCT film as an insulating coating layer. The FFC comprises a lower insulating coating layer made of the PCT film; a lower adhesive layer made of polyester formed through a lower primer layer made of polyurethane material on the upper surface of the lower insulating coating layer; an upper insulating coating layer made of the PCT film; an upper adhesive layer made of polyester formed through an upper primer layer made of polyurethane material on a lower surface of the upper insulating coating layer; and a conductor wire layer interposed between the lower adhesive layer and the upper adhesive layer.

Abstract: A first embodiment of the present invention provides a flexible printed circuit board (FPCB) comprising a hot melt adhesive layer and a metal foil layer sequentially stacked on an insulating layer made of a PCT film; a flexible copper clad laminate (FCCL) having a circuit pattern on the metal foil layer; a coverlay adhered to the hot melt adhesive layer formed on the insulating layer made of the PCT film while covering the metal foil layer and also provides a method of manufacturing the FPCB. A second embodiment of the present invention provides an FPCB having a pressure-sensitive adhesive layer instead of the hot-melt adhesive layer, and a method for manufacturing the FPCB having the same, and the third embodiment of the present invention provides an FPCB having a UV cured layer instead of a hot melt adhesive layer, and a method for manufacturing the FPCB having the same.