Patents by Inventor Dong Su

Dong Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200349986
    Abstract: A non-volatile memory device includes a serial pipeline structure connected to an output stage of a First In, First Out (FIFO) memory. The FIFO memory is configured to store data transmitted through a data path having a wave pipeline structure based on a plurality of FIFO input clock signals and output the stored data based on a plurality of FIFO output clock signals. A serializer is configured to output data to an input/output pad based on a select clock signal. The serial pipeline structure is connected between the FIFO memory and the serializer and configured to compensate for a phase difference between the data output from the FIFO memory and the select clock signal.
    Type: Application
    Filed: July 20, 2020
    Publication date: November 5, 2020
    Inventors: Dong-Su Jang, Man-Jae Yang, Jeong-Don Ihm, Go-Eun Jung, Byung-Hoon Jeong, Young-Don Choi
  • Patent number: 10826436
    Abstract: A power supply modulator includes: a linear regulator; a switching regulator; and a mode-based connection circuit. The mode-based connection circuit includes a coupling circuit configured to drop an output signal of the linear regulator by a target coupling voltage in an envelope tracking (ET) modulation mode; and a coupling voltage management circuit configured to monitor a coupling voltage of the coupling circuit in another modulation mode, and selectively apply a voltage to the coupling voltage based on a monitoring result such that the coupling voltage is maintained at the target coupling voltage.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: November 3, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-su Kim, Jun-suk Bang
  • Patent number: 10817027
    Abstract: A window includes a window that includes a first hole, a second hole, and a third hole between the first and second holes, a front protection film disposed on a front surface of the window that covers the first, second, and third holes, a first protection film disposed on a rear surface of the window that covers the first hole, a second protection film disposed on the rear surface of the window that covers the second hole, a cover disposed on the rear surface of the window and inserted into the third hole, the cover including a plurality of holes, and a cap disposed on the rear surface of the window and on the first and second protection films and the cover.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: October 27, 2020
    Assignee: SAMSUNG DISILAY CO., LTD.
    Inventors: Dong-Su Yee, Minhyuk Im, Myungan Min, Sujin Jung
  • Publication number: 20200335505
    Abstract: A method for fabricating a semiconductor device includes: forming a mold stack pattern including a plurality of openings in an upper portion of a substrate and including a mold layer and a supporter layer which are stacked; forming a bottom electrode layer filling the plurality of the openings and covering the supporter layer; forming a filler portion disposed inside the plurality of the openings, a barrier portion extended upwardly from the filler portion, and an electrode cutting portion exposing a surface of the supporter layer by selectively etching the bottom electrode layer; forming a supporter by using the barrier portion as an etch barrier and etching the supporter layer exposed by the electrode cutting portion; selectively removing the barrier portion to form a hybrid pillar-type bottom electrode disposed inside the plurality of the openings; and removing the mold layer.
    Type: Application
    Filed: July 1, 2020
    Publication date: October 22, 2020
    Inventors: Jeong-Yeop LEE, Dong-Su PARK, Jong-Bum PARK, Sang-Do LEE, Jae-Min LEE, Kee-Jeung LEE, Jun-Soo JANG
  • Publication number: 20200335975
    Abstract: A method of controlling output levels of an MMC converter to reduce fluctuation in a power grid frequency, which adjusts an output level of the MMC converter in response to a change in a power grid frequency of a power grid system in the MMC converter connected to a grid system, is proposed. The method includes a detection step of detecting a power grid frequency of a grid connected to the MMC converter in real time, a comparison step of comparing the detected power grid frequency with a preset reference power grid frequency, and an adjustment step of adjusting a number of output levels of the MMC converter to reduce a difference between the detected power grid frequency and the reference power grid frequency when the detected power grid frequency and the reference power grid frequency are different from each other.
    Type: Application
    Filed: December 21, 2018
    Publication date: October 22, 2020
    Inventors: Hee Jin KIM, Dong Su LEE, Kyeon HUR, Jae Sik KANG, Sang Min KIM
  • Patent number: 10811077
    Abstract: A memory device a plurality of memory banks, a hammer address manager, and a refresh controller. The hammer address manager manages access addresses with respect to the plurality of memory banks and provides a hammer address for a hammer refresh operation among the access addresses, the hammer address being the access address that is accessed more than other access addresses. The refresh controller generates a hammer refresh address signal based on the hammer address, the hammer refresh address signal corresponding to a row that is physically adjacent to a row corresponding to the hammer address such that the row physically adjacent to the row corresponding to the hammer address is refreshed by the hammer refresh operation.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: October 20, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hoon Shin, Do-Yeon Kim, Ho-Young Song, Dong-Su Lee
  • Patent number: 10799719
    Abstract: The present invention relates to a thermoplastic mask monitoring system using a pressure sensor. Specifically, a thermoplastic mask according to the present invention may include: a mask having a shape determined according to a shape of a first region which is at least a part of a patient's body by using thermoplasticity, fixing the first region in close contact with the first region, and receiving radiation; and a pressure sensor provided between the mask and the first region and sensing pressure induced by a space generated between the mask and the first region.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: October 13, 2020
    Assignee: The Catholic University of Korea Industry-Academic Cooperation Foundation
    Inventors: Min-Seok Cho, Tae-Ho Kim, Seong-Hee Kang, Dong-Su Kim, Kyeong-Hyeon Kim, Dong-Seok Shin, Si Yong Kim, Tae Suk Suh
  • Publication number: 20200321917
    Abstract: A symbol power tracking amplification system including: a modem to generate data and symbol tracking signals; a symbol tracking modulator including a control circuit, first and second voltage supply circuits and a switch circuit, the control circuit generates first and second voltage level control signals in response to the symbol tracking signal, the first voltage supply circuit generates a first output voltage in response to the first voltage level control signal, the second voltage supply circuit generates a second output voltage in response to the second voltage level control signal and the switch circuit outputs the first or second output voltages as a supply voltage in response to a switch control signal; an RF block to generate an RF signal based on the data signal from the modem; and a power amplifier to adjust a power level of the RF signal based on the supply voltage.
    Type: Application
    Filed: May 28, 2020
    Publication date: October 8, 2020
    Inventors: Takahiro Nomiyama, Ji-seon Paek, Dong-su Kim
  • Publication number: 20200310166
    Abstract: A display device includes a display panel including: a display area at which an image is displayed and a bezel area which is adjacent to the display area, and a pixel including a pixel circuit and a light emitting layer, the pixel circuit defining a stacked structure; a window; and a pattern film between the display panel and the window, the pattern film including: a first film including a first area and a second area which respectively correspond to the display area and the bezel area of the display panel, and a pattern layer on the second film in the second area thereof. The pattern layer of the pattern film includes a same stacked structure as the stacked structure defined by the pixel circuit of the display panel.
    Type: Application
    Filed: January 30, 2020
    Publication date: October 1, 2020
    Inventor: Dong-su YEE
  • Publication number: 20200296516
    Abstract: A sound vibration actuator includes: a casing having an internal space, a coil part coupled to the casing to receive power, a magnet part disposed in the casing, an elastic member whose one surface coupled to the magnet part, a substrate drawn from the internal space, and an external device-coupling part disposed on an outer peripheral surface of the casing to be coupled to an external device, wherein the casing has an underside casing part, a side periphery casing part, and a top casing part, the coil part is coupled to the top casing part, and the external device-coupling part includes a first coupling area coming into contact with a portion of the outer periphery of the side periphery casing part and second coupling areas extended from the first coupling area in a vertical direction to the first coupling area coupled to the external device.
    Type: Application
    Filed: December 5, 2019
    Publication date: September 17, 2020
    Inventors: Yong Jin KIM, Jun Kun CHOI, Yeon Ho SON, Yong Tae KIM, Dong Su MOON, Seok Jun PARK, Tae Hoon LEE
  • Publication number: 20200295647
    Abstract: A sound vibration actuator includes: a casing having an internal space formed by an underside casing part, a side periphery casing part, and a top casing part; a first vibration assembly disposed in the internal space of the casing; a second vibration assembly disposed between the first vibration assembly and the top casing part in such a manner as to be coupled to the top casing part; an elastic member whose one surface coupled to the first vibration assembly; and a third vibration assembly disposed between the first vibration assembly and the underside casing part in such a manner as to be coupled to the underside casing part. The sound vibration actuator includes at least three or more vibration assemblies disposed therein, thereby obtaining at least three or more resonance frequencies.
    Type: Application
    Filed: December 5, 2019
    Publication date: September 17, 2020
    Inventors: Jun Kun CHOI, Yong Jin KIM, Yeon Ho SON, Yong Tae KIM, Dong Su MOON, Seok Jun PARK, Tae Hoon LEE
  • Patent number: 10759412
    Abstract: A method for identifying a driving pattern for fuel economy improvement of a hybrid vehicle is provided. The method includes allocating priorities in accordance with influences exerted on fuel economy based on a heating load and an electric load. A current driving pattern is then selected in the order of a high heating load driving pattern, a high electric load driving pattern, an aggressive driving pattern, a high speed driving pattern, and a city driving pattern.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: September 1, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Jae-Yun Shim, Il-Kwon Park, In-Eok Cho, Hoon Han, Jae-Mun Lee, Dong-Su Ha, Dong-Jun Shin, Kyung-Taek Lee
  • Patent number: 10759375
    Abstract: Disclosed herein may be a side airbag apparatus and a method of manufacturing the same. The side airbag apparatus may include: an outboard sheet part disposed on a side portion of a vehicle body; an inboard sheet part laminated to an interior side of the outboard sheet part and formed such that a first peripheral part located on an opposite side of a gas injecting part is longer than a second peripheral part located adjacent to the gas injecting part; a push chamber formed such that a folding length of the first peripheral part is longer than that of the second peripheral part; a folding seam part seaming a folded part of the first peripheral part; and a peripheral seam part seaming a peripheral part of the outboard sheet part, a peripheral part of the inboard sheet part, and the first peripheral part of the push chamber all together.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: September 1, 2020
    Assignee: HYUNDAI MOBIS CO., LTD.
    Inventor: Dong Su Suk
  • Publication number: 20200274395
    Abstract: Provided is a wireless power receiving unit with a self-regulation rectifier. In one embodiment, the wireless power receiving unit includes a resonator configured to receive wireless power; and a self-regulation rectifier unit including a rectifier configured to apply a rectifier output voltage to a load by converting alternating-current (AC) power received from the resonator into direct-current (DC) power, and a switching device located at a rear end of the rectifier and configured to self-regulate the rectifier output voltage.
    Type: Application
    Filed: April 7, 2017
    Publication date: August 27, 2020
    Applicant: Maps, Inc.
    Inventors: Jong Tae HWANG, Hyun Ick SHIN, Sung Min PARK, Min Jung KO, Dong Su LEE, Jong Hoon LEE, Ki Woong JIN, Joon RHEE
  • Publication number: 20200274397
    Abstract: Provided is a wireless power transmitting unit capable of auto-tuning according to impedance change. The wireless power transmitting unit according to an embodiment can stabilize the operation of the amplifier by changing the resonance frequency of the resonator without measuring the phase information about the resonator.
    Type: Application
    Filed: June 12, 2017
    Publication date: August 27, 2020
    Applicant: MAPS, INC.
    Inventors: Jong Tae HWANG, Ik Soo JEON, Dong Su LEE, Hyun Ick SHIN, Joon RHEE
  • Publication number: 20200267874
    Abstract: A heat radiation sheet includes: a film layer; a heat radiation layer on the film layer and having a first area, a second area, and a third area and a plurality of openings therein; and a first adhesive layer on the heat radiation layer. The openings include a plurality of first openings in the first area, a plurality of second openings in the second area, and a plurality of third openings in the third area, and an average distance between adjacent ones of the first openings is smaller than an average distance between adjacent ones of the third openings.
    Type: Application
    Filed: January 15, 2020
    Publication date: August 20, 2020
    Inventor: Dong Su YEE
  • Publication number: 20200259457
    Abstract: A power supply modulator includes: a linear regulator; a switching regulator; and a mode-based connection circuit. The mode-based connection circuit includes a coupling circuit configured to drop an output signal of the linear regulator by a target coupling voltage in an envelope tracking (ET) modulation mode; and a coupling voltage management circuit configured to monitor a coupling voltage of the coupling circuit in another modulation mode, and selectively apply a voltage to the coupling voltage based on a monitoring result such that the coupling voltage is maintained at the target coupling voltage.
    Type: Application
    Filed: May 1, 2020
    Publication date: August 13, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-su Kim, Jun-suk Bang
  • Publication number: 20200260190
    Abstract: A sound vibration actuator includes a casing having an internal space formed by an underside casing part, a side periphery casing part, and a top casing part, a coil part coupled to the top casing part in such a manner as to receive power from the outside, a magnet part disposed in the internal space of the casing, an elastic member whose one surface coupled to the magnet part, and a weight part coupled to the top casing part. The sound vibration actuator is configured to allow the weight part to be coupled to the part for generating vibrations, thereby controlling vibrations in a high frequency resonance band.
    Type: Application
    Filed: December 10, 2019
    Publication date: August 13, 2020
    Inventors: Seok Jun PARK, Jun Kun CHOI, Yeon Ho SON, Yong Tae KIM, Yong Jin KIM, Seung Wook KIM, Dong Su MOON
  • Patent number: 10741225
    Abstract: A non-volatile memory device includes a serial pipeline structure connected to an output stage of a First In, First Out (FIFO) memory. The FIFO memory is configured to store data transmitted through a data path having a wave pipeline structure based on a plurality of FIFO input clock signals and output the stored data based on a plurality of FIFO output clock signals. A serializer is configured to output data to an input/output pad based on a select clock signal. The serial pipeline structure is connected between the FIFO memory and the serializer and configured to compensate for a phase difference between the data output from the FIFO memory and the select clock signal.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: August 11, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-Su Jang, Man-Jae Yang, Jeong-Don Ihm, Go-Eun Jung, Byung-Hoon Jeong, Young-Don Choi
  • Patent number: 10734389
    Abstract: A method for fabricating a semiconductor device includes: forming a mold stack pattern including a plurality of openings in an upper portion of a substrate and including a mold layer and a supporter layer which are stacked; forming a bottom electrode layer filling the plurality of the openings and covering the supporter layer; forming a filler portion disposed inside the plurality of the openings, a barrier portion extended upwardly from the filler portion, and an electrode cutting portion exposing a surface of the supporter layer by selectively etching the bottom electrode layer; forming a supporter by using the barrier portion as an etch barrier and etching the supporter layer exposed by the electrode cutting portion; selectively removing the barrier portion to form a hybrid pillar-type bottom electrode disposed inside the plurality of the openings; and removing the mold layer.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: August 4, 2020
    Assignee: SK hynix Inc.
    Inventors: Jeong-Yeop Lee, Dong-Su Park, Jong-Bum Park, Sang-Do Lee, Jae-Min Lee, Kee-Jeung Lee, Jun-Soo Jang