Patents by Inventor Dong Suk Jun
Dong Suk Jun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9631981Abstract: Provided is an apparatus for measuring a thermoelectric device. The apparatus includes a high temperature heater controlling a temperature of a first side of a sample, a low temperature heater controlling a temperature of a second side of the sample, a fine control heater controlling the temperature of the first side of the sample by a smaller unit than the high temperature heater, a temperature control and voltage measuring unit controlling the high temperature heater, the low temperature heater, and the fine control heater and measuring voltages of the first and second sides of the sample, and a thermal conductivity measuring unit measuring thermal conductivity of the sample by using a high temperature output voltage generated in the first side of the sample and a low temperature output voltage generated in the second side of the sample.Type: GrantFiled: July 14, 2014Date of Patent: April 25, 2017Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Dong Suk Jun, Moon Gyu Jang, Won Chul Choi
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Patent number: 9437795Abstract: Provided are a thermoelectric device and a method of manufacturing the same. The method may include forming nanowires on a substrate, forming a barrier layer on the nanowires, forming a bulk layer on the barrier layer, forming a lower electrode under the substrate, and forming an upper electrode on the bulk layer.Type: GrantFiled: June 5, 2015Date of Patent: September 6, 2016Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Dong Suk Jun, Moon Gyu Jang, Won Chul Choi
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Patent number: 9276403Abstract: Disclosed are a solar cell having a fan structure that provides a more pleasant life, convenience, and stability by forming, in a fan structure, a flexible color solar cell applied with a carbon dioxide absorption material, and configuring the formed flexible color solar cell through convergence of information technology, and an electronic application apparatus using the same. The electronic application apparatus using a solar cell as a power source includes: an application device body portion including a both side supporter fixed to ground, a transmitter including an antenna capable of transmitting power and data, and a data screen to thereby provide a predetermined service; and the solar cell provided in an upper end of the application device body portion, to color using a predetermined wavelength of light, and to perform solar power generation using a remaining wavelength of light.Type: GrantFiled: March 7, 2013Date of Patent: March 1, 2016Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Dong Suk Jun, In-Kyu You, Je Ha Kim
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Publication number: 20150283743Abstract: Provided is a method of fabricating a mold, the method including: forming a first preliminary layer and a second preliminary layer, which are spaced apart from each other and stacked on a substrate; forming a first pattern by patterning the first preliminary layer; forming a first spacer on both sidewalls of the first pattern; forming a second pattern by etching the second preliminary layer by using the first spacer as an etching mask; forming a multilayer structure including the first pattern and the second pattern on the substrate by removing the first spacer; and forming a mold layer covering the multilayer structure.Type: ApplicationFiled: October 17, 2014Publication date: October 8, 2015Inventors: Jong-Moon PARK, Kunsik PARK, Dong Suk JUN, Seong Wook YOO, Sang Gi KIM, Jin Ho LEE
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Publication number: 20150270464Abstract: Provided are a thermoelectric device and a method of manufacturing the same. The method may include forming nanowires on a substrate, forming a barrier layer on the nanowires, forming a bulk layer on the barrier layer, forming a lower electrode under the substrate, and forming an upper electrode on the bulk layer.Type: ApplicationFiled: June 5, 2015Publication date: September 24, 2015Applicant: Electronics and Telecommunications Research InstituteInventors: Dong Suk JUN, Moon Gyu JANG, Won Chul CHOI
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Patent number: 9082895Abstract: Provided are a thermoelectric device and a method of manufacturing the same. The method may include forming nanowires on a substrate, forming a barrier layer on the nanowires, forming a bulk layer on the barrier layer, forming a lower electrode under the substrate, and forming an upper electrode on the bulk layer.Type: GrantFiled: July 11, 2014Date of Patent: July 14, 2015Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Dong Suk Jun, Moon Gyu Jang, Won Chul Choi
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Publication number: 20150129010Abstract: Provided is a thermoelectric device. The thermoelectric device includes a substrate; first and second electrodes disposed at one side of the substrate, wherein the first and second electrodes are apart from each other; a common electrode formed on the other side of the substrate, wherein the common electrode is separated from the first and second electrodes; first and second legs connecting the common electrode to the first electrode, and the common electrode to the second electrode, respectively; and first and second barrier patterns covering the first and second legs and the substrate between the common electrode and the first electrode and between the common electrode and the second electrode, wherein the first and second barrier patterns prevents the short between the first and second legs and the common electrode and between the first and second legs and the first and second electrodes.Type: ApplicationFiled: May 29, 2014Publication date: May 14, 2015Applicant: Electronics and Telecommunications Research InstituteInventors: Dong Suk JUN, Moon Gyu JANG, Soojung KIM
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Publication number: 20150130012Abstract: Provided are a thermoelectric device and a method of manufacturing the same. The method may include forming nanowires on a substrate, forming a barrier layer on the nanowires, forming a bulk layer on the barrier layer, forming a lower electrode under the substrate, and forming an upper electrode on the bulk layer.Type: ApplicationFiled: July 11, 2014Publication date: May 14, 2015Applicant: Electronics and Telecommunications Research InstituteInventors: Dong Suk JUN, Moon Gyu JANG, Won Chul CHOI
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Publication number: 20150130472Abstract: Provided are a thermoelectric conductivity measurement instrument of a thermoelectric device and a measuring method of the same. The thermoelectric conductivity measurement instrument of the thermoelectric device includes a sample piece fixing module configured to provide an environment for measuring physical properties of the thermoelectric device as a sample piece and comprising an electrode part configured to provide contact points which are respectively in contact with both ends of the sample piece, and a measuring circuit module configured to provide a source AC voltage of a first frequency heating the sample piece to the electrode part, detect a first thermoelectric AC voltage of a second frequency greater than the first frequency and a second thermoelectric AC voltage of a third frequency greater than the second frequency, which are generated by a temperature change occurring at the contact points, and then obtain the thermoelectric conductivity.Type: ApplicationFiled: April 22, 2014Publication date: May 14, 2015Applicant: Electronics and Telecommunications Research InstituteInventors: Dong Suk JUN, Moon Gyu JANG, Won Chul CHOI
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Publication number: 20150092812Abstract: Provided is an apparatus for measuring a thermoelectric device. The apparatus includes a high temperature heater controlling a temperature of a first side of a sample, a low temperature heater controlling a temperature of a second side of the sample, a fine control heater controlling the temperature of the first side of the sample by a smaller unit than the high temperature heater, a temperature control and voltage measuring unit controlling the high temperature heater, the low temperature heater, and the fine control heater and measuring voltages of the first and second sides of the sample, and a thermal conductivity measuring unit measuring thermal conductivity of the sample by using a high temperature output voltage generated in the first side of the sample and a low temperature output voltage generated in the second side of the sample.Type: ApplicationFiled: July 14, 2014Publication date: April 2, 2015Applicant: Electronics and Telecommunications Research InstituteInventors: Dong Suk JUN, Moon Gyu JANG, Won Chul CHOI
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Patent number: 8957441Abstract: The exemplary embodiments of the present invention include forming a photoconductor thin film on a front surface of a substrate; forming a photoconductor thin film pattern by patterning the photoconductor thin film; and forming a metal electrode on the photoconductor thin film pattern.Type: GrantFiled: November 8, 2011Date of Patent: February 17, 2015Assignee: Intellectual Discovery Co., Ltd.Inventors: Dong Suk Jun, Kwang-Yong Kang, Sungil Kim, Mun Cheol Paek, Han-Cheol Ryu, Min Hwan Kwak, Seung Beom Kang
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Publication number: 20140198195Abstract: Provided is a terahertz health checker. The terahertz health checker includes a terahertz wave transmitter generating terahertz waves in a terahertz band, a lens outputting the terahertz waves and receiving terahertz waves reflected from the outputted terahertz waves, an imaging chip connected to the lens, detecting the received terahertz waves, and generating a digital image signal based on the detected terahertz waves, a readout circuit reading out the digital image signal, and a transceiver outputting the read-out digital image signal to the outside.Type: ApplicationFiled: January 16, 2014Publication date: July 17, 2014Applicant: Electronics and Telecommunications Research InstituteInventors: Dong Suk JUN, Seok-Hwan MOON, In-Kyu YOU, Jae Ick CHOI
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Patent number: 8730567Abstract: A terahertz continuous wave generator includes: an optical intensity modulator configured to modulate an optical signal into DSB optical signals; a local oscillator configured to generate a modulation signal for modulating the optical signal inputted to the optical intensity modulator into DSB optical signals; a notch filter configured to filter an optical signal with a specific frequency; an optical fiber amplifier configured to amplify an output signal of the optical intensity modulator; an optical circulator configured to transmit the optical signal inputted to the optical fiber amplifier to the notch filter and transmit the optical signal reflected from the notch filter to an input of the optical intensity modulator; an optical coupler configured to apply the optical signal to the optical intensity modulator; and an OE converter configured to photomix the DSB signals outputted through the notch filter.Type: GrantFiled: November 8, 2011Date of Patent: May 20, 2014Assignee: Electronics and Telecommunications Research InstituteInventors: Sungil Kim, Kwang-Yong Kang, Dong Suk Jun
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Publication number: 20140062786Abstract: Provided is a sensing device having a multi beam antenna array. The sensing device includes an antenna array including a plurality of antennas, a plurality of low noise amplifiers respectively connected to the antennas to amplify radio frequency signals received from the respective antennas, a delay line box including a plurality of delay lines, each delay line delaying the signals amplified by the low noise amplifiers for a predetermined time, and a detector detecting the output signals of the delay ling box.Type: ApplicationFiled: August 23, 2013Publication date: March 6, 2014Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Dong Suk JUN, Yong Sung EOM, Hyun Seo KANG, Moo Jung CHU, Soo Young OH
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Patent number: 8547278Abstract: A sensing device may include an antenna. The antenna may include a top wafer and a bottom wafer coupled to the top wafer. The antenna may further include an air cavity between the top wafer and the bottom wafer. The sensing device may further include a substrate and an interposer disposed between the antenna and the substrate.Type: GrantFiled: April 30, 2010Date of Patent: October 1, 2013Assignee: Electronics and Telecommunications Research InstituteInventors: Dong Suk Jun, Yong Sung Eom, Hyun Seo Kang, Moo Jung Chu, Soo Young Oh
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Publication number: 20120166144Abstract: A device characteristics measurement method using an all-optoelectronic terahertz photomixing system includes: calculating power of an antenna of a transmitter by adding a matching condition between output impedance of the photomixer and input impedance of the antenna of the transmitter to power of the photomixer of the transmitter; calculating power of an antenna of a receiver based on the power of the antenna of the transmitter; and outputting the power of the antenna of the transmitter and the power of the antenna of the receiver so as to analyze device characteristics of the photomixer and the antenna of the transmitter.Type: ApplicationFiled: October 21, 2011Publication date: June 28, 2012Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Han-Cheol Ryu, Min Hwan Kwak, Seung beom Kang, Sungil Kim, Dong Suk Jun, Mun Cheol Paek, Kwang Yong Kang
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Publication number: 20120162747Abstract: A terahertz continuous wave generator includes: an optical intensity modulator configured to modulate an optical signal into DSB optical signals; a local oscillator configured to generate a modulation signal for modulating the optical signal inputted to the optical intensity modulator into DSB optical signals; a notch filter configured to filter an optical signal with a specific frequency; an optical fiber amplifier configured to amplify an output signal of the optical intensity modulator; an optical circulator configured to transmit the optical signal inputted to the optical fiber amplifier to the notch filter and transmit the optical signal reflected from the notch filter to an input of the optical intensity modulator; an optical coupler configured to apply the optical signal to the optical intensity modulator; and an OE converter configured to photomix the DSB signals outputted through the notch filter.Type: ApplicationFiled: November 8, 2011Publication date: June 28, 2012Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Sungil KIM, Kwang-Yong KANG, Dong Suk JUN
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Publication number: 20120112230Abstract: The exemplary embodiments of the present invention include forming a photoconductor thin film on a front surface of a substrate; forming a photoconductor thin film pattern by patterning the photoconductor thin film; and forming a metal electrode on the photoconductor thin film pattern.Type: ApplicationFiled: November 8, 2011Publication date: May 10, 2012Applicant: Electronics and Telecommunications Research InstituteInventors: Dong Suk JUN, Kwang-Yong KANG, Sungil KIM, Mun Cheol PAEK, Han-Cheol RYU, Min Hwan KWAK, Seung beom KANG
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Publication number: 20110115036Abstract: Provided is a method for fabricating a device package. The method includes: preparing a substrate where respectively corresponding device structures and input and output pads are disposed on an active surface; preparing a carrier substrate where a metal lid corresponding to the device structure is disposed on one surface; and contacting the active surface of the substrate with the metal lid of the carrier substrate to cover and seal the device structure corresponding to the metal lid.Type: ApplicationFiled: April 27, 2010Publication date: May 19, 2011Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Jong Tae MOON, Jong-Hyun Lee, Dong Suk Jun, Hyun-cheol Bae, Sunghae Jung, Moo Jung Chu
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Publication number: 20110090651Abstract: Provided is a package structure. The package structure includes a first substrate, a first device, a second substrate, a first via contact, and at least one second device. The first device is formed on the first substrate. The second substrate has an air gap over the first substrate and covers the first device. The first via contact is connected to the first device through the second substrate. At least one second device is electrically connected to the first via contact, and is stacked on the second substrate.Type: ApplicationFiled: April 22, 2010Publication date: April 21, 2011Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Sunghae Jung, Dong Suk Jun, Jong Tae Moon, Hyun-cheol Bae, Moo Jung Chu