Patents by Inventor Dong Tang
Dong Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250116287Abstract: The disclosure relates to a connector and furniture using connector. The disclosure includes a primary member and an auxiliary member that are separated and detachable. The primary member is provided with a primary junction having a limiting groove, and the auxiliary member is provided with an auxiliary junction having a limiting block. When the primary junction and the auxiliary junction are vertically stacked, the limiting block is vertically inserted into the limiting groove, such that the primary member and the auxiliary member are horizontally clamped and limited. The primary member and the auxiliary member are provided with the primary junction having the limiting groove and the auxiliary junction having the limiting block respectively, such that the primary member and the auxiliary member are fixed to each other in an inserted manner.Type: ApplicationFiled: March 21, 2023Publication date: April 10, 2025Inventor: Dong TANG
-
Patent number: 12122550Abstract: A bag breaking device for garbage bags, which includes a horizontal moving mechanism, a vertical moving mechanism mounted on the horizontal moving mechanism, and a bag breaking mechanism mounted on the vertical moving mechanism; the bag breaking mechanism includes a first motor on the vertical moving mechanism, a first housing fixedly connected to an output end of the first motor, a second housing fixed on the first housing, a second motor fixed in the first housing, a first screw rod fixedly connected to an output end of the second motor, a screw block scraper rotatably mounted on the first screw rod, and a cylindrical knife fixed on the second housing.Type: GrantFiled: December 31, 2021Date of Patent: October 22, 2024Assignee: GUANGZHOU UNIVERSITYInventors: Changhong Liu, Xingxin Yang, Henghao Li, Shaohu Peng, Dong Tang, Lingxi Peng, Jiachun Wu, Tuxian Ye, Ziliang Li
-
Publication number: 20240132488Abstract: The present invention belongs to the medical field, and relates to novel ?-lactamase inhibitors, for the treatment of bacterial infections in combination with ?-lactam antibiotics, including infection caused by drug resistant organisms and especially multi-drug resistant organisms. The present invention includes compounds according to formula (I): or pharmaceutically acceptable salts thereof, wherein M and R are as defined herein.Type: ApplicationFiled: March 4, 2022Publication date: April 25, 2024Inventors: Zhixiang YANG, Haikang YANG, Jinbo JI, Lijuan ZHAI, Jian SUN, Jingwen JI, Lili HE, Dong TANG, Zafar IQBAL, Yuanbai LIU, Yangxiu MU, Xueqin MA, Jianqiang YU
-
Patent number: 11862830Abstract: The present disclosure provides a membrane electrode assembly (MEA) with high-efficiency water and heat management for a direct ethanol fuel cell (DEFC), and a fabrication method therefor, and belongs to the technical field of fuel cells. In the MEA for a DEFC in the present disclosure, a cathode catalyst layer is designed to be convex and ordered and an anode catalyst layer is designed to be concave and ordered, which is conducive to the timely discharge of the generated heat. The MEA for a DEFC can be fabricated by gradually fabricating each layer of the MEA on an inner surface and an outer surface of a proton-exchange membrane (PEM) or by step-by-step dip coating on an anode support tube. The present disclosure can effectively improve the working capacity of the cell.Type: GrantFiled: August 25, 2021Date of Patent: January 2, 2024Assignee: Jiangsu UniversityInventors: Dong Tang, Guoliang Xu, Yubin Han, Shengyao Shi, Yang Xiao
-
Publication number: 20230365561Abstract: ?-lactamase inhibitors, pharmaceutical compositions including the same, methods of preparing the same, and methods of treating bacterial infections in combination with ?-lactam antibiotics, including infection caused by drug resistant organisms and especially multi-drug resistant organisms. The present invention includes compounds according to formula (I) or pharmaceutically acceptable salts thereof, wherein M and R are as defined herein.Type: ApplicationFiled: September 1, 2020Publication date: November 16, 2023Inventors: Zhixiang YANG, Haikang YANG, Jinbo JI, Yuanyu GAO, Dong TANG, Lijuan ZHAI, Zafar IQBAL, Jian SUN, Jingwen JI, Yangxiu MU, Lili HE, Yuanbai LIU, Xueqin MA, Jianqiang YU
-
Publication number: 20230295149Abstract: A monobactam compound of formula (I), a preparation thereof, and a use thereof as antibiotic agents for the treatment of bacterial infections are provided. In the formula (I), M is hydrogen or a pharmaceutically acceptable salt forming cation, R1 and R2 represent independently of one another hydrogen or methyl, W represents a bond or O, X represents CR4 or N, R4 represents halogen, R3 represents hydrogen, amino, hydroxy, (C1-C6)-alkyl, or a 4-, 5- or 6-membered nitrogen-containing heterocycle.Type: ApplicationFiled: July 16, 2020Publication date: September 21, 2023Applicant: NINGXIA ACADEMY OF AGRICULTURE AND FORESTRY SCIENCESInventors: Zhixiang YANG, Haikang YANG, Jinbo JI, Lijuan ZHAI, Lili HE, Jian SUN, Koko MYO, Dong TANG, Yuanyu GAO, Yuanbai LIU, Yangxiu MU, Jingwen JI, Zafar IQBAL, Zawmin THU, Rui JIANG, Xueqin MA, Jianqiang YU
-
Publication number: 20230197992Abstract: The present disclosure provides a membrane electrode assembly (MEA) with high-efficiency water and heat management for a direct ethanol fuel cell (DEFC), and a fabrication method therefor, and belongs to the technical field of fuel cells. In the MEA for a DEFC in the present disclosure, a cathode catalyst layer is designed to be convex and ordered and an anode catalyst layer is designed to be concave and ordered, which is conducive to the timely discharge of the generated heat. The MEA for a DEFC can be fabricated by gradually fabricating each layer of the MEA on an inner surface and an outer surface of a proton-exchange membrane (PEM) or by step-by-step dip coating on an anode support tube. The present disclosure can effectively improve the working capacity of the cell.Type: ApplicationFiled: August 25, 2021Publication date: June 22, 2023Applicant: Jiangsu UniversityInventors: Dong TANG, Guoliang XU, Yubin HAN, Shengyao SHI, Yang XIAO
-
Publication number: 20230150996Abstract: Provided are ?-lactam compounds of formula (I), their preparation and use as antibiotic agents for the treatment of bacterial infections: Wherein X, W, R1, R2 and R3 are defined herein.Type: ApplicationFiled: August 6, 2020Publication date: May 18, 2023Inventors: Zhixiang YANG, Haikang YANG, Jinbo JI, Jian SUN, Lili HE, Lijuan ZHAI, Koko MYO, Dong TANG, Zafar IQBAL, Jingwen JI, Yuanyu GAO, Yangxiu MU, Yuanbai LIU, Xueqin MA, Jianqiang YU
-
Patent number: 11476803Abstract: The present disclosure provides an oscillating circuit and an electronic device; the oscillating circuit includes a capacitor charging and discharging circuit unit, a voltage comparison circuit unit and a threshold voltage generation circuit unit; the oscillating circuit uses the capacitor charging and discharging and the hysteresis effect of the capacitor charging and discharging circuit unit to achieve oscillation based on the negative feedback regulation constituted by the voltage comparison circuit unit and the threshold voltage generation circuit unit, which is different from the traditional oscillating circuit based on capacitance and inductance; the oscillating circuit does not adopts inductors, has relatively low power consumption, and outputs oscillation signals with frequencies that vary with currents, and when the oscillating circuit is used to provide clock signals for the sensor, it can be integrated with a sensor signal processing circuit to realize the miniaturization and integration of the senType: GrantFiled: January 7, 2020Date of Patent: October 18, 2022Assignees: NO.24 RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION, CHONGQING GIGACHIP TECHNOLOGY CO. LTD.Inventors: Rongbin Hu, Ziqiang Yi, Gang Zhou, Dong Tang, Ning Tang, Daiguo Xu, Jianan Wang, Guangbing Chen, Dongbing Fu
-
Publication number: 20220247354Abstract: The present disclosure provides an oscillating circuit and an electronic device; the oscillating circuit includes a capacitor charging and discharging circuit unit, a voltage comparison circuit unit and a threshold voltage generation circuit unit; the oscillating circuit uses the capacitor charging and discharging and the hysteresis effect of the capacitor charging and discharging circuit unit to achieve oscillation based on the negative feedback regulation constituted by the voltage comparison circuit unit and the threshold voltage generation circuit unit, which is different from the traditional oscillating circuit based on capacitance and inductance; the oscillating circuit does not adopts inductors, has relatively low power consumption, and outputs oscillation signals with frequencies that vary with currents.Type: ApplicationFiled: January 7, 2020Publication date: August 4, 2022Applicants: NO.24 RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION, CHONGQING GIGACHIP TECHNOLOGY CO. LTD.Inventors: RONGBIN HU, ZIQIANG YI, GANG ZHOU, DONG TANG, NING TANG, DAIGUO XU, JIANAN WANG, GUANGBING CHEN, DONGBING FU
-
Publication number: 20220119146Abstract: A bag breaking device for garbage bags, which includes a horizontal moving mechanism, a vertical moving mechanism mounted on the horizontal moving mechanism, and a bag breaking mechanism mounted on the vertical moving mechanism; the bag breaking mechanism includes a first motor on the vertical moving mechanism, a first housing fixedly connected to an output end of the first motor, a second housing fixed on the first housing, a second motor fixed in the first housing, a first screw rod fixedly connected to an output end of the second motor, a screw block scraper rotatably mounted on the first screw rod, and a cylindrical knife fixed on the second housing.Type: ApplicationFiled: December 31, 2021Publication date: April 21, 2022Inventors: Changhong Liu, Xingxin Yang, Henghao Li, Shaohu Peng, Dong Tang, Lingxi Peng, Jiachun Wu, Tuxian Ye, Ziliang Li
-
Patent number: 11163214Abstract: A camera module includes a circuit board; a photosensitive chip located on the circuit board and electrically coupled to the circuit board, a package material body arranged on the circuit board, a support member arranged on one end of the package material body away from the circuit board, and a filter having a first and a second surfaces. The package material body includes a top end bearing surface. The support member includes a support body and an extension structure, and the extension structure includes a bottom surface, the bottom surface is connected to the bearing surface, and the second surface is connected to the bottom surface. The camera module is a three-stage structure of a package material body plus a support member plus a plurality of lenses.Type: GrantFiled: September 15, 2018Date of Patent: November 2, 2021Assignee: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
-
Patent number: 10951801Abstract: A photosensitive assembly includes a circuit board, photosensitive chip coupled to the circuit board, the photosensitive chip includes a photosensitive area on an upper surface thereof and a non-photosensitive area surrounding the photosensitive area, and a package body packaged on the circuit board and covering a portion of the non-photosensitive area of the photosensitive chip, the package body includes an inner surface, and the inner surface has a curved surface on an edge thereof contacting the non-photosensitive area.Type: GrantFiled: September 14, 2018Date of Patent: March 16, 2021Assignee: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
-
Patent number: 10750072Abstract: The present disclosure relates to a camera module and a photosensitive assembly thereof. The photosensitive assembly comprises includes a circuit board, a photosensitive chip, and a packaging body. The photosensitive chip is connected to the circuit board. The packaging body is formed on the circuit board. A through hole is formed in the packaging body. The through hole is opposite to the photosensitive chip to provide a light channel of for the photosensitive chip. An inner side surface of the through hole comprises includes a first cambered surface, a connection surface, and a second cambered surface, and the first cambered surface and the second cambered surface are respectively connected to two ends of the connection surface.Type: GrantFiled: September 15, 2018Date of Patent: August 18, 2020Assignee: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
-
Patent number: 10708481Abstract: The present disclosure relates to a camera module and a photosensitive assembly thereof. The photosensitive assembly includes a circuit board, a photosensitive chip and a packaging body. The photosensitive chip is connected to the circuit board, and includes a photosensitive region and a non-photosensitive region surrounding the photosensitive region. The packaging body is formed on the circuit board and a portion of the non-photosensitive region of the photosensitive chip. The packaging body includes a top surface away from the photosensitive chip and an inner side surface connecting the top surface to the non-photosensitive region. A portion of the inner side surface adjacent to the top surface is a cambered surface, and the cambered surface has a larger surface area than an inclined plane, thus the cambered surface can carry more adhesive. In this way, it is possible to effectively prevent the adhesive from flowing to the photosensitive region of the photosensitive chip.Type: GrantFiled: September 15, 2018Date of Patent: July 7, 2020Assignee: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
-
Patent number: 10707249Abstract: A camera module includes a circuit board; a photosensitive chip coupled to the circuit board, a package material body attached on the circuit board, and a support member mounted on the package material body. The package material body has a photosensitive surface, which includes a photosensitive region. The support member includes a support body and an extension structure. A side of the support body away from the package material body is coplanar with the extension structure. An orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region.Type: GrantFiled: September 15, 2018Date of Patent: July 7, 2020Assignee: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
-
Publication number: 20200212241Abstract: A high efficient photovoltaic module with cut cells including: the surface glass layer, the upper encapsulation layer, the solar cell string layer, the lower encapsulation layer, and the back plate. The solar cell string layer includes a plurality of solar cell strings, each solar cell string including a plurality of solar cells connected by using a first electric conductor and a second electric conductor. The plurality of solar cells is connected in series by the first electric conductor on front sides. The plurality of solar cells is connected in series by the second electric conductor on back sides.Type: ApplicationFiled: December 9, 2019Publication date: July 2, 2020Inventors: Jianjun WANG, Zhaowei NING, Tao FENG, Congwu LIANG, Jianchao ZHANG, Taohua HUANG, Yun SHI, Dong TANG
-
Patent number: 10699875Abstract: Methods and systems for charged particle microscope confocal imaging are disclosed herein. An example method includes obtaining a plurality of probe images of a portion of a sample, each probe image of the plurality of probe images obtained at a different focal depth within the sample, applying a virtual aperture to each probe image of the plurality of probe images to form a respective plurality of confocal images, and forming a three-dimensional reconstruction of the sample based on the plurality of confocal images.Type: GrantFiled: November 13, 2018Date of Patent: June 30, 2020Assignee: FEI CompanyInventors: Mark Williamson, Andrew Barnum, Dong Tang
-
Publication number: 20200203543Abstract: A bifacial double glass solar module including: the upper glass layer, the upper encapsulation layer, the cell layer, the lower encapsulation layer, and the lower glass layer. The upper glass layer, the upper encapsulation layer, the cell layer, the lower encapsulation layer, and the lower glass layer are disposed sequentially from top to bottom. The cell layer includes a plurality of double-sided cells connected in series by a solder strip. The upper glass layer is provided with a first anti-reflection film layer on the upper surface and a first up-conversion thin film layer on the lower surface. The lower glass layer is provided with a second up-conversion thin film layer on the upper surface and a second anti-reflection film layer on the lower surface.Type: ApplicationFiled: December 9, 2019Publication date: June 25, 2020Inventors: Jianjun WANG, Zhaowei NING, Tao FENG, Congwu LIANG, Jianchao ZHANG, Taohua HUANG, Yun SHI, Dong TANG
-
Patent number: 10667052Abstract: A speaker module, and an audio compensation method and apparatus and relates to the field of terminal technologies. The speaker module includes an audio component and a speaker board. A power contact, a ground contact, and a general-purpose input/output (GPIO) contact are disposed on the speaker board, and a connecting component is disposed between the audio component and the speaker board. A connection status of the GPIO contact is any one of the following. The connecting component is a conductor, and the GPIO contact is conducted to the power contact using the connecting component, the connecting component is a conductor, and the GPIO contact is conducted to the ground contact using the connecting component, or the connecting component is a non-conductor, and the GPIO contact is disconnected from both the power contact and the ground contact.Type: GrantFiled: October 26, 2015Date of Patent: May 26, 2020Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventor: Dong Tang