Patents by Inventor Dong Tang
Dong Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20200152420Abstract: Methods and systems for charged particle microscope confocal imaging are disclosed herein. An example method includes obtaining a plurality of probe images of a portion of a sample, each probe image of the plurality of probe images obtained at a different focal depth within the sample, applying a virtual aperture to each probe image of the plurality of probe images to form a respective plurality of confocal images, and forming a three-dimensional reconstruction of the sample based on the plurality of confocal images.Type: ApplicationFiled: November 13, 2018Publication date: May 14, 2020Inventors: Mark WILLIAMSON, Andrew BARNUM, Dong TANG
-
Patent number: 10623614Abstract: A camera module includes a circuit board, a photosensitive chip coupled to the circuit board and having a photosensitive surface, a package material body attached on the circuit board, and a support member mounted on a side of the package material body away from the circuit board. The photosensitive surface includes a photosensitive region. The support member includes a support body and an extension structure. A side of the support body adjacent to the package material body is coplanar with a side of the extension structure adjacent to the package material body, and an orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region.Type: GrantFiled: September 15, 2018Date of Patent: April 14, 2020Assignee: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
-
Patent number: 10600832Abstract: A camera module includes a circuit board, a photosensitive chip located on the circuit board and electrically coupled to the circuit board, a package body packaged on the circuit board, and a bracket located on a side of the package body away from the circuit board. The package body includes a bearing surface away from the circuit board, and the bracket includes a first surface adjacent to the package body. A ratio between an area of the first surface and an area of the bearing surface is about 0.5 to about 1.2.Type: GrantFiled: September 14, 2018Date of Patent: March 24, 2020Assignee: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
-
Patent number: 10602043Abstract: A camera module includes: a circuit board; a photosensitive chip located on and coupled to the circuit board; a package body packaged on the circuit board; and a bracket located on a side of the package body away from the circuit board; wherein the bracket is provided with a step away from the package body, a sidewall of the step is inclined with respect to an optical axis of the camera module, a distance between the sidewall of the step and the optical axis gradually increase along a direction from the circuit to the package body, and an angle between the sidewall of the step and the optical axis ranges from 0.5° to 30°.Type: GrantFiled: September 14, 2018Date of Patent: March 24, 2020Assignees: O-FILM IMAGE TECHNOLOGY (GUANGZHOU) CO., LTD., NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
-
Publication number: 20190086771Abstract: A camera module includes a circuit board; a photosensitive chip located on the circuit board and electrically coupled to the circuit board, a package material body arranged on the circuit board, a support member arranged on one end of the package material body away from the circuit board, and a filter having a first and a second surfaces. The package material body includes a top end bearing surface. The support member includes a support body and an extension structure, and the extension structure includes a bottom surface, the bottom surface is connected to the bearing surface, and the second surface is connected to the bottom surface. The camera module is a three-stage structure of a package material body plus a support member plus a plurality of lenses.Type: ApplicationFiled: September 15, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
-
Publication number: 20190089882Abstract: A photosensitive assembly includes a circuit board, photosensitive chip coupled to the circuit board, the photosensitive chip includes a photosensitive area on an upper surface thereof and a non-photosensitive area surrounding the photosensitive area, and a package body packaged on the circuit board and covering a portion of the non-photosensitive area of the photosensitive chip, the package body includes an inner surface, and the inner surface has a curved surface on an edge thereof contacting the non-photosensitive area.Type: ApplicationFiled: September 14, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
-
Publication number: 20190089885Abstract: A camera module includes a circuit board, a photosensitive chip coupled to the circuit board and having a photosensitive surface, a package material body attached on the circuit board, and a support member mounted on a side of the package material body away from the circuit board. The photosensitive surface includes a photosensitive region. The support member includes a support body and an extension structure. A side of the support body adjacent to the package material body is coplanar with a side of the extension structure adjacent to the package material body, and an orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region.Type: ApplicationFiled: September 15, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
-
Publication number: 20190089881Abstract: A camera module includes: a circuit board; a photosensitive chip located on and coupled to the circuit board; a package body packaged on the circuit board; and a bracket located on a side of the package body away from the circuit board; wherein the bracket is provided with a step away from the package body, a sidewall of the step is inclined with respect to an optical axis of the camera module, a distance between the sidewall of the step and the optical axis gradually increase along a direction from the circuit to the package body, and an angle between the sidewall of the step and the optical axis ranges from 0.5° to 30°.Type: ApplicationFiled: September 14, 2018Publication date: March 21, 2019Applicants: O-FILM IMAGE TECHNOLOGY (GUANGZHOU) CO.,LTD., NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
-
Publication number: 20190088699Abstract: A camera module includes a circuit board; a photosensitive chip coupled to the circuit board, a package material body attached on the circuit board, and a support member mounted on the package material body. The package material body has a photosensitive surface, which includes a photosensitive region. The support member includes a support body and an extension structure. A side of the support body away from the package material body is coplanar with the extension structure. An orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region.Type: ApplicationFiled: September 15, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
-
Publication number: 20190089884Abstract: The present disclosure relates do a camera module and a photosensitive assembly thereof The photosensitive assembly comprises includes a circuit board, a photosensitive chip, and a packaging body. The photosensitive chip is connected to the circuit board. The packaging body is formed on the circuit board. A through hole is formed in the packaging body. The through hole is opposite lo the photosensitive chip to provide a light channel of for the photosensitive chip. An inner side surface of the through hole comprises includes a first cambered surface, a connection surface, and a second cambered surface, and the first cambered surface and the second cambered surface are respectively connected to two ends of the connection surface.Type: ApplicationFiled: September 15, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
-
Publication number: 20190088698Abstract: A camera module includes a circuit board, a photosensitive chip located on the circuit board and electrically coupled to the circuit board, a package body packaged on the circuit board, and a bracket located on a side of the package body away from the circuit board. The package body includes a bearing surface away from the circuit board, and the bracket includes a first surface adjacent to the package body. A ratio between an area of the first surface and an area of the bearing surface is about 0.5 to about 1.2.Type: ApplicationFiled: September 14, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
-
Publication number: 20190089883Abstract: The present disclosure relates to a camera module and a photosensitive assembly thereof. The photosensitive assembly includes a circuit board, a photosensitive chip and a packaging body. The photosensitive chip is connected to the circuit board, and includes a photosensitive region and a non-photosensitive region surrounding the photosensitive region. The packaging body is formed on the circuit board and a portion of the non-photosensitive region of the photosensitive chip. The packaging body includes a top surface away from the photosensitive chip and an inner side surface connecting the top surface to the non-photosensitive region. A portion of the inner side surface adjacent to the top surface is a cambered surface, and the cambered surface has a larger surface area than an inclined plane, thus the cambered surface can carry more adhesive. In this way, it is possible to effectively prevent the adhesive from flowing to the photosensitive region of the photosensitive chip.Type: ApplicationFiled: September 15, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
-
Publication number: 20190058945Abstract: A speaker module, and an audio compensation method and apparatus and relates to the field of terminal technologies. The speaker module includes an audio component and a speaker board. A power contact, a ground contact, and a general-purpose input/output (GPIO) contact are disposed on the speaker board, and a connecting component is disposed between the audio component and the speaker board. A connection status of the GPIO contact is any one of the following. The connecting component is a conductor, and the GPIO contact is conducted to the power contact using the connecting component, the connecting component is a conductor, and the GPIO contact is conducted to the ground contact using the connecting component, or the connecting component is a non-conductor, and the GPIO contact is disconnected from both the power contact and the ground contact.Type: ApplicationFiled: October 26, 2015Publication date: February 21, 2019Applicant: Huawei Technologies Co., Ltd.Inventor: Dong Tang
-
Patent number: 9906692Abstract: A media stream sharing method and terminal, where the method includes, after a first terminal receives a start instruction triggered by a user to start a service of sharing audio and video, searching for, according to the start instruction, a terminal capable of implementing sharing of a media stream with the first terminal, and displaying the found terminal or terminal list; when the first terminal determines that a terminal selected by a user according to the displayed terminal or terminal list is a second terminal, obtaining a playing attribute of the second terminal; and synchronizing, by the first terminal according to the playing attribute, a media stream currently played to the second terminal, causing the second terminal to decode and play the media stream. The method solves problems of audio and video asynchronization, operational complexity, and high costs during media stream sharing in the prior art.Type: GrantFiled: December 30, 2014Date of Patent: February 27, 2018Assignee: HUAWEI DEVICE CO., LTD.Inventors: Xianjun Zou, Dong Tang
-
Publication number: 20170271813Abstract: An electrical connector includes an insulative housing; plural contacts secured to the insulative housing, and a pair of holding members insert molded with the insulative housing, the holding member including a base, a pair of arms extending from the base, and a pair of contact portions bent inwardly from the arms, wherein the base is embedded in the insulative housing. Also an electrical connector includes an insulative housing, plural contacts secured to the insulative housing, and a pair of holding members insert molded with the insulative housing, each holding member including a base, a pair of arms extending from the base, and a head bent inwardly from the base, wherein the base is embedded in the insulative housing.Type: ApplicationFiled: March 17, 2017Publication date: September 21, 2017Inventors: MING-QI GE, LI-DONG TANG, XIAO-LI ZHU, XING-CHEN QIAN, XIAN-DONG BAO
-
Patent number: 9589275Abstract: A user behavior analysis (UBA) method, and a related device and system are provided. The method is applied to a UBA system including at least one UBA cloud server. The method includes: receiving, by a UBA cloud server, a network content identifier reported by a first UBA subnode, where the network content identifier cannot be identified by the first UBA subnode; acquiring network content corresponding to the network content identifier; extracting a keyword from the network content; updating a behavior knowledge base by using the extracted keyword; and delivering, by the UBA cloud server, the updated behavior knowledge base or updated content of the behavior knowledge base to a UBA subnode set, where the UBA subnode set at least includes the first UBA subnode and a second UBA subnode. The UBA cloud server and the UBA subnodes are associated with a telecommunication network.Type: GrantFiled: October 27, 2014Date of Patent: March 7, 2017Assignee: Huawei Technologies Co., Ltd.Inventors: Dong Tang, Hongding Zhang, Wei Zhou
-
Publication number: 20170047675Abstract: An electrical connector is applied on a module mobile device with a frame and includes a magnetic element and a plurality of conductive terminals assembled into the magnetic element. Each conductive terminal defines a contacting portion exposed upwardly outside of the magnetic element and a soldering portion extending downwardly outside of the magnetic element.Type: ApplicationFiled: August 11, 2016Publication date: February 16, 2017Inventors: MING-QI GE, LI-DONG TANG, JIAN-HUA LIANG, XIAN-DONG BAO
-
Patent number: 9477718Abstract: A data mining method, apparatus, and system are provided.Type: GrantFiled: December 16, 2013Date of Patent: October 25, 2016Assignee: Huawei Technologies Co., LTDInventors: Wei Zhou, Dong Tang, Hongding Zhang
-
Patent number: 9337590Abstract: A cable electrical connector assembly includes an electrical connector, a cable soldered with the electrical connector, and an insulative body. The electrical connector includes a printed circuit board having a number of conductive pads, two of the conductive pads forming a differential signal pair for differential signal transmission. The cable has a number of core wires soldered with the conductive pads. The insulative body encloses a soldering area of the conductive pads and the cable core wires. The insulative body has a slot between the two conductive pads of the differential signal pair, the slot running through the insulative body along an up-to-down direction. The slot improves impedance in the soldering area of the core wires and the conductive pads.Type: GrantFiled: July 25, 2014Date of Patent: May 10, 2016Assignee: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Jerry Wu, Xiao-Feng Li, Jian-Jun Zhu, Dong Tang, Qing-Man Zhu
-
Publication number: 20150186095Abstract: An inter-terminal graphic sharing method, a terminal device, and a communications system are provided. The method includes: determining, by the transmit end, a sharing area on a graphic displayed on a screen of the transmit end; processing, by the transmit end, a graphic in a non-sharing area, so as to mask the graphic in the non-sharing area, where the non-sharing area is an area except the sharing area on the graphic displayed on the screen of the transmit end; and sending, by the transmit end, a processed graphic displayed on the screen to the receive end by using a local area network, so that the transmit end and the receive end share a graphic in the sharing area. Thus a part of a graphic is shared between two terminals in a local area network, thereby satisfying a security requirement and a personalized requirement of a user.Type: ApplicationFiled: December 23, 2014Publication date: July 2, 2015Inventors: Hao Dong, Dong Tang, Liu Yang