Abstract: An electromagnetic wave reverberation chamber includes: an electromagnetic wave absorbing apparatus installed in an intended space of the electromagnetic wave reverberation chamber for adjusting a reflection characteristic of an inside of the electromagnetic wave reverberation chamber, wherein the electromagnetic wave absorbing apparatus have an electromagnetic bandgap structure including a plurality of unit cells arranged periodically.

Abstract: A multi-directional resonant-type electromagnetic wave absorber includes: at least one ground layer; a first dielectric layer and a second dielectric layer respectively formed on different outer surfaces of the ground layer; a first resistive pattern layer formed on an outer surface of the first dielectric layer; and a second resistive pattern layer formed on an outer surface of the second dielectric layer. Herein, the electromagnetic absorption performance is adjusted by changing one or more of thicknesses, permittivities, and permeabilities of the dielectric layers, thicknesses of the resistive pattern layers, and a reflection coefficient of the ground layer.

Abstract: An electromagnetic absorber using resistive material includes a ground plane of a conductive material; a dielectric layer formed on the ground plane; and a pattern layer in which specific unit cell patterns made of a resistive material are periodically arranged on the dielectric layer. The electromagnetic absorber is applied to an electronic toll collection system, a transportation device, a building structure, an electronic device and an anechoic chamber.

Abstract: Provided are a tag antenna for wireless identification and a wireless identification system including the tag antenna. The tag antenna includes: a substrate formed of a first dielectric; a conductive ground layer formed underneath the substrate; an AMC layer formed on the substrate; and a wireless identification chip adhered onto the AMC layer.

Abstract: There is provided provided a frequency selective surface (FSS) structure for filtering a single frequency band, including: a plurality of unit cells arranged at a predetermined distance, wherein each of the unit cells includes: a substrate; a circular loop formed on the substrate with a predetermined width and having at least one of meanderingly bent portions, wherein a filtering frequency band is controlled by a length of the circular loop, a width of the circular loop, a distance between the unit cells, and a thickness and dielectric constant of dielectric.

Abstract: An antenna system includes an antenna transmitting and receiving a signal; a power feeding line feeding electric power to the antenna; and a metal conductor ground electrically connected to the power feeding line. Further, the metal conductor ground includes an electromagnetic bandgap.

Abstract: An electromagnetic wave absorber includes a ground layer made of a metal conductor, a dielectric layer formed on the ground layer, and a unit cell pattern made of a resistive material, and formed on the dielectric layer. The unit cell pattern includes a fundamental patch having a regular square shape, in which a rectangular recess is formed on the center of each of the respective sides, the fundamental patch being located at the center of each of the unit cell pattern, and half cross dipole patches, which are respectively disposed at the four sides of the fundamental patch at a regular angle so as to be engaged with the recesses formed on the respective sides of the fundamental patch at a regular interval.

Abstract: An electromagnetic-wave suppression structure in a multilayer PCB or package structure is supplied with a power to be used therein by a power distribution network including a power plane and a ground plane. The multilayer PCB and package includes: an electromagnetic-wave suppression structure including an electromagnetic band-gap; and the electromagnetic-wave suppression structure is formed at a specific portion(s) of the power plane and/or the ground plane to suppress noises.

Abstract: An opening/closing type electromagnetic wave absorbing device is provided. The opening/closing type electromagnetic wave absorbing device includes, a plurality of electromagnetic band gap (EBG) unit cells each of which is polygonal and selectively transmits or reflects a wave with a predetermined frequency and an opening/closing means on which the plurality of EBG unit cells are periodically arranged to selectively open and close a limited space, wherein each of the plurality of EBG unit cells includes a metallic conductive ground layer; a dielectric layer formed on the metallic conductive ground layer; an EBG unit cell pattern layer formed of a resistive material on the dielectric layer.

Abstract: A multilayer board for suppressing unwanted electromagnetic waves and noise includes: a power plane and a ground plane constituting a power distribution network; an electromagnetic wave suppression structure placed on the power plane or the ground plane; and a decoupling capacitor placed on the power plane or the ground plane, wherein the electromagnetic wave suppression structure and the decoupling capacitor are placed together.

Abstract: A multi-directional resonant-type electromagnetic wave absorber includes: at least one ground layer; a first dielectric layer and a second dielectric layer respectively formed on different outer surfaces of the ground layer; a first resistive pattern layer formed on an outer surface of the first dielectric layer; and a second resistive pattern layer formed on an outer surface of the second dielectric layer. Herein, the electromagnetic absorption performance is adjusted by changing one or more of thicknesses, permittivities, and permeabilities of the dielectric layers, thicknesses of the resistive pattern layers, and a reflection coefficient of the ground layer.

Abstract: An apparatus for reducing electromagnetic waves includes a dielectric layer and a plurality of metal unit cells periodically formed over the dielectric layer. The apparatus further includes an adhesive formed under the dielectric layer for attaching the apparatus to a radiator radiating electromagnetic waves.

Abstract: An electromagnetic-wave suppression structure in a multilayer PCB or package structure is supplied with a power to be used therein by a power distribution network including a power plane and a ground plane. The multilayer PCB and package includes: an electromagnetic-wave suppression structure including an electromagnetic band-gap; and the electromagnetic-wave suppression structure is formed at a specific portion(s) of the power plane and/or the ground plane to suppress noises.

Abstract: An electromagnetic absorber using resistive material includes a ground plane of a conductive material; a dielectric layer formed on the ground plane; and a pattern layer in which specific unit cell patterns made of a resistive material are periodically arranged on the dielectric layer. The electromagnetic absorber is applied to an electronic toll collection system, a transportation device, a building structure, an electronic device and an anechoic chamber.

Abstract: There is provided provided a frequency selective surface (FSS) structure for filtering a single frequency band, including: a plurality of unit cells arranged at a predetermined distance, wherein each of the unit cells includes: a substrate; a circular loop formed on the substrate with a predetermined width and having at least one of meanderingly bent portions, wherein a filtering frequency band is controlled by a length of the circular loop, a width of the circular loop, a distance between the unit cells, and a thickness and dielectric constant of dielectric.

Abstract: Provided are a dipole tag antenna using an artificial magnetic conductor (AMC) for wireless identification and a wireless identification system using the dipole tag antenna. The dipole tag antenna includes: a substrate formed of a first dielectric material; a conductive ground layer formed underneath the substrate; an AMC layer formed on the substrate; the dipole tag antenna mounted on the AMC layer and comprising a wireless identification chip; and the AMC directly mounted on a conductor.

Abstract: Provided are a tag antenna for wireless identification and a wireless identification system including the tag antenna. The tag antenna includes: a substrate formed of a first dielectric; a conductive ground layer formed underneath the substrate; an AMC layer formed on the substrate; and a wireless identification chip adhered onto the AMC layer.

Abstract: An electromagnetic wave absorber includes a ground layer made of a metal conductor, a dielectric layer formed on the ground layer, and a unit cell pattern made of a resistive material, and formed on the dielectric layer. The unit cell pattern includes a fundamental patch having a regular square shape, in which a rectangular recess is formed on the center of each of the respective sides, the fundamental patch being located at the center of each of the unit cell pattern, and half cross dipole patches, which are respectively disposed at the four sides of the fundamental patch at a regular angle so as to be engaged with the recesses formed on the respective sides of the fundamental patch at a regular interval.

Abstract: An apparatus for reducing electromagnetic waves, includes an electromagnetic bandgap for reducing a surface current induced by electromagnetic waves that are emitted from a radiator; and an absorber for reducing a surface current around the electromagnetic bandgap and for diminishing diffracted waves radiated from an end of a terminal.

Abstract: Provided are a high impedance surface structure using an AMC (artificial magnetic conductor) and an antenna and an electromagnetic device using the high impedance surface structure. The high impedance surface structure includes: a ground layer formed of a first conductor layer; a first dielectric layer formed on the ground layer; and an HIS (high impedance surface) layer formed of second conductor layers and a second dielectric layer on the first dielectric layer, wherein the second conductor layers are interdigitated with one another and vias connecting the second conductor layers to the ground layer are not formed.