Abstract: A side view mirror having a rotatable housing comprises a cover plate mounted on an exterior of a vehicle body, wherein an inside and outside of the cover plate are divided based on the vehicle body. A stay includes a lever disposed at an inner side of the cover plate. An up/down/left/right angle adjusting part is integrated with a connection bar, connected to the lever through the connection bar, and configured to be movable in up/down and left/right directions with respect to an outer surface of the cover plate. A folding supporting part is integrated with the up/down/left/right angle adjusting part at the outer surface of the up/down/left/right angle adjusting part and connected to the mirror-integrated housing. A mirror-integrated housing is foldably or unfoldably coupled with the folding supporting part, and an angle of the mirror-integrated housing is adjusted in up/down and left/right directions by the up/down/left/right angle adjusting part.

Abstract: An image sensor includes a first photo detecting device disposed in a central region of a pixel array portion and a second photo detecting device disposed in an edge of the pixel array portion. The second photo detecting device has a full well capacity which is less than a full well capacity of the first photo detecting device. An imaging device includes the image sensor and an image signal process. The image signal processor compensates for a lens shading effect and a difference between the full well capacity of the first photo detecting device and the full well capacity of the second photo detecting device.

Abstract: An image sensor includes a first substrate, a photodiode array, a first wiring structure, a second wiring structure, a third wiring structure and a light blocking layer pattern. The photodiode array is disposed in the first substrate. The photodiode array includes first photodiodes in a first region, second photodiodes in a second region and third photodiodes in a third region. The first wiring structure is disposed in the first region. The first wiring structure is electrically connected to the first photodiodes. The second wiring structure is disposed in the second region. The second wiring structure includes power supply wiring. The third wiring structure is disposed in the third region. The third wiring structure is electrically connected to the third photodiodes. The light blocking layer pattern is disposed on the first substrate. The light blocking layer pattern covers the third region and the fourth region.

Abstract: A pixel of an image sensor includes a well below a gate and containing a dopant at a first concentration, a shallow trench isolation (STI) configured to electrically isolate the well, and a channel stop adjacent to at least one border between the well and the STI and containing a dopant at a second concentration higher than the first concentration.

Abstract: A side view mirror having a rotatable housing comprises a cover plate mounted on an exterior of a vehicle body, wherein an inside and outside of the cover plate are divided based on the vehicle body. A stay includes a lever disposed at an inner side of the cover plate. An up/down/left/right angle adjusting part is integrated with a connection bar, connected to the lever through the connection bar, and configured to be movable in up/down and left/right directions with respect to an outer surface of the cover plate. A folding supporting part is integrated with the up/down/left/right angle adjusting part at the outer surface of the up/down/left/right angle adjusting part and connected to the mirror-integrated housing. A mirror-integrated housing is foldably or unfoldably coupled with the folding supporting part, and an angle of the mirror-integrated housing is adjusted in up/down and left/right directions by the up/down/left/right angle adjusting part.

Abstract: An image sensor includes a first photo detecting device disposed in a central region of a pixel array portion and a second photo detecting device disposed in an edge of the pixel array portion. The second photo detecting device has a full well capacity which is less than a full well capacity of the first photo detecting device. An imaging device includes the image sensor and an image signal process. The image signal processor compensates for a lens shading effect and a difference between the full well capacity of the first photo detecting device and the full well capacity of the second photo detecting device.

Abstract: Disclosed is a device for inspecting a bonded wafer using laser, which has a simple structure to facilitate an operation of the device and can detect an interface defect of the bonded wafer economically and highly reliably. To this end, the device for inspecting the bonded wafer using laser includes a laser unit, a laser diffusion unit, and a detection unit. If the device of inspecting the bonded wafer using laser according to the present invention is used, it is possible to advantageously inspect a wafer interface at a magnification desired by an inspector. In addition, the device has a simple structure, and thus it is advantageously easy to operate the device.

Abstract: Provided is a bonded wafer inspection method using a laser method allowing a simple and reliable test in an examination of a bonded wafer interface using a laser. To do this, a laser used bonded wafer inspection method includes, emitting a laser beam through a laser means, diffusing the emitted laser beam by a laser diffusion means, illuminating the diffused laser beam on a bonded wafer, and detecting a laser beam illuminated and transmitted at the bonded wafer using a detecting means. In a case a bonded wafer inspection method using a laser of the invention is used, defects by a foreign substance occurring at an interface of a bonded wafer is can be examined in a simple way and thus high work performance may be expected.