Patents by Inventor Dong Yun Jung

Dong Yun Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170025550
    Abstract: Provided is a bridge diode according to an embodiment of the inventive concept. The bridge diode includes a first structure including a first lower nitride film and a first upper nitride film, which are laminated on the substrate, a second structure including a second lower nitride film and a second upper nitride film, which are laminated on the substrate, a first electrode structural body disposed on the first structure, and a second electrode structural body disposed on the second structure.
    Type: Application
    Filed: July 20, 2016
    Publication date: January 26, 2017
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Dong Yun JUNG, Hyun Soo LEE, Sang Choon KO, Minki KIM, Jeho NA, EUN SOO NAM, Young Rak PARK, Junbo PARK, Hyung Seok LEE, Hyun-Gyu JANG, Chi Hoon JUN
  • Publication number: 20170012359
    Abstract: The present disclosure relates to a pre-5th-generation (5G) or 5G communication system to be provided for supporting higher data rates beyond 4th-generation (4G) communication system such as long term evolution (LTE). An electronic device is provided in a wireless communication system. The device comprises a plurality of antenna sets; a plurality of antenna elements configuring the plurality of antenna sets; an RF transceiver including a plurality of switches for selecting the plurality of antenna elements and a plurality of phase shifters for shifting the phase of a signal transmitted/received through the plurality of antenna elements; and a control unit for determining a beam forming direction and the phase of the signal by simultaneously controlling the plurality of switches and the plurality of phase shifters according to a beambook.
    Type: Application
    Filed: February 27, 2015
    Publication date: January 12, 2017
    Inventors: Dong-Yun JUNG, Sung-Tae CHOI, Ji-Hoon KIM, Yi-Ju ROH, Yun-A SHIM, Dong-Hyun LEE, Seung-Pyo HONG
  • Publication number: 20160380119
    Abstract: A first nitride semiconductor layer of a semiconductor device is provided on a substrate, a second nitride semiconductor layer is provided on the first nitride semiconductor layer, a first ohmic metal and a second ohmic metal are provided on the second nitride semiconductor layer, a recess region is provided in the second nitride semiconductor layer between the first ohmic metal and the second ohmic metal, a passivation layer covers side of the first ohmic metal and a bottom surface and sides of the recess region, and a Schottky electrode is provided on the first ohmic metal and extends into the recess region.
    Type: Application
    Filed: March 30, 2016
    Publication date: December 29, 2016
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Dong Yun JUNG, Hyun Soo LEE, Sang Choon KO, Jeong-Jin KIM, Zin-Sig KIM, Jeho NA, Eun Soo NAM, Jae Kyoung MUN, Young Rak PARK, Sung-Bum BAE, Hyung Seok LEE, Woojin CHANG, Hyungyu JANG, Chi Hoon JUN
  • Publication number: 20160330049
    Abstract: The present invention relates to a method and an apparatus for direct current offset calibration of a direct conversion receiver, a Direct Current (DC) offset calibration apparatus of a direct conversion receiver includes a plurality of variable gain amplifiers for amplifying an input signal based on a gain control value, a DC offset monitoring unit for monitoring a DC offset for an output signal of the plurality of variable gain amplifiers, a plurality of variable Digital to Analog Converters (DACs) for controlling a current applied to each of the plurality of variable gain amplifiers according to a current control code, and a DC offset cancellation unit for determining a current control code set which minimizes the DC offset value per preset gain control value, and thus the DC offset can be precisely cancelled without being affected by external factors such as a signal modulation method and heat and performance degradation of the receiver can be prevented.
    Type: Application
    Filed: January 2, 2015
    Publication date: November 10, 2016
    Inventors: Yi-Ju ROH, Ji-Hoon KIM, Ju-Ho SON, Yun-A SHIM, Dong-Hyun LEE, Dong-Yun JUNG, Sung-Tae CHOI, Seung-Pyo HONG
  • Publication number: 20160260653
    Abstract: Provided is a semiconductor device. The semiconductor device includes a substrate including a cantilever configured to generate a flow of cooling media through dynamic movement, an active area on the substrate which an electronic device is provided on, an insulation layer disposed to be spaced apart from the active area on the substrate, a lower electrode on the insulation layer, a piezoelectric film on the lower electrode, and an upper electrode on the piezoelectric film.
    Type: Application
    Filed: October 1, 2015
    Publication date: September 8, 2016
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Chi Hoon JUN, Jeho NA, Dong Yun JUNG, Sang Choon KO, Eun Soo NAM, Hyung Seok LEE
  • Patent number: 9294178
    Abstract: An electronic device for beamforming and a method thereof in a wireless communication system are provided. The electronic device includes a plurality of antennas. The electronic device also includes a plurality of transmitter and receiver switches connected to the antennas and configured to select a plurality of transmission paths and a plurality of reception paths. The electronic device further includes a plurality of first Phase Shifters (P/Ss) configured to shift a phase of Radio Frequency (RF) signals received via the antennas and the transmitter and receiver switches. The electronic device includes a combiner configured to combine the phase-shifted RF signals to one RF signal. The electronic device also includes a quadrature signal generator configured to generate a quadrature signal. The electronic device further includes a down-mixer configured to convert the quadrature signal and the combined RF signal to a first baseband signal and configured to output the first baseband signal to a modem.
    Type: Grant
    Filed: January 6, 2015
    Date of Patent: March 22, 2016
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Dong-Yun Jung, Sung-Tae Choi, Dong-Woo Kang, Ji-Hoon Kim, Yi-Ju Roh, Yun-A Shim, Dong-Hyun Lee, Seung-Pyo Hong
  • Publication number: 20150195027
    Abstract: An electronic device for beamforming and a method thereof in a wireless communication system are provided. The electronic device includes a plurality of antennas. The electronic device also includes a plurality of transmitter and receiver switches connected to the antennas and configured to select a plurality of transmission paths and a plurality of reception paths. The electronic device further includes a plurality of first Phase Shifters (P/Ss) configured to shift a phase of Radio Frequency (RF) signals received via the antennas and the transmitter and receiver switches. The electronic device includes a combiner configured to combine the phase-shifted RF signals to one RF signal. The electronic device also includes a quadrature signal generator configured to generate a quadrature signal. The electronic device further includes a down-mixer configured to convert the quadrature signal and the combined RF signal to a first baseband signal and configured to output the first baseband signal to a modem.
    Type: Application
    Filed: January 6, 2015
    Publication date: July 9, 2015
    Inventors: Dong-Yun Jung, Sung-Tae Choi, Dong-Woo Kang, Ji-Hoon Kim, Yi-Ju Roh, Yun-A Shim, Dong-Hyun Lee, Seung-Pyo Hong
  • Publication number: 20130194754
    Abstract: An apparatus for a single chip package using Land Grid Array (LGA) coupling is provided. The apparatus includes a multi-layer substrate, at least one integrated circuit chip, and a Printed Circuit Board (PCB). The a multi-layer substrate has at least one substrate layer, has at least one first chip region and at least one second chip region in a lowermost substrate layer, configures a transmission line transition of a vertical structure for transmitting a signal from at least one integrated circuit chip coupled in the first chip region in a coaxial shape or in a form of a Co-Planar Waveguide guide (CPW), and has an LGP coupling pad for connecting with a Printed Circuit Board (PCB) in the lowermost layer. The at least one integrated circuit chip is coupled in the first chip region and the second chip region. The PCB is connected with the multi-layer substrate using the LGA coupling via the LGA coupling pad.
    Type: Application
    Filed: October 5, 2011
    Publication date: August 1, 2013
    Applicant: Samsung Electronics Co. Ltd.
    Inventors: Dong-Yun Jung, Sung-Tae Choi, Young-Hwan Kim, Jung-Han Choi, Ji-Hoon Kim, Jei-Young Lee, Dong-Hyun Lee
  • Patent number: 8183896
    Abstract: A resistive frequency mixing apparatus includes a first frequency mixer having a source follower FET, and a second frequency mixer having a common source FET. The resistive frequency mixing apparatus perform a frequency mixing of an RF depending on an LO signal to generate a down-converted IF signal when the RF signal is applied to the source follower FET and the LO signal is applied to the common source FET. Further, the resistive frequency mixing apparatus performs a frequency mixing of an IF signal depending on an LO signal through the use of the source follower FET to produce an up-converted RF signal when the IF signal is applied to the common source FET and the LO signal is applied to the common source FET.
    Type: Grant
    Filed: October 27, 2008
    Date of Patent: May 22, 2012
    Assignee: Korea Advanced Institute of Science and Technology (KAIST)
    Inventors: Dong Yun Jung, Chul Soon Park
  • Patent number: 8022784
    Abstract: A wireless communication module includes a plurality of monolithic millimeter-wave integrated circuits (MMICs) for signal processing attached to the top surface of a multi-layer low temperature co-fired ceramic substrate; a planar transmission line formed on the top surface of the multi-layer substrate for communications between the MMICs; a metal base attached to the bottom surface of the multi-layer substrate and having an opening to which an antenna is attached; a plurality of vias for connecting the metal base and the planar transmission line within the multi-layer substrate to establish a uniform potential on a ground plane of the multi-layer substrate; an embedded waveguide formed in the opening surrounded with the vias within the multi-layer substrate; and a planar transmission line-to-waveguide transition apparatus for the transition of waves between the planar transmission line and the embedded waveguide.
    Type: Grant
    Filed: April 30, 2009
    Date of Patent: September 20, 2011
    Assignee: Korea Advanced Institute of Science and Technology (KAIST)
    Inventors: Jae Jin Lee, Chul Soon Park, Dong Yun Jung, Ki Chan Eun
  • Publication number: 20100090780
    Abstract: A phase shifter includes a substrate; a signal line formed on a specific region in an upper surface of the substrate; and an air gap which is formed within the substrate and changes effective permittivity of the substrate to delay phase of a signal supplied to the signal line. The phase shifter delays a phase of a signal by controlling effective permittivity using an air gap, thereby having outstandingly low insertion loss as compared to existing phase shifters. Further, the phase shifter can be manufactured in a same length as a reference line so that the phase shifter can be in a compact size.
    Type: Application
    Filed: October 15, 2009
    Publication date: April 15, 2010
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: In Sang Song, Chul Soon Park, Dong Yun Jung, Ki Chan Eun, Jae Jin Lee, Seong Jun Cho
  • Publication number: 20090181634
    Abstract: A resistive frequency mixing apparatus includes a first frequency mixer having a source follower FET, and a second frequency mixer having a common source FET. The resistive frequency mixing apparatus perform a frequency mixing of an RF depending on an LO signal to generate a down-converted IF signal when the RF signal is applied to the source follower FET and the LO signal is applied to the common source FET. Further, the resistive frequency mixing apparatus performs a frequency mixing of an IF signal depending on an LO signal through the use of the source follower FET to produce an up-converted RF signal when the IF signal is applied to the common source FET and the LO signal is applied to the common source FET.
    Type: Application
    Filed: October 27, 2008
    Publication date: July 16, 2009
    Applicant: RESEARCH AND INDUSTRIAL COOPERATION GROUP
    Inventors: Dong Yun Jung, Chul Soon Park
  • Patent number: 7264987
    Abstract: Provided is a method of fabricating an optoelectronic integrated circuit chip. In particular, a method of fabricating an optoelectronic integrated circuit chip is provided, in which an optical absorption layer of a wave-guide type optical detector is grown to be thicker than a collector layer of a hetero-junction bipolar transistor by using a selective area growth by metal organic chemical vapor deposition (MOCVD) method, and the wave-guide type optical detector and the hetero-junction bipolar transistor are integrated as a single chip on a semi-insulated InP substrate, thereby readily realizing the wave-guide type optical detector improved in quantum efficiency and having the ultra-high speed characteristics.
    Type: Grant
    Filed: December 16, 2004
    Date of Patent: September 4, 2007
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Eun Soo Nam, Ho Young Kim, Myoung Sook Oh, Dong Yun Jung, Seon Eui Hong, Kyoung Ik Cho
  • Patent number: 7030701
    Abstract: A transimpedance amplification apparatus includes a signal source for generating a current signal, a source follower stage, a common source stage and a shunt feedback resistor. The source follower stage having a source follower structure receives the current signal to reduce an impedance of the signal source. The common source stage, following the source follower stage, driven by the reduced signal source impedance, amplifies the current signal to extend a frequency bandwidth of the current signal and buffers the amplified signal with the extended frequency bandwidth thereof maintained, wherein the reduced signal source impedance serves to extend a frequency bandwidth of the common source stage. The shunt feedback resistor, which is installed between the source follower stage and the common source stage, adjusts an input DC bias of the source follower stage and increasing a transimpedance gain of the common source stage.
    Type: Grant
    Filed: December 16, 2003
    Date of Patent: April 18, 2006
    Assignee: Information and Communications University Educational Foundation
    Inventors: Dong Yun Jung, Sang-Hyun Park, Chul Soon Park
  • Publication number: 20050170549
    Abstract: Provided is a method of fabricating an optoelectronic integrated circuit chip. In particular, a method of fabricating an optoelectronic integrated circuit chip is provided, in which an optical absorption layer of a wave-guide type optical detector is grown to be thicker than a collector layer of a hetero-junction bipolar transistor by using a selective area growth by metal organic chemical vapor deposition (MOCVD) method, and the wave-guide type optical detector and the hetero-junction bipolar transistor are integrated as a single chip on a semi-insulated InP substrate, thereby readily realizing the wave-guide type optical detector improved in quantum efficiency and having the ultra-high speed characteristics.
    Type: Application
    Filed: December 16, 2004
    Publication date: August 4, 2005
    Inventors: Eun Soo Nam, Ho Young Kim, Myoung Sook Oh, Dong Yun Jung, Seon Hong, Kyoung Ik Cho
  • Patent number: 6914488
    Abstract: A broadband amplification apparatus for extending a bandwidth includes a first and a second amplifying unit for amplifying an input signal, a buffering unit and a first inductive buffer. The buffering unit disposed between the first and the second amplifying unit buffers an output signal of the first amplifying unit to thereby maintain a bandwidth of the output signal, increases a gain and returns back a portion of the buffered signal to the first amplifying unit. The first inductive buffer, which is connected to the buffer unit, enhances input impedance as a frequency increases within a predetermined range, thereby introducing little gain changes while serving to extend a bandwidth.
    Type: Grant
    Filed: July 3, 2003
    Date of Patent: July 5, 2005
    Assignee: Information and Communications University Educational Foundation
    Inventors: Sang-Hyun Park, Dong Yun Jung, Chul Soon Park
  • Publication number: 20040124927
    Abstract: A transimpedance amplification apparatus includes a signal source for generating a current signal, a source follower stage, a common source stage and a shunt feedback resistor. The source follower stage having a source follower structure receives the current signal to reduce an impedance of the signal source. The common source stage, following the source follower stage, driven by the reduced signal source impedance, amplifies the current signal to extend a frequency bandwidth of the current signal and buffers the amplified signal with the extended frequency bandwidth thereof maintained, wherein the reduced signal source impedance serves to extend a frequency bandwidth of the common source stage. The shunt feedback resistor, which is installed between the source follower stage and the common source stage, adjusts an input DC bias of the source follower stage and increasing a transimpedance gain of the common source stage.
    Type: Application
    Filed: December 16, 2003
    Publication date: July 1, 2004
    Applicant: Information and Communications University Educational Foundation
    Inventors: Dong Yun Jung, Sang-Hyun Park, Chul Soon Park
  • Publication number: 20040004519
    Abstract: A broadband amplification apparatus for extending a bandwidth includes a first and a second amplifying unit for amplifying an input signal, a buffering unit and a first inductive buffer. The buffering unit disposed between the first and the second amplifying unit buffers an output signal of the first amplifying unit to thereby maintain a bandwidth of the output signal, increases a gain and returns back a portion of the buffered signal to the first amplifying unit. The first inductive buffer, which is connected to the buffer unit, enhances input impedance as a frequency increases within a predetermined range, thereby introducing little gain changes while serving to extend a bandwidth.
    Type: Application
    Filed: July 3, 2003
    Publication date: January 8, 2004
    Inventors: Sang-Hyun Park, Dong Yun Jung, Chul Soon Park