Abstract: Provided is a monitoring apparatus used to monitor lubricating oil inside a compressor. The monitoring apparatus comprises a first capacitance detector (100), a calculation unit, and a determining unit. The first capacitance detector (100) is disposed in a compressor (10) and is completely immersed in lubricating oil (20) inside the compressor (10), and is used to detect a first capacitance value (Cn). The calculation unit calculates a relative dielectric constant of the lubricating oil inside the compressor according to the first capacitance value (Cn) detected by the first capacitance detector (100). The determining unit monitors, according to the calculated relative dielectric constant, whether quality of the lubricating oil (20) inside the compressor (10) encounters an exception. Further provided are a method for monitoring quality of lubricating oil inside a compressor and an apparatus and a method for monitoring a fluid level of lubricating oil inside a compressor.

Abstract: A re-chargeable battery comprising a non-dendrite forming sodium (Na)/potassium (K) liquid metal alloy anode, a sulfur and polyacrylonitrile (PAN) conductive polymer composite cathode, a polyethyleneoxide (PEO) solid electrolyte, a solid electrolyte interface (SEI) formed on the PEO solid electrolyte; and a cell housing, wherein the anode, cathode, and electrolyte are assembled into the cell housing with the PEO solid electrolyte disposed between the cathode and anode.

Abstract: A method for obtaining a water amount for a humidifier, includes: obtaining a target humidification parameter for a space to be humidified; determining a water amount required for the humidifier to reach the target humidification parameter; and outputting a notifying message, the notifying message carrying the determined water amount.

Abstract: A method of determining the coal-bearing system boundary includes the following steps: firstly, determining the high-level boundaries mainly including the tectonic boundary, ore-bearing stratum and geological body distribution boundary, mixed complex boundary, etc.; secondly, determining the major boundary mainly including a fault or fault zone, giant fold or fold assemblage zone, sedimentary boundary, stratigraphic and mineral occurrence boundary, natural geography and artificial boundary, etc.. The determination of each major boundary contains the definition of its interfaces or boundaries with specific meaning among 18 types of such interfaces or boundaries. The coal-bearing system boundary is determined based on the features of the boundaries with specific meaning as well as the boundary development, mineral assemblage and spatial distribution conditions of a specific region.

Abstract: A method of intergrowing and coexisting four-in-one multi-mineral coordinated prospecting includes the following steps: firstly, implement the coordinated prospecting to identify the occurrence states, occurrence regularities and developing conditions of multiple minerals so as to realize the coordinated prospecting and evaluation for these minerals and achieve high-precision high-benefit optimal prospecting effectiveness; secondly, implement different prospecting methods and technologies in a coordinated way and implement the exploratory drilling, geophysical prospecting, information technology and other technologies in a systematic and coordinated fashion so that the implementation of prospecting works achieves the optimal configuration, realize maximum benefit, obtain sustainable optimal prospecting effectiveness with minimum input and enhance the technological level and prospecting effectiveness of multi-mineral integrated coordinated prospecting as a whole.

Abstract: A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers.

Abstract: A digital control laser automatic tooth preparation method and device and a tooth positioner are provided. The device includes an intra-oral three-dimensional scanner, a dental laser, an oral working end of a digital control laser tooth preparation control system, an oral and maxillofacial cone beam CT scanner, a computer, a tooth positioner, a negative-pressure suction device and a real-time monitoring device. The computer is connected respectively with the intra-oral three-dimensional scanner, the dental laser, the oral working end of the digital control laser tooth preparation control system, the oral and maxillofacial cone beam CT scanner, the negative-pressure suction device, and the real-time monitoring device. The dental laser is connected with the oral working end of the digital control laser tooth preparation control system through a light guiding arm(1).

Abstract: A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers.

Abstract: A flex-rigid wiring board includes a flexible base material structure, a rigid base material structure extending from opposite ends of the flexible base material structure, an electronic component embedded in the rigid base material structure, a first buildup layer laminated on first surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure, and a second buildup layer laminated on second surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure. The first and second buildup layers are formed such that the flexible base material structure exposed by the exposing portions of the first and second buildup layers forms a bendable portion and that the rigid base material structure and the first and second buildup layers form non-bendable portions connected to the bendable portion.

Abstract: A multilayer device has a resin layer, a semiconductor device positioned in the resin layer and including an electronic component and a passivation layer having an opening exposing an electrode of the electronic component, an intermediate layer including metal layers and formed in the opening of the passivation layer such that the intermediate layer is connected to the electrode of the electronic component, and a buildup layer formed on the resin layer and including an insulating layer and a via conductor formed in the insulating layer such that the via conductor is connected to the intermediate layer. The resin layer includes one or more resin material selected from the group consisting of a thermosetting resin material and a thermoplastic resin material.

Abstract: A printed circuit board includes a substrate having an opening portion, a chip capacitor device accommodated in the opening portion of the substrate, and a buildup structure formed on the substrate such that the buildup structure covers the chip capacitor device in the opening portion of the substrate. The chip capacitor has a dielectric body having a surface facing the buildup structure, first electrodes formed on the surface of the dielectric body and second electrodes formed on the surface of the dielectric body, and the buildup structure has first via structures and second via structures such that the first via structures are connected to the first electrodes, respectively, and the second via structures are connected to the second electrodes, respectively.

Abstract: A printed circuit board includes an accommodating layer, chip capacitor devices accommodated in the accommodating layer, and a buildup structure formed on the accommodating layer such that the buildup structure covers the chip capacitor devices in the accommodating layer. The buildup structure has mounting conductor structures positioned to mount an IC chip device on a surface of the buildup structure such that the IC chip device is mounted directly over the chip capacitor devices, each of the chip capacitor devices has a dielectric body having a surface facing the buildup structure, a first electrode formed on the dielectric body and extending on the surface of the dielectric body, and a second electrode formed on the dielectric body and extending on the surface of the dielectric body, and the dielectric body is interposed between the first electrode and the second electrode.

Abstract: A multilayer device has a resin layer, a semiconductor device positioned in the resin layer and including an electronic component and a passivation layer having an opening exposing an electrode of the electronic component, an intermediate layer including metal layers and formed in the opening of the passivation layer such that the intermediate layer is connected to the electrode of the electronic component, and a buildup layer formed on the resin layer and including an insulating layer and a via conductor formed in the insulating layer such that the via conductor is connected to the intermediate layer. The resin layer includes one or more resin material selected from the group consisting of a thermosetting resin material and a thermoplastic resin material.

Abstract: A method of manufacturing a core substrate having an electronic component, including providing a core substrate having a first surface and a second surface on an opposite side of the first surface, forming a through hole extending from the first surface to the second surface in the core substrate, attaching an adhesive tape to the second surface of the core substrate such that the through hole formed in the core substrate is closed on the second surface, attaching an electronic component to the adhesive tape inside the through hole, filling the through hole with a filler, and removing the adhesive tape from the second surface of the core substrate.

Abstract: A re-chargeable battery comprising a non-dendrite forming sodium (Na)/potassium (K) liquid metal alloy anode, a sulfur and polyacrylonitrile (PAN) conductive polymer composite cathode, a polyethyleneoxide (PEO) solid electrolyte, a solid electrolyte interface (SEI) formed on the PEO solid electrolyte; and a cell housing, wherein the anode, cathode, and electrolyte are assembled into the cell housing with the PEO solid electrolyte disposed between the cathode and anode.

Abstract: A method for manufacturing a printed circuit board includes forming an opening portion in a substrate, positioning chip capacitors in the opening portion of the substrate such that the chip capacitors are accommodated in the opening portion of the substrate, forming a buildup structure including an interlayer resin insulating layer and a conductive layer over a surface of the substrate and the chip capacitors accommodated in the opening portion of the substrate, and forming on a surface of the buildup structure bump structures positioned to mount an IC chip such that the chip capacitors in the opening portion of the substrate are positioned directly below the IC chip.

Abstract: A printed circuit board including a core substrate including a first resin substrate, a second resin substrate having an opening and a third resin substrate in a multilayer manner while interposing bonding plates, insulating layers and conductive circuit layers alternately laminated on the core substrate, solder bumps formed on an outer surface of the printed circuit board, a first capacitor formed in the opening of the second resin substrate, a conductive pad formed on the first resin substrate and connected to an electrode of the first capacitor, a via hole formed in the first resin substrate and directly connected to the conductive pad and a conductive circuit on the core substrate, and a second capacitor mounted on a surface of the printed circuit board.

Abstract: A printed circuit board includes an accommodating layer, chip capacitor devices accommodated in the accommodating layer, and a buildup structure formed on the accommodating layer such that the buildup structure covers the chip capacitor devices in the accommodating layer. The buildup structure has mounting conductor structures positioned to mount an IC chip device on a surface of the buildup structure such that the IC chip device is mounted directly over the chip capacitor devices, each of the chip capacitor devices has a dielectric body having a surface facing the buildup structure, a first electrode formed on the dielectric body and extending on the surface of the dielectric body, and a second electrode formed on the dielectric body and extending on the surface of the dielectric body, and the dielectric body is interposed between the first electrode and the second electrode.

Abstract: A multi-layer printed circuit board including a first insulating layer, a first conductor layer having circuits on one surface of the first insulating layer, a second conductor layer having circuits on the opposite surface of the first insulating layer, a second insulating layer on the second conductor and first insulating layers, and a third conductor layer having circuits on the second insulating layer on the opposite side of the second conductor layer. The first and second insulating layers have first and second via holes formed in openings of the first and second insulating layers and made of conductive materials filling the openings such that circuits in the first and third conductor layers are connected to one or more circuits in the second conductor layer, and the first and second via holes have bottom ends facing the second conductor layer and top ends larger than the bottom ends.

Abstract: A multi-layer printed circuit board includes a core structure including resin layers and conductor circuits sandwiched by the resin layers, the core structure having first and second surfaces, a first conductor layer including conductor circuits on the first surface of the core structure, and a second conductor layer including conductor circuits on the second surface of the core structure. The core structure includes first and via holes, and the first and second via holes include a metal filling up to the respective top of openings in the resin layers, respectively, sandwich one or more conductor circuits in the core structure and are positioned vertically to form a through hole electrically connecting respective ones of the conductor circuits of the first and second conductor layers, and the first and second via holes are deviated from each other in a vertical direction.