Patents by Inventor Dong-Hyun Park

Dong-Hyun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11975076
    Abstract: The present invention relates to antibody-drug conjugates (ADCs) wherein a plurality of active agents are conjugated to an antibody through at least one branched linker. The branched linker may comprise a branching unit, and two active agents are coupled to the branching unit through a secondary linker and the branching unit is coupled to the antibody by a primary linker. The active agents may be the same or different. In certain such embodiments, two or more such branched linkers are conjugated to the antibody, e.g., 2-4 branched linkers, which may each be coupled to a different C-terminal cysteine of a heavy or light chain of the antibody. The branched linker may comprise one active agent coupled to the branching unit by a first branch and a second branch that comprises a polyethylene glycol moiety coupled to the branching unit. In certain such embodiments, two or more such branched linkers are conjugated to the antibody, e.g.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: May 7, 2024
    Assignee: LegoChem Biosciences, Inc.
    Inventors: Yong Zu Kim, Yeong Soo Oh, Jeiwook Chae, Ho Young Song, Chul-Woong Chung, Yun Hee Park, Hyo Jung Choi, Kyung Eun Park, Hyoungrae Kim, Jinyeong Kim, Ji Young Min, Sung Min Kim, Byung Soo Lee, Dong Hyun Woo, Ji Eun Jung, Su In Lee
  • Patent number: 11976797
    Abstract: A lighting device according to an embodiment includes a sensor, a substrate disposed on the sensor and including an electrode pattern, a light source disposed on the substrate and electrically connected to the electrode pattern, a resin layer disposed on the substrate, and a reflective layer disposed between the substrate and the resin layer, and the substrate may include a first region overlapping the sensor in a first direction perpendicular to an upper surface of the substrate, a second region surrounding the first region, the light source may be disposed on the second region, the plurality of reflective pattern groups may be disposed on the first region, and the sensor may not overlap the light source and the electrode pattern in the first direction.
    Type: Grant
    Filed: August 24, 2021
    Date of Patent: May 7, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Kwang Hyun Ko, Moo Ryong Park, Dong Hyun Lee
  • Patent number: 11978548
    Abstract: The present disclosure relates to a medical image analysis method using a processor and a memory which are hardware. The method includes generating predicted second metadata for a medical image by using a prediction model, and determining a processing method of the medical image based on one of first metadata stored corresponding to the medical image and the second metadata.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: May 7, 2024
    Assignee: LUNIT INC.
    Inventors: Jong Chan Park, Dong Geun Yoo, Ki Hyun You, Hyeon Seob Nam, Hyun Jae Lee, Sang Hyup Lee
  • Publication number: 20240142389
    Abstract: A substrate inspection apparatus inspecting substrates using a vision system, which includes a camera module and an illumination module, and a substrate treatment system including the substrate inspection apparatus are provided. The substrate treatment system includes: a first substrate treatment apparatus; a second substrate treatment apparatus; a transfer unit transporting a container with a plurality of substrates accommodated therein from the first substrate treatment apparatus to the second substrate treatment apparatus; and a substrate inspection apparatus inspecting the substrates, wherein the substrate inspection apparatus includes an illumination module, which illuminates in a direction where the substrates are located, a camera module, which acquires images related to the substrates when the substrates are illuminated, and a control module, which inspects the substrates based on the images.
    Type: Application
    Filed: October 19, 2023
    Publication date: May 2, 2024
    Inventors: Jeong Hoon HAN, Oh Yeol KWON, Jun Hyun LIM, Dong Min PARK
  • Patent number: 11972941
    Abstract: Proposed is a precursor composition for forming a metal film including a zirconium compound represented by any one of Chemical Formulas 1 to 3 and a hafnium compound represented by any one of Chemical Formulas 4 to 6.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: April 30, 2024
    Assignee: SK TRICHEM
    Inventors: Chang Sung Hong, Yong Joo Park, Tae Hoon Oh, In Chun Hwang, Sang Kyung Lee, Dong Hyun Kim
  • Patent number: 11973277
    Abstract: Disclosed is a 5G NR antenna device. An antenna module includes an antenna material formed of a metal material and having a semi-planar inverted-F antenna (PIFA) structure, and a support formed in the shape of a hexahedron with side and bottom faces that are bent from the antenna material by stamping, wherein the support and the antenna material are formed as an integral body.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: April 30, 2024
    Assignee: Tyco Electronics AMP Korea Co., Ltd.
    Inventors: Jung-Hoon Kim, Chang Hyun Lee, Dong Wook Park
  • Patent number: 11973106
    Abstract: A semiconductor device includes a lower electrode; a supporter supporting an outer wall of the lower electrode; a dielectric layer formed on the lower electrode and the supporter; an upper electrode on the dielectric layer; a first interfacial layer disposed between the lower electrode and the dielectric layer and selectively formed on a surface of the lower electrode among the lower electrode and the supporter; and a second interfacial layer disposed between the dielectric layer and the upper electrode, wherein the first interfacial layer is a stack of a metal oxide contacting the lower electrode and a metal nitride contacting the dielectric layer.
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: April 30, 2024
    Assignee: SK hynix Inc.
    Inventors: Jae Hee Song, Dong Hyun Lee, Kyung Woong Park, Cheol Hwan Park, Ki Vin Im
  • Patent number: 11974346
    Abstract: A method includes configuring serving cells for UE, the serving cells including at least six serving cells configurable for the UE; receiving PUCCH format configuration information for transmitting uplink control information associated with the configured serving cells, the PUCCH format configuration information including configuration information of PUCCH format 4; determining a total number of HARQ-ACK bits, SR bits, and periodic CSI bits to be transmitted in a subframe; selecting, at least based on the determined total number, a PUCCH format to transmit at least one of HARQ-ACK, SR, and periodic CSI, the selected PUCCH format being one of PUCCH formats including the PUCCH format 4 and PUCCH format 3; and transmitting the uplink control information associated with the configured serving cells in the subframe using the selected PUCCH format, the uplink control information associated with the configured serving cells including the at least one of HARQ-ACK, SR, and periodic CSI.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: April 30, 2024
    Assignee: CISCO TECHNOLOGY, INC.
    Inventor: Dong Hyun Park
  • Patent number: 11972839
    Abstract: A memory system includes a memory device including an interface circuit and a semiconductor memory, and a controller to generate a command for controlling the memory device. The interface circuit receives the command from the controller; determines whether the command is for the semiconductor memory or the interface circuit; and when it is determined that the command is for the interface circuit, performs a blocking operation to block transfer of the command between the interface circuit and the semiconductor memory and performs an internal operation of the interface circuit. The internal operation includes a signal controlling operation, a training operation, a read operation, an on-die termination operation, a ZQ calibration operation, or a driving force control operation.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: April 30, 2024
    Assignee: SK hynix Inc.
    Inventors: Chang Kyun Park, Young Sik Koh, Seung Jin Park, Dong Hyun Lee
  • Publication number: 20240138019
    Abstract: A method includes configuring serving cells for UE, the serving cells including at least six serving cells configurable for the UE; receiving PUCCH format configuration information for transmitting uplink control information associated with the configured serving cells, the PUCCH format configuration information including configuration information of PUCCH format 4; determining a total number of HARQ-ACK bits, SR bits, and periodic CSI bits to be transmitted in a subframe, selecting, at least based on the determined total number, a PUCCH format to transmit at least one of HARQ-ACK, SR, and periodic CSI, the selected PUCCH format being one of PUCCH formats including the PUCCH format 4 and PUCCH format 3; and transmitting the uplink control information associated with the configured serving cells in the subframe using the selected PUCCH format, the uplink control information associated with the configured serving cells including the at least one of HARQ-ACK, SR, and periodic CSI.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 25, 2024
    Inventor: Dong Hyun Park
  • Patent number: 11967066
    Abstract: An image processing method of the present disclosure may include receiving a scanned image, and processing the received image through an octave convolution-based neural network to output a high-quality image and an edge image for the received image. The octave convolution-based neural network may include a plurality of octave encoder blocks and a plurality of octave decoder blocks. Each octave encoder block may include an octave convolutional layer, and may be configured to output a high-frequency feature map and a low-frequency feature map for the image.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: April 23, 2024
    Assignees: DAEGU GYEONGBUK INSTITUTE OF SCIENCE AND TECHNOLOGY, MARQUETTE UNIVERSITY
    Inventors: Sang Hyun Park, Dong Kyu Won, Dong Hye Ye
  • Patent number: 11968643
    Abstract: An apparatus and method of processing a positioning reference signal are disclosed. In some embodiments, the method includes determining a narrow-band (NB) positioning reference signal (PRS) bitmap indicating a pattern selecting NB PRS subframes, wherein each NB PRS subframe comprises an NB PRS for positioning an NB user equipment (UE), transmitting, to the NB UE, NB PRS configuration information for the NB UE, the NB PRS configuration information comprising the NB PRS bitmap, determining, by a reference cell and based on the NB PRS bitmap, NB PRS subframes of the reference cell, mapping, by the reference cell, a first NB PRS in the NB PRS subframes of the reference cell, and receiving, from the NB UE and in response to the first NB PRS, a reference signal time difference (RSTD) measurement.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: April 23, 2024
    Assignee: Innovative Technology Lab Co., Ltd.
    Inventors: Sung Jun Yoon, Dong Hyun Park
  • Publication number: 20240129725
    Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 18, 2024
    Applicant: ESTORM CO., LTD.
    Inventors: Jong Hyun WOO, Tae Il LEE, Il Jin JUNG, Hee Jun SHIN, Hyung Seok JANG, Min Jae SON, Sang Heon BAEK, Seo Bin PARK, Hyo Sang KWON, Mi Ju KIM, Jung Hoon SONG, Rakhmanov DILSHOD, Dong Hee KIM, Jeon Gjin KIM
  • Publication number: 20240128136
    Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.
    Type: Application
    Filed: February 16, 2023
    Publication date: April 18, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Wook PARK, Seong Hun NA, Jae Hyun JUNG, Kwang Su KIM, Sung Jun LEE, Yong Suk KIM, Dong Hyun PARK
  • Patent number: 11960408
    Abstract: A unit page buffer block includes first to fourth page buffer pairs. Each of the page buffer pairs includes a common column decoder block; and an upper page buffer stage and a lower page buffer stage electrically and commonly connected to the common column decoder block. Each of the upper page buffer stages includes an upper selection block; an upper latch block; and an upper cache block. Each of the lower page buffer stage includes a lower selection block; a lower latch block; and a lower cache block. Each of the upper selection blocks includes first to fourth sub-selection blocks. Each of the upper and lower latch blocks includes first to twelfth upper sub-latch blocks. Each of the upper and lower cache blocks includes first to twelfth upper sub-cache blocks. Each of the common column decoder block includes first to third sub-common column decoder blocks arranged in a row direction.
    Type: Grant
    Filed: November 7, 2022
    Date of Patent: April 16, 2024
    Assignee: SK HYNIX INC.
    Inventors: Dong Hyuk Kim, Tae Sung Park, Sang Hyun Sung, Sung Lae Oh, Soo Nam Jung
  • Patent number: 11946607
    Abstract: A lighting device disclosed in an embodiment of the invention includes a substrate; light sources disposed on the substrate; and a resin layer disposed on the substrate and the light sources. a first reflective layer disposed on the resin layer, wherein the resin layer includes an exit surface facing the light sources, and the exit surface of the resin layer includes convex portions facing each of the light sources and recess portions respectively disposed between the plurality of convex portions, concave surfaces disposed in each of the plurality of recess portions may have a curvature, and a radius of curvature of the concave surfaces may increase in one direction.
    Type: Grant
    Filed: February 27, 2023
    Date of Patent: April 2, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Young Jae Choi, Dong Hyun Lee, Ki Chang Lee, Gyeong Il Jin, Moo Ryong Park
  • Patent number: 11944998
    Abstract: A method of fabricating a capacitive micromachined ultrasonic transducer (CMUT) according to one aspect of the present invention may include forming, on a semiconductor substrate, a first region implanted with impurity ions at a first average concentration and a second region implanted with no impurity ions or implanted with the impurity ions at a second average concentration lower than the first average concentration, forming an insulating layer by oxidizing the semiconductor substrate wherein the insulating layer includes a first oxide layer having a first thickness on at least a part of the first region and a second oxide layer having a second thickness smaller than the first thickness on at least a part of the second region, and forming a membrane layer on the insulating layer such that a gap is defined between the second oxide layer and the membrane layer.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: April 2, 2024
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Byung Chul Lee, Dong-Hyun Kang, Jin soo Park, Tae Song Kim
  • Patent number: 11939505
    Abstract: Provided are a silicon nitride film etching composition, a method of etching a silicon nitride film using the same, and a manufacturing method of a semiconductor device. Specifically, a silicon nitride film may be stably etched with a high selection ratio relative to a silicon oxide film, and when the composition is applied to an etching process at a high temperature and a semiconductor manufacturing process, not only no precipitate occurs but also anomalous growth in which the thickness of the silicon oxide film is rather increased does not occur, thereby minimizing defects and reliability reduction.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: ENF Technology Co., Ltd.
    Inventors: Dong Hyun Kim, Hyeon Woo Park, Sung Jun Hong, Myung Ho Lee, Myung Geun Song, Hoon Sik Kim, Jae Jung Ko, Myong Euy Lee, Jun Hyeok Hwang
  • Publication number: 20240097832
    Abstract: Hybrid Automatic Retransmit ReQuest-Acknowledgment (HARQ-ACK) index mapping and uplink resource allocation is performed and controlled for channel selection transmission. A method for transmitting HARQ-ACK information to an eNode-B (eNB) by a User Equipment (UE) includes identifying KPCell as a number of downlink subframe(s) of a PCell associated with an uplink subframe and identifying KSCell as a number of downlink subframe(s) of an SCell associated with the uplink subframe; generating Discontinuous Transmission (DTX) response information for a cell having a smaller number of downlink subframes between the PCell and the SCell; generating HARQ-ACK information including the generated DTX response information and response information on data received by the UE from the eNB; and transmitting the generated HARQ-ACK information to the eNB through the uplink subframe.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 21, 2024
    Inventor: Dong Hyun PARK
  • Patent number: 11937194
    Abstract: One or more synchronization procedures in wireless communications are provided. A wireless user device may determine a global navigation satellite system (GNSS) as a synchronization reference source associated with a sidelink synchronization. The wireless user device may determine, based on the GNSS being the synchronization reference source associated with a sidelink synchronization and a subcarrier spacing index for sidelink, a slot number for sidelink communication. The wireless user device may transmit, based on the slot number, a sidelink synchronization signal from the wireless user device to a second wireless user device.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: March 19, 2024
    Assignee: Innovative Technology Lab Co., Ltd.
    Inventors: Dong Hyun Park, Sung Jun Yoon